Intel E7230 MCH Thermal/Mechanical Design Manual
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Intel E7230 MCH Thermal/Mechanical Design Manual

Intel E7230 MCH Thermal/Mechanical Design Manual

Chipset memory controller hub
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Intel
E7230 Chipset Memory
Controller Hub (MCH)
Thermal/Mechanical Design Guide
July 2005
Document Number:
308335-001

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Summary of Contents for Intel Intel E7230 MCH

  • Page 1 ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide July 2005 Document Number: 308335-001...
  • Page 2 Notice: This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information. Contact your local Intel sales office or your distributor to obtain the latest specification before placing your product order.

  • Page 3: Table Of Contents

    Heatsink Clips ..................27 6.5.6 Clip Retention Anchors................28 Reliability Guidelines ................... 28 Thermal Solution Component Suppliers................29 Plastic Wave Soldering Heatsink Thermal Solution ..........29 Mechanical Drawings ....................... 31 ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...
  • Page 4 Plastic Wave Soldering Heatsink Wire Clip Drawing .......... 37 Plastic Wave Soldering Heatsink Solder-down Anchor Drawing ......38 Tables Intel® E7230 Chipset MCH Thermal Specifications..........13 Chomerics T710 TIM Performance as a Function of Attach Pressure ....27 Reliability Guidelines ................... 28 Mechanical Drawing List ..................
  • Page 5 Revision History Revision Description Revision Date Number • Initial Release. June 2005 § ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...
  • Page 6 ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...

  • Page 7: Introduction

    By maintaining the Intel E7230 chipset MCH die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset.

  • Page 8: Reference Documents

    Processor Extreme Edition 840 Thermal and Mechanical Design Guidelines ® ® ® ® Intel Pentium Processor Extreme Edition and Intel Pentium Processor Specification Update BGA/OLGA Assembly Development Guide Contact your Intel Field Sales Representative Various system thermal design suggestions http://www.formfactors.org §...

  • Page 9: Packaging Technology

    Packaging Technology The Intel E7230 chipset consist of three individual components: the MCH, the ICH7 and the Intel 6700PXH 64-bit PCI Hub. The Intel E7230 chipset MCH components use a 34 mm squared, 6-layer flip chip ball grid array (FC-BGA) package (see...

  • Page 10: Mch Package Dimensions (Side View)

    4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped) orientation after reflow Figure 2-3. MCH Package Dimensions (Bottom View) NOTES: 1. All dimensions are in millimeters. 2. All dimensions and tolerances conform to ANSI Y14.5M-1994. ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...

  • Page 11: Package Mechanical Requirements

    Packaging Technology Package Mechanical Requirements The Intel E7230 chipset MCH package has an exposed bare die which is capable of sustaining a maximum static normal load of 10 lbf. The package is NOT capable of sustaining a dynamic or static compressive load applied to any edge of the bare die. These mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use condition.
  • Page 12 Packaging Technology ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...

  • Page 13: Thermal Specifications

    Intel E7230 chipset MCH. FC-BGA packages have poor heat transfer capability into the board and have minimal thermal capability without a thermal solution. Intel recommends that system designers plan for a heatsink when using the Intel E7230 chipset.
  • Page 14 Thermal Specifications ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...

  • Page 15: Thermal Simulation

    The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool FLOTHERM* (version 5.1 or higher) by Flomerics, Inc. Contact your Intel field sales representative to order the thermal models and user's guides.
  • Page 16 Thermal Simulation ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...

  • Page 17: Thermal Metrology

    Thermal Metrology The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the MCH die temperatures. Section 5.1 provides guidelines on how to accurately measure the MCH die temperatures.

  • Page 18: Thermal Solution Decision Flowchart

    Figure 5-2. Zero Degree Angle Attach Heatsink Modifications NOTE: Not to scale. Figure 5-3. Zero Degree Angle Attach Methodology (Top View) Thermocouple Wire Cement + Thermocouple Bead Substrate NOTE: Not to scale. ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...

  • Page 19: Power Simulation Software

    The power simulation software is a utility designed to dissipate the thermal design power on an Intel E7230 chipset MCH when used in conjunction with the Prescott processor (1333 MHz). The combination of the above mentioned processor(s) and the higher bandwidth capability of the Intel E7230 chipset enable higher levels of system performance.
  • Page 20 Thermal Metrology ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...

  • Page 21: Reference Thermal Solution

    Reference Thermal Solution ® Intel has developed a reference thermal solution to meet the cooling needs of the Intel E7230 chipset MCH under operating environments and specifications defined in this document. This chapter describes the overall requirements for the Plastic Wave Soldering Heatsink (PWSH) reference thermal solution including critical-to-function dimensions, operating environment, and validation criteria.

