Index
(cont.)
6.
7.
reports
8.
9.
■
System status ........................................................................................ 51
Main PCB ............................................................................................... 53
Expansion PCB ...................................................................................... 55
Heating water buffer cylinder (HWB) and high temperature mainte-
■
nance .................................................................................................. 57
■
■
Compressor ........................................................................................ 58
■
Applicatn limits .................................................................................... 58
■
General ............................................................................................... 59
■
■
■
■
................................................................................................................ 61
Index
5