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Notice: This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information. Contact your local Intel sales office or your distributor to obtain the latest specification before placing your product order.
By maintaining the Intel E7230 chipset MCH die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset.
Packaging Technology The Intel E7230 chipset consist of three individual components: the MCH, the ICH7 and the Intel 6700PXH 64-bit PCI Hub. The Intel E7230 chipset MCH components use a 34 mm squared, 6-layer flip chip ball grid array (FC-BGA) package (see...
4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped) orientation after reflow Figure 2-3. MCH Package Dimensions (Bottom View) NOTES: 1. All dimensions are in millimeters. 2. All dimensions and tolerances conform to ANSI Y14.5M-1994. ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...
Packaging Technology Package Mechanical Requirements The Intel E7230 chipset MCH package has an exposed bare die which is capable of sustaining a maximum static normal load of 10 lbf. The package is NOT capable of sustaining a dynamic or static compressive load applied to any edge of the bare die. These mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use condition.
Intel E7230 chipset MCH. FC-BGA packages have poor heat transfer capability into the board and have minimal thermal capability without a thermal solution. Intel recommends that system designers plan for a heatsink when using the Intel E7230 chipset.
The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool FLOTHERM* (version 5.1 or higher) by Flomerics, Inc. Contact your Intel field sales representative to order the thermal models and user's guides.
Thermal Metrology The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the MCH die temperatures. Section 5.1 provides guidelines on how to accurately measure the MCH die temperatures.
The power simulation software is a utility designed to dissipate the thermal design power on an Intel E7230 chipset MCH when used in conjunction with the Prescott processor (1333 MHz). The combination of the above mentioned processor(s) and the higher bandwidth capability of the Intel E7230 chipset enable higher levels of system performance.
Reference Thermal Solution ® Intel has developed a reference thermal solution to meet the cooling needs of the Intel E7230 chipset MCH under operating environments and specifications defined in this document. This chapter describes the overall requirements for the Plastic Wave Soldering Heatsink (PWSH) reference thermal solution including critical-to-function dimensions, operating environment, and validation criteria.
End of Life TIM, add +1.0C/W offset to Psi_ca. Mechanical Design Envelope While each design may have unique mechanical volume and height restrictions or implementation ® requirements, the height, width, and depth constraints typically placed on the Intel E7230 chipset MCH thermal solution are shown in Figure 6-2.
Area 47.0 mm Board-Level Components Keepout Dimensions The location of hole patterns and keepout zones for the reference thermal solution are shown in Figure 6-3 Figure 6-4. ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...
Figure 6-3. Plastic Wave Soldering Heatsink Board Component Keepout 60.6 mm 48.0 mm 26.79 mm Heatsink Fin Max 2.2 mm Component Height component this Area 47.0 mm Air Flow ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...
8 x Ø1.42 mm Trace Keepout 6.5.1 Heatsink Orientation Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned with the direction of the heatsink fins. ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...
Chomerics T710 TIM is shown in Table 6-1. The heatsink clip provides enough pressure for the TIM to achieve a thermal conductivity of 0.17°C inch ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...
See Appendix B for a mechanical drawing of the clip. Figure 6-6. Plastic Wave Soldering Heatsink Extrusion Profile ® Intel E7230 Chipset Memory Controller Hub (MCH) Thermal/Mechanical Design Guide...
6.5.6 Clip Retention Anchors For Intel E7230 chipset-based platforms that have very limited board space, a clip retention anchor has been developed to minimize the impact of clip retention on the board. It is based on a standard two-pin jumper and is soldered to the board like any common through-hole header. A new anchor design is available with 45°...
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