Intel 4 Series Thermal/Mechanical Design Manuallines
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Intel 4 Series Thermal/Mechanical Design Manuallines

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Intel
4 Series Chipset
Thermal and Mechanical Design Guidelines
September 2008
Document Number: 319972-004

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Summary of Contents for Intel 4 Series

  • Page 1 ® Intel 4 Series Chipset Thermal and Mechanical Design Guidelines September 2008 Document Number: 319972-004...
  • Page 2 Customers, licensees and other third parties are not authorized by Intel to use code names in advertising, promotion or marketing of any product or services and any such use of Intel’s internal code names is at the sole risk of the user.

  • Page 3: Table Of Contents

    Contents Introduction .....................7 Terminology ..................8 Reference Documents ................9 Product Specifications..................11 Package Description................11 2.1.1 Non-Grid Array Package Ball Placement ........11 Package Loading Specifications............... 12 Thermal Specifications ................12 2.3.1 Thermal Design Power (TDP) ............ 13 2.3.1.1 Definition ..............13 2.3.2 TDP Prediction Methodology ............13 2.3.2.1 Pre-Silicon ...............
  • Page 4 Table 6. Balanced Technology Extended (BTX) Reference Thermal Solution Environmental Reliability Requirements (System Level) ......30 Table 7. ATX Intel Reference Heatsink Enabled Suppliers for (G)MCH ..... 31 Table 8. BTX Intel Reference Heatsink Enabled Suppliers for (G)MCH ..... 31 Table 9.
  • Page 5 Revision Description Date Number -001 Initial Release June 2008 -002 Minor edits and formatting throughout. June 2008 -003 Added Intel 82G41 GMCH September 2008 -004 Added Intel 82Q43 GMCH and 82Q45 GMCH September 2008 § Thermal and Mechanical Design Guidelines...
  • Page 6 Thermal and Mechanical Design Guidelines...

  • Page 7: Introduction

    MCH. The term (G)MCH will be used to when referring to all configurations. Note: In this document the Intel P45, P43, Q45, Q43, G45, and G43 Chipsets refer to the ® combination of the (G)MCH and the Intel ICH10.

  • Page 8: Terminology

    Note that the device arrives at the customer with solder balls attached. ® ® Intel ICH7 Intel I/O Controller Hub 7. The chipset component that contains the primary PCI interface, LPC interface, USB2, SATA, and/or other legacy functions.

  • Page 9: Reference Documents

    Pentium Dual-Core Processor E5000 Series Thermal and cessor/designex/318734.pdf Mechanical Design Guidelines ® Intel Core™2 Extreme Quad-Core Processor and Intel® Core™2 http://www.intel.com/ Quad Processor Thermal and Mechanical Design Guidelines design/processor/designex/ 315594.htm Balanced Technology Extended (BTX) Interface Specification http://www.formfactors.org Various System Thermal and Mechanical Design Suggestions http://www.formfactors.org...
  • Page 10 Introduction Thermal and Mechanical Design Guidelines...

  • Page 11: Product Specifications

    0.7 mm [0.028 in], but ball ordering does not follow a 0.7 mm grid. Board designers should ensure correct ball placement when designing for the non-grid array pattern. ® For exact ball locations relative to the package, refer to the Intel 4 Series Chipset Family Datasheet.

  • Page 12: Package Loading Specifications

    Product Specifications Package Loading Specifications Table 1 provides static load specifications for the package. This mechanical maximum load limit should not be exceeded during heatsink assembly, shipping conditions, or standard use conditions. Also, any mechanical system or component testing should not exceed the maximum limit.

  • Page 13: Thermal Design Power (Tdp)

    Product Specifications 2.3.1 Thermal Design Power (TDP) 2.3.1.1 Definition Thermal design power (TDP) is the estimated power dissipation of the (G)MCH based on normal operating conditions including V and T while executing real worst- C-MAX case power intensive applications. This value is based on expected worst-case data traffic patterns and usage of the chipset and does not represent a specific software application.

  • Page 14: Thermal Specifications

    TDP for these components. The Idle and TDP numbers are assuming Internal Graphics is disabled on the Intel Q43 Chipset. Idle data is measured on Intel P45, P43 Chipset when an external graphics card is installed in a system wherein this card must support L0s /L1 ASPM.