  • Page 22: Mechanical Design Envelope

    End of Life TIM, add +1.0C/W offset to Psi_ca. Mechanical Design Envelope While each design may have unique mechanical volume and height restrictions or implementation ® requirements, the height, width, and depth constraints typically placed on the Intel E7230 chipset MCH thermal solution are shown in Figure 6-2.

  • Page 23: Board-Level Components Keepout Dimensions

    Area 47.0 mm Board-Level Components Keepout Dimensions The location of hole patterns and keepout zones for the reference thermal solution are shown in Figure 6-3 Figure 6-4. ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...

  • Page 24: Plastic Wave Soldering Heatsink Thermal Solution Assembly

    Figure 6-3. Plastic Wave Soldering Heatsink Board Component Keepout 60.6 mm 48.0 mm 26.79 mm Heatsink Fin Max 2.2 mm Component Height component this Area 47.0 mm Air Flow ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...

  • Page 25: Heatsink Orientation

    8 x Ø1.42 mm Trace Keepout 6.5.1 Heatsink Orientation Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned with the direction of the heatsink fins. ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...

  • Page 26: Extruded Heatsink Profiles

    Chomerics T710 TIM is shown in Table 6-1. The heatsink clip provides enough pressure for the TIM to achieve a thermal conductivity of 0.17°C inch ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...

  • Page 27: Heatsink Clips

    See Appendix B for a mechanical drawing of the clip. Figure 6-6. Plastic Wave Soldering Heatsink Extrusion Profile ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...

  • Page 28: Clip Retention Anchors

    6.5.6 Clip Retention Anchors For Intel E7230 chipset-based platforms that have very limited board space, a clip retention anchor has been developed to minimize the impact of clip retention on the board. It is based on a standard two-pin jumper and is soldered to the board like any common through-hole header. A new anchor design is available with 45°...

  • Page 29: A Thermal Solution Component Suppliers

    Thermal Solution Component Suppliers Plastic Wave Soldering Heatsink Thermal Solution Supplier Part Intel Part Number Contact Information (Part Number) Heatsink Assembly includes: C92237-001 Monica Chih (Taiwan) 866-2-29952666, x131 • Unidirectional Pin-Fin monica_chih@ccic.com.tw Heatsink • Thermal Interface Material Harry Lin (CCI/ACK-USA) •...
  • Page 30 Thermal Solution Component Suppliers Supplier Part Intel Part Number Contact Information (Part Number) Solder-Down Anchor C85376-001 Wieson Rick Lin Deputy Manager/Project Sales Department Add.: 7F, No. 276, Section 1, Tatung Road, Hsichih City, Taipei Hsien, Taiwan Tel: 886-2-2647-1896 ext. 6342 Mobile: 886-955644008 Email: rick@wieson.com...

  • Page 31: B Mechanical Drawings

    Plastic Wave Soldering Heatsink Ramp Clip Drawing (2 of 2) Figure B-5 Plastic Wave Soldering Heatsink Wire Clip Drawing Figure B-6 Plastic Wave Soldering Heatsink Solder-down Anchor Drawing Figure B-7 ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...

  • Page 32: Plastic Wave Soldering Heatsink Assembly Drawing

    Mechanical Drawings Figure B-1. Plastic Wave Soldering Heatsink Assembly Drawing ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...

  • Page 33: Plastic Wave Soldering Heatsink Drawing (1 Of 2)

    Mechanical Drawings Figure B-2. Plastic Wave Soldering Heatsink Drawing (1 of 2) ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...

  • Page 34: Plastic Wave Soldering Heatsink Drawing (2 Of 2)

    Mechanical Drawings Figure B-3. Plastic Wave Soldering Heatsink Drawing (2 of 2) ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...

  • Page 35: Plastic Wave Soldering Heatsink Ramp Clip Drawing (1 Of 2)

    Mechanical Drawings Figure B-4. Plastic Wave Soldering Heatsink Ramp Clip Drawing (1 of 2) ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...

  • Page 36: Plastic Wave Soldering Heatsink Ramp Clip Drawing (2 Of 2)

    Mechanical Drawings Figure B-5. Plastic Wave Soldering Heatsink Ramp Clip Drawing (2 of 2) ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...

  • Page 37: Plastic Wave Soldering Heatsink Wire Clip Drawing

    Mechanical Drawings Figure B-6. Plastic Wave Soldering Heatsink Wire Clip Drawing ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...

  • Page 38: Plastic Wave Soldering Heatsink Solder-Down Anchor Drawing

    Mechanical Drawings Figure B-7. Plastic Wave Soldering Heatsink Solder-down Anchor Drawing § ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...

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