Quectel BG96 Series Hardware Design page 67

NOTES
1. For easy maintenance of the module, please keep about 3mm between the module and other
components on the
2. All reserved pins must be kept open.
3. The thickness of stencil should be stepped-up to 0.18mm. The stencil openings should be shrunken
inward by 0.30mm and moved outward by 0.40mm. Cut four 1.00×1.00mm openings with 0.05mm
square chamfer on the pads in the center.
BG96_Hardware_Design
Figure 33: Recommended Stencil Design (Top View)
host PCB.
LTE Module Series
BG96 Hardware Design
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