Intel G35 Express Chipset Design Manuallines
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Intel G35 Express Chipset Design Manuallines

Graphics and memory controller hub (gmch)
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®
Intel
G35 Express Chipset
Thermal and Mechanical Design Guidelines
®
— For the Intel
82G35 Graphics and Memory Controller Hub
(GMCH)
August 2007
Document Number:
317609-001

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Summary of Contents for Intel G35 Express Chipset

  • Page 1 ® Intel G35 Express Chipset Thermal and Mechanical Design Guidelines ® — For the Intel 82G35 Graphics and Memory Controller Hub (GMCH) August 2007 Document Number: 317609-001...
  • Page 2 The Intel 82G35 Graphics and Memory Controller Hub (GMCH) may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

  • Page 3: Table Of Contents

    Contents Introduction .....................7 Terminology ..................8 Reference Documents ................9 Product Specifications..................11 Package Description................11 2.1.1 Non-Grid Array Package Ball Placement ........11 Package Loading Specifications...............12 Thermal Specifications ................13 Thermal Design Power (TDP)..............13 2.4.1 Definition ................13 2.4.2 Methodology................14 2.4.3 Specifications .................14 2.4.4 Limit ................14 CONTROL Non-Critical to Function Solder Balls............15 Thermal Metrology ..................17...
  • Page 4 (Board Level) ...................25 Table 4. Balanced Technology Extended (BTX) Reference Thermal Solution Environmental Reliability Requirements (System Level) ......26 ® Table 5. ATX Intel Reference Heatsink Enabled Suppliers for Intel Express Chipset ................27 ® Table 6. Balanced Technology Extended (BTX) Intel Reference Heatsink ®...
  • Page 5 Revision History Revision Description Date Number -001 • Initial release. August 2007 § Thermal and Mechanical Design Guidelines...
  • Page 6 Thermal and Mechanical Design Guidelines...

  • Page 7: Introduction

    Note: In this document the use of the term chipset refers to the combination of the GMCH ® and the Intel ICH8. For the ICH8 thermal details, refer to the Intel I/O Controller Hub 8 (ICH8) Thermal Design Guidelines.

  • Page 8: Terminology

    Note that the device arrives at the customer with solder balls attached. ® ® Intel ICH8 Intel I/O Controller Hub 8. The chipset component that contains the primary PCI interface, LPC interface, USB, ATA, and/or other legacy functions.

  • Page 9: Reference Documents

    Pentium Dual Core Processor http://www.intel.com Thermal and Mechanical Design Guidelines /design/processor/spe cupdt/313279.htm ® ® Intel Core™2 Extreme Quad-Core Processor and Intel Core™2 Quad http://www.intel.com Processor Thermal and Mechanical Design Guidelines /design/processor/des ignex/315594.htm Balanced Technology Extended (BTX) Interface Specification http://www.formfacto rs.org Various System Thermal Design Suggestions http://www.formfacto...
  • Page 10 Introduction Thermal and Mechanical Design Guidelines...

  • Page 11: Product Specifications

    [0.031 in], but ball ordering does not follow a 0.8-mm grid. Board designers should ensure correct ball placement when designing for the non-grid array pattern. For exact ball locations relative to the package, contact your Intel Field Sales Representative. Thermal and Mechanical Design Guidelines...

  • Page 12: Package Loading Specifications

    Product Specifications Figure 1. GMCH Non-Grid Array 34 x 34mm Substrate [1.34 x 1.34 in] 29 31 35 37 BC10 BC12 BC14 BC16 BC18 BC20 BC22 BC24 BC26 BC28 BC30 BC32 BC34 BC37 BC39 BC42 BC41 FIDSAF1 BC43 BB11 BB13 BB15 BB17 BB19...

  • Page 13: Thermal Specifications

    Product Specifications To ensure the package static load limit is not exceeded, the designer should understand the post reflow package height. The following figure shows the nominal post-reflow package height assumed for calculation of a heatsink clip preload of the reference design.

  • Page 14: Methodology

    2. Max Idle Power is the worst case idle power in system booted to Windows* with no background applications running. ® 3. When an external graphics card is installed in a system with the Intel G35 Express Chipset, the TDP for this part will drop to approximately 19 W. The GMCH will detect the presence of the graphics card and disable the on-board graphics resulting in the lower GMCH TDP.

  • Page 15: Non-Critical To Function Solder Balls

    Product Specifications Non-Critical to Function Solder Balls Intel has defined selected solder joints of the GMCH as non-critical to function (NCTF) when evaluating package solder joints post environmental testing. The GMCH signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality.
  • Page 16 Product Specifications Thermal and Mechanical Design Guidelines...

