Temperature Profile; Baking - Elatec TWN4 MultiTech Nano Manual

3 Connector and Pin-Out
3.1.3.3 Temperature Profile
For reflow soldering, following temperature profile is recommended:
T
240°C
217°C
200°C
150°C
25°C
Ramp-up rate
Preheat time (t
Time within liquidus temperature (t
Peak temperature (T
Time within peak (t

3.1.3.4 Baking

The TWN4 MultiTech Nano has a moisture sensitivity level (MSL) of 3. This means, that the modules must
be baked prior to reflow soldering, if the modules are removed from their sealed dry-bags and not soldered
within their out-of-bag time, which is 168 hours.
In this case it is recommended to bake the TWN4 MultiTech Nano for 10 days at 85°C
t
S
)
s
)
L
)
P
)
P
t
P
t
L
1-3 K/s
60-180 seconds
60-150 seconds
245 +0/-5 °C
10-30 seconds
T
245°C
P
t
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