Reference Thermal Solution; Operating Environment And Thermal Performance; Theta Ja Required Versus Device And Configuration - Intel E7500 MCH Thermal Design Manual

6.0

Reference Thermal Solution

Intel has developed a reference thermal solution designed to meet the cooling needs of the Intel
E7500 and Intel
the overall requirements for the reference thermal solution, including critical-to-function
dimensions, operating environment, and validation criteria. Other chipset components may or may
not need attached thermal solutions, depending on your specific system local-ambient operating
conditions. Refer to the Intel
Controller Hub 4 (ICH4) Thermal Design Guidelines for information on thermal solution
requirements and reference thermal solutions.
6.1

Operating Environment and Thermal Performance

The reference thermal solution was designed assuming a maximum local-ambient temperature of
55° C with a minimum airflow velocity directly upstream of the heatsink of 50 LFM. Assuming
these boundary conditions are met, the reference thermal solution will meet the thermal
specifications for the Intel E7500 and Intel E7501 chipset MCHs in all memory and Hub Interface
configurations. See
design, and
E7501 chipset MCHs.
The reference thermal solution provides enough thermal capability to meet the required theta ja for
all of the configurations listed in
Table 4.

Theta ja Required versus Device and Configuration

®
Intel E7500 Chipset MCH
®
Intel E7501 Chipset MCH
(Paired with Intel
processor, dual channel memory configuration)
Intel E7501 Chipset MCH
(Paired with Intel Xeon processor or Low Voltage Intel Xeon
processor, single channel memory configuration)
Intel E7501 Chipset MCH
(Paired with Intel
configuration)
Intel E7501 Chipset MCH
(Paired with Intel Pentium M processor, single channel memory
configuration)
† T is defined as the local (internal) ambient temperature directly upstream of the chipset.
LA
Thermal Design Guide
®
Intel E7500 and Intel
®
E7501 chipset MCHs at worst-case embedded conditions. This section describes
®
PCI-64 Hub 2 (P64H2) Thermal Design Guidelines and Intel
Figure 7 for a plot of the theta ja versus airflow for the reference heatsink
Table 4 for the required theta ja heatsink performances for the Intel E7500 and Intel
Table 4
Device
® ™
Xeon processor or Low Voltage Intel Xeon
® ®
Pentium M processor, dual channel memory
®
E7501 Chipsets MCH Thermal Design Guide
with 50 LFM airflow.
Theta ja Max (° C/W) at T
®
®
I/O
= 55° C
LA
6.27° C/W
5.88° C/W
6.41° C/W
7.04° C/W
8.06° C/W
17