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3. Handling
•
Place the templet on the substrate under test and hold the templet in
such way that the cuts always are executed away from the body and
from the hand holding the templet! Never hold the templet at the sides
of the slits!
Do not to put the fingers directly at the cuts and pay attention not to
cut yourself. The cuttings of the NT-Cutter are sharpened and could
cause injuries by incorrect handling! Operators need to achieve an
appropriate security instruction.
•
Carry out six (ASTM 1 mm: 11 cuts) parallel cuts with the desired
spacing by cutting through the film to the substrate in one steady
motion.
•
Turn the templet for 90° and make the same number of cuts with the
same spacing again that a lattice pattern is formed.
•
Brushing lightly back and forth with the brush (ASTM: or cloth) along
the diagonal of the cross-cut a couple of times.
Additional adhesive tape test (not for smooth substrates for DIN EN ISO):
•
Remove two complete laps of tape and discard.
•
Remove an additional length at a steady rate and cut a piece about
75 mm long. Stick the piece adhesive tape on the cut area. Rub the
tape firmly by finger.
•
Within 5 minutes (ASTM: 90 s ± 30 s) remove the adhesive tape
carefully and steady by seizing the free end and pulling it rapidly back
upon itself within approx. 0,5 to 1 s in an angle of 60° (ASTM: as near
as 180° as possible) in the pulling direction.
•
(DIN EN ISO: keep the adhesive tape for comparative purposes, e.g.
by sticking it on a transparent film.
•
Check the results with the chapter "4 Overwiew - Cross-cut
classification" on page 8.
page 7
last update: 24.06.2009
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