  • Page 17: Thermal Metrology

    Thermal Metrology Thermal Metrology The system designer must measure temperatures in order to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques of measuring GMCH component case temperatures. Case Temperature Measurements To ensure functionality and reliability of the GMCH the T must be maintained at or below the maximum temperature listed in Table 2.

  • Page 18: Figure 4. 0° Angle Attach Methodology (Top View, Not To Scale)

    Thermal Metrology Figure 4. 0° Angle Attach Methodology (top view, not to scale) Figure 5. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom view shown, not to scale) Thermal and Mechanical Design Guidelines...

  • Page 19: Airflow Characterization

    Figure 6 shows the recommended location for air temperature measurements measured relative to the component. For a more accurate measurement of the average approach air temperature, Intel recommends averaging temperatures recorded from two thermocouples spaced about 25 mm [1.0 in] apart. Locations for both a single thermocouple and a pair of thermocouples are presented.
  • Page 20 Thermal Metrology Thermal and Mechanical Design Guidelines...

  • Page 21: Reference Thermal Solution

    Intel 945G Express Chipset thermal solution. The thermal interface material and a wire preload clip are being redesigned to meet the Intel G35 Express Chipset thermal requirements. The Balanced Technology Extended (BTX) reference design for the Intel G35 Express Chipset includes a new extrusion, clip with higher preload and a new thermal interface material.

  • Page 22: Balanced Technology Extended (Btx) Form Factor Operating Environment

    Operating Environment This section provides operating environment conditions based on what has been exhibited on the Intel micro-BTX reference design. On a BTX platform, the GMCH obtains in-line airflow directly from the processor thermal module. Since the processor thermal module provides lower inlet temperature airflow to the processor, reduced inlet ambient temperatures are also often seen at the GMCH as compared to ATX.

  • Page 23: Reference Design Mechanical Envelope

    A thermal interface material (Honeywell* PCM45F) is pre-applied to the heatsink bottom over an area which contacts the package die. ® Note: The ATX design is similar in appearance to the Intel 945G Express Chipset thermal solution, but two critical items have been changed.

  • Page 24: Figure 9. Atx Gmch Heatsink - Installed On Board

    Reference Thermal Solution The reference thermal solution for the GMCH in a BTX chassis is shown in Figure 10. The heatsink is aluminum extruded and uses a Z-clip for attach. The clip is secured to the system motherboard via two solder down anchors around the GMCH. The clip helps to provide a mechanical preload to the package via the heatsink.

  • Page 25: Environmental Reliability Requirements

    Reference Thermal Solution Figure 10. Balanced Technology Extended (BTX) GMCH Heatsink - Installed on Board Environmental Reliability Requirements The environmental reliability requirements for the reference thermal solution are shown in Table 3 and Table 4. These should be considered as general guidelines. Validation test plans should be defined by the user based on anticipated use conditions and resulting reliability requirements.

  • Page 26: Table 4. Balanced Technology Extended (Btx) Reference Thermal Solution Environmental Reliability Requirements (System Level)

    Reference Thermal Solution Table 4. Balanced Technology Extended (BTX) Reference Thermal Solution Environmental Reliability Requirements (System Level) Test Requirement Pass/Fail Criteria Mechanical • 2 drops for + and - directions in each of 3 Visual\Electrical perpendicular axes (i.e., total 12 drops). Shock Check •...

  • Page 27: Appendix A Enabled Suppliers

    Enabled suppliers for the GMCH reference thermal solution are listed in Table 5 and Table 6. The supplier contact information is listed in Table 7. Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices.

  • Page 28: Table 7. Supplier Contact Information

    Enabled Suppliers Table 7. Supplier Contact Information Supplier Contacts Phone Email AVC (Asia Vital David Chao +886-2-2299-6930 ext. david_chao@avc.com.tw Components) 7619 Raichel Hsu +886-2-2299-6930 ext. raichel_hsi@avc.com.tw 7630 CCI(Chaun Choung Monica Chih +886-2-2995-2666 monica_chih@ccic.com.tw Technology) Harry Lin (714) 739-5797 hlinack@aol.com Foxconn Jack Chen (408) 919-6121 jack.chen@foxconn.com...

  • Page 29: Appendix B Mechanical Drawings

    Mechanical Drawings Appendix B Mechanical Drawings The following table lists the mechanical drawings available in this document. Drawing Name Page Number GMCH Package Drawing GMCH Keep-Out Restrictions for ATX Platforms GMCH Keep-Out Restrictions for Balanced Technology Extended (BTX) Platforms GMCH Reference Heatsink for ATX Platforms – Sheet 1 GMCH Reference Heatsink for ATX Platforms –...

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