Storage, Manufacturing And Packaging; Storage - Quectel BG96 Series Hardware Design

8
Storage, Manufacturing and
Packaging

8.1. Storage

BG96 is stored in a vacuum-sealed bag. The storage restrictions are shown as below.
1. Shelf life in the vacuum-sealed bag: 12 months at <40º C/90%RH.
2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other
high temperature processes must be:
 Mounted within 168 hours at the factory environment of ≤30º C/60%RH.

Stored at <10%RH.
3. Devices require baking before mounting, if any circumstance below occurs.

When the ambient temperature is 23º C± 5º C and the humidity indication card shows the humidity
is >10% before opening the vacuum-sealed bag.
 Device mounting cannot be finished within 168 hours at factory conditions of ≤30º C/60%
4. If baking is required, devices may be baked for 48 hours at 125º C± 5º C.
NOTE
As the plastic package cannot be subjected to high temperature, it should be removed from devices
before high temperature (125º C) baking. If shorter baking time is desired, please refer to
IPC/JEDECJ-STD-033 for baking procedure.
BG96_Hardware_Design
LTE Module Series
BG96 Hardware Design
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