Contents
Figures
1
Thermal Design Process .............................................................................................................. 5
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2
3
4
5
6
7
8
9
15 MCH Heat Sink ........................................................................................................................... 32
16 Heat Sink Clip ............................................................................................................................. 33
17 Push-pin ..................................................................................................................................... 34
Tables
1
Definition of Terms ....................................................................................................................... 6
2
Reference Documents .................................................................................................................. 6
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3
4
5
Reliability Requirements ............................................................................................................. 25
6
Mechanical Drawing List............................................................................................................. 31
Revision History
Date
March 2003
November 2002
4
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®
Revision
002
001
Description
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Revised Table 3, "Intel
E7500 and Intel
MCH Thermal Specifications."
Revised Table 4, "Theta ja Required versus Device and
Configuration."
Initial release of this document.
®
E7501 Chipsets
Thermal Design Guide