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Summary of Contents for Intel 848P
- Page 1 ® Intel 848P Chipset Thermal Design Guide For the Intel 82848P Memory Controller Hub (MCH) August 2003 Document Number: 253662-001...
- Page 2 Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, Pentium and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
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Page 3: Table Of Contents
4.3.3 WSHS Removal and Installation Procedure .........24 4.3.3.1 Removal via Lead Clipping Methodology......24 4.3.3.2 Removal via De-Soldering Methodology......26 4.3.3.3 Re-Installation Methodology..........27 Environmental Reliability Requirements ...............28 Appendix A: Enabled Suppliers.........................29 Appendix B: Mechanical Drawings......................31 ® Intel 848P Chipset Thermal Design Guide... - Page 4 Table 4. TMTV Heater Connections ..................17 Table 5. TMTV Correction Factor..................18 Table 6. Wave Solder Recommended Settings for WSHS ..........23 Table 7. Reference Thermal Solution Environmental Reliability Requirements ....28 Table 8. MCH Wave Solder Heatsink Enabled Suppliers ..........29 ® Intel 848P Chipset Thermal Design Guide...
- Page 5 Revision History Revision Description Date • Initial Release. -001 August 2003 ® Intel 848P Chipset Thermal Design Guide...
- Page 6 This page is intentionally left blank. ® Intel 848P Chipset Thermal Design Guide...
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Page 7: Introduction
This document presents the conditions and requirements to properly design a cooling solution for systems that implement the 848P chipset. Properly designed solutions provide adequate cooling to maintain the chipset MCH case temperature at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. -
Page 8: Reference Documents
® Intel 848P Chipset: Intel 82848P Memory Controller Hub (MCH) 253575 Datasheet ® ® Intel 82801EB I/O Controller Hub 5 (ICH5) and Intel 82801ER I/O http://developer.intel.com/design/ch Controller Hub 5 R (ICH5R) Thermal Design Guide ipsets/designex/252673.htm ® ® Intel Pentium 4 Processor with 512-KB L2 Cache on 0.13 Micron http://developer.intel.com/design/pe... -
Page 9: Product Specifications
848P Chipset Datasheet. Figure 1. MCH Non-Grid Array 37.5mm x 37.5mm Substrate [1.48 in x 1.48 in] Shifted Grid Std Grid w/ Depop Non standard grid ball pattern. Minimum pitch = 1.0 mm [0.039 in] ® Intel 848P Chipset Thermal Design Guide... -
Page 10: Thermal Specifications
TDP. The TDP value can be used for thermal design if the chipset thermal protection mechanisms are enabled. Intel chipsets provide a hardware-based fail-safe mechanism incorporated to keep the product temperature in specification in the event of unusually strenuous usage above the TDP power. -
Page 11: Methodology
Testing with currently available commercial applications has shown they may dissipate power levels below the published TDP specification in Section 2.3.3. Intel strongly recommends that thermal engineers design to the published TDP specifications to develop a robust thermal solution that will meet the needs of current and future applications. - Page 12 Product Specifications This page is intentionally left blank. ® Intel 848P Chipset Thermal Design Guide...
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Page 13: Thermal Metrology
Thermal Metrology Thermal Metrology The system designer must measure temperatures to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques of measuring chipset component case temperatures. Case Temperature Measurements To ensure functionality and reliability, the MCH is specified for proper operation when T maintained at or below the maximum temperature listed in Table 2. -
Page 14: Figure 2. Zero-Degree Angle Attach Methodology
Figure 3. Zero-Degree Angle Attach Heatsink Modifications Generic Heatsink Shown, Not to Scale 1.3 mm (0.05 in.) (0.5 mm (0.02 in.) Depth) 3.3 mm (0.13 in.) Diameter (1.5 mm (0.06 in.) Depth) Angle_Attach_Heatsink_Mod ® Intel 848P Chipset Thermal Design Guide... -
Page 15: Thermal Mechanical Test Vehicle
Test points on the board can then facilitate the identification of any opens on the mounted package after any mechanical testing (shock, vibration, temperature cycling, etc.). Figure 4 shows a schematic of the internal package structures and Figure 5 shows an example of a complementary test board configuration. ® Intel 848P Chipset Thermal Design Guide... -
Page 16: Figure 4. Tmtv Daisy Chain Structure
Thermal Metrology Figure 4. TMTV Daisy Chain Structure ® Intel 848P Chipset Thermal Design Guide... -
Page 17: Tmtv Thermal Operation
AK10, AM9, AL9, AM10, AL10, AG11, AK9, AN10 Heater End 1 AG28, AF28, AF29, AG27, AH27, AG29, AH26, AH29 Heater End 2 Figure 6. TMTV Die Heater Representation HEATER HEATER END 1 END 2 ® Intel 848P Chipset Thermal Design Guide... -
Page 18: Recommended Test Parameters
) / Total Package Power = (90 – 50) / 11.7 = 3.4 °C/W CA, MEASURED Applying the correction factor, we get: Ψ = Correction Factor x Ψ = 0.968 x 3.4 = 3.3 °C/W CA, CORRECTED CA, MEASURED ® Intel 848P Chipset Thermal Design Guide... -
Page 19: Airflow Characterization
Airflow Characterization Figure 7 describes the recommended location for air temperature measurements measured relative to the component. For a more accurate measurement of the average approach air temperature, Intel recommends averaging temperatures recorded from two thermocouples spaced about 25 mm [1.0 in] apart. - Page 20 Thermal Metrology This page is intentionally left blank. ® Intel 848P Chipset Thermal Design Guide...
