Using The Equipotential Bonding Strip And Shield Bus - Siemens SINAMICS SL150 Operating Instructions Manual

Electrical connection

6.4 Using the equipotential bonding strip and shield bus

I/O connection
● Create a low-impedance ground connection for additional cabinets, system components,
● Ground unused lines at one end in the cabinet.
● Choose the greatest possible clearance between the power and signal cables (at least 20
● Avoid unnecessarily long cable loops.
● Surge suppressors – e.g. RC elements or varistors – must be connected to the solenoids of
● In order to reduce noise/interference entering or exiting via the cable, filter auxiliary voltages
6.4 Using the equipotential bonding strip and shield bus
Each cabinet is equipped with an equipotential bonding or grounding bar to make it simpler to
connect equipotential bonding conductors.
Connect all internal and external components to this equipotential bonding busbar. is Attach the
shields of incoming and outgoing cables directly to the shield bus. It is important here to
establish the greatest possible area of contact and a good conductive connection.
Figure 6-3
64
and distributed devices with the largest possible cross-section (at least 16 mm²).
cm). The greater the distance over which the cables are routed in parallel, the greater the
clearance must be. You must install additional shields if sufficient clearance cannot be
maintained.
contactors and relays in the device.
in the control cabinet.
Equipotential bonding strip
SINAMICS SL150 6SL38600UL432AA0Z
Operating Instructions Rev.201910281433 EXAMPLE