3. For applications that require vertically-mounted cooling solution, use only coolers that secure the thermal stacks with fixing post. Without
the fixing post feature, the thermal stacks may move.
4. Do not exceed the recommended maximum torque. Doing so may damage the module or the carrier board, or both.
4.1
CSP Dimensions
For Bare-die Variants
Copyright © 2021 congatec GmbH
87±0.15
1.75±0.10
Without thermal pad
6±0.10 - 6X
M2.5 x 6 mm
threaded standoff
for threaded version
or
NOTES:
ø2.7 x 10 mm
non-threaded standoff
for borehole version
TA70m01
95
8.5
0.8
21/67
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