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Page 21: Reference Thermal Solution
(G)MCH Heatsink (Fan Not Shown) proc_airflow Other methods exist for providing airflow to the MCH heatsink, including the use of system fans and/or ducting, or the use of an attached fan (active heatsink). ® Intel 848P Chipset Thermal Design Guide... -
Page 22: Mechanical Design Envelope
Figure 9 (the MCH cannot be seen in this view, as it is hidden by the WSHS base). Drawings of the WSHS extrusion and with the entire WSHS assembly are shown in Appendix B. Figure 9. Wave Solder Heatsink Installed on Board ® Intel 848P Chipset Thermal Design Guide... -
Page 23: Alternate Wshs For Non-Rotated Mch
Once a successful wave solder process is in place, the manufacturer may choose to use visual gross tilt inspection in an HVM setting. ® Intel 848P Chipset Thermal Design Guide... -
Page 24: Wshs Removal And Installation Procedure
Apply flux and remove any residual solder from each hole. Inspect the board and ensure all holes are clean and completely free of solder. Make sure none of the adjacent components were damaged during the removal process. ® Intel 848P Chipset Thermal Design Guide... -
Page 25: Figure 11. Wshs Lead Clipping Order
Reference Thermal Solution Figure 11. WSHS Lead Clipping Order Heatsink Shown Is Not MCH WSHS WSHS_lead_clip_order ® Intel 848P Chipset Thermal Design Guide... -
Page 26: Removal Via De-Soldering Methodology
Apply flux and remove any residual solder from each hole. Inspect the board and ensure all holes are clean and completely free of solder. Make sure none of the adjacent components were damaged during the removal process. ® Intel 848P Chipset Thermal Design Guide... -
Page 27: Re-Installation Methodology
Cool the board to room temperature. Stand the board vertically using jig. Solder the WSHS leads using a soldering iron with a STTC 137 tip. Figure 13. WSHS Target Heatsink Shown Is Not MCH WSHS ® Intel 848P Chipset Thermal Design Guide... -
Page 28: Environmental Reliability Requirements
1. The above tests should be performed on a sample size of at least 12 assemblies from 3 different lots of material. 2. Additional Pass/Fail Criteria may be added at the discretion of the user. ® Intel 848P Chipset Thermal Design Guide... -
Page 29: Appendix A: Enabled Suppliers
604-6122122 USA: Kevin Tao, 714-626-1278 Note: These vendors and devices are listed by Intel as a convenience to Intel’s general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice. - Page 30 Appendix A: Enabled Suppliers This page is intentionally left blank ® Intel 848P Chipset Thermal Design Guide...
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Page 31: Appendix B: Mechanical Drawings
Appendix B: Mechanical Drawings The following table lists the mechanical drawings available in this document: Drawing Name Page Number MCH Package Drawing MCH Component Keep-Out Restrictions WSHS Heatsink Extrusion Drawing WSHS Heatsink Assembly Drawing ® Intel 848P Chipset Thermal Design Guide... -
Page 32: Figure 14. Mch Package Drawing
Appendix B: Mechanical Drawings Figure 14. MCH Package Drawing ® Intel 848P Chipset Thermal Design Guide... -
Page 33: Figure 15. Mch Component Keep-Out Restrictions
Appendix B: Mechanical Drawings Figure 15. MCH Component Keep-Out Restrictions ® Intel 848P Chipset Thermal Design Guide... -
Page 34: Figure 16. Wshs Heatsink Extrusion Drawing
Appendix B: Mechanical Drawings Figure 16. WSHS Heatsink Extrusion Drawing ® Intel 848P Chipset Thermal Design Guide... -
Page 35: Figure 17. Wshs Heatsink Assembly Drawing
Appendix B: Mechanical Drawings Figure 17. WSHS Heatsink Assembly Drawing ® Intel 848P Chipset Thermal Design Guide...
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