  • Page 15: Non-Critical To Function Solder Balls

    (G)MCH. Non-Critical to Function Solder Balls Intel has defined selected solder joints of the (G)MCH as non-critical to function (NCTF) when evaluating package solder joints post environmental testing. The (G)MCH signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality.
  • Page 16 Product Specifications Thermal and Mechanical Design Guidelines...

  • Page 17: Thermal Metrology

    Thermal Metrology Thermal Metrology The system designer must measure temperatures in order to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques of measuring (G)MCH component case temperatures. Case Temperature Measurements To ensure functionality and reliability of the (G)MCH the T must be maintained at or below the maximum temperature listed in Table 2.

  • Page 18: Figure 4. 0° Angle Attach Methodology (Top View, Not To Scale)

    Thermal Metrology Figure 4. 0° Angle Attach Methodology (top view, not to scale) Figure 5. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom view shown, not to scale) Thermal and Mechanical Design Guidelines...

  • Page 19: Airflow Characterization

    Figure 6 describes the recommended location for air temperature measurements measured relative to the component. For a more accurate measurement of the average approach air temperature, Intel recommends averaging temperatures recorded from two thermocouples spaced about 25 mm [1.0 in] apart. Locations for both a single thermocouple and a pair of thermocouples are presented.
  • Page 20 Thermal Metrology Thermal and Mechanical Design Guidelines...

  • Page 21: Reference Thermal Solution

    Note: The PWSHS reference design retention requires zero gap (between anchor wire clip and ramp retainer) to ensure effective top-side stiffening for solder joint protection. ® This cross-cut dimension change design allows to be used on Intel 3 Series Chipsets without assembly issue.

  • Page 22: Operating Environment

    (G)MCH thermal requirements. The keep out zone remains the ® same as used with the Intel 3 Series Chipsets, see Figure 16. This chapter provides detailed information on operating environment assumptions, heatsink manufacturing, and mechanical reliability requirements for the (G)MCH.

  • Page 23: Atx Form Factor Operating Environment

    Reference Thermal Solution 4.1.1 ATX Form Factor Operating Environment The (G)MCH reference design thermal solution has been optimized to meet all three boundary conditions for 65W/95W/130W processor TDPs. The highest processor TDP provide a boundary condition for the (G)MCH heatsink with higher air inlet speed and temperature (T ) while the lowest processor TDP provides lower air inlet speed and temperature.

  • Page 24: Figure 8. Atx Boundary Conditions

    Reference Thermal Solution Figure 8. ATX Boundary Conditions Thermal and Mechanical Design Guidelines...

  • Page 25: Figure 9. Side View Of Atx Boundary Conditions

    Reference Thermal Solution Figure 9. Side View of ATX Boundary Conditions Figure 10. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on an ATX Platform Airflow Direction Airflow Direction Airflow Direction Airflow Direction GMCH Heatsink GMCH Heatsink Omni Directional Flow Omni Directional Flow Processor Heatsink Processor Heatsink...

  • Page 26: Balanced Technology Extended (Btx) Form Factor Operating Environment

    Operating Environment This section provides operating environment conditions based on what has been exhibited on the Intel BTX Entertainment PC reference design, refer to the Balanced Technology Extended (BTX) Entertainment PC Case Study for detail system study. On a BTX platform, the (G)MCH obtains in-line airflow directly from the processor thermal module.

  • Page 27: Reference Design Mechanical Envelope

    Reference Thermal Solution Figure 11. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on a Balanced Technology Extended (BTX) Platform BTX Thermal Module Assembly Airflow Direction over processor GMCH Top View Reference Design Mechanical Envelope The motherboard component keep-out restrictions for the (G)MCH on an ATX platform are included in Appendix B, Figure 15.

  • Page 28: Figure 12. Design Concept For Atx (G)Mch Heatsink - Installed On Board

    Reference Thermal Solution Figure 12. Design Concept for ATX (G)MCH Heatsink — Installed on Board Figure 13. Design Concept for Balanced Technology Extended (BTX) (G)MCH Heatsink Design — Installed on Board Thermal and Mechanical Design Guidelines...

  • Page 29: Environmental Reliability Requirements

    Reference Thermal Solution Environmental Reliability Requirements The environmental reliability requirements for the reference thermal solution are shown in Table 5 and Table 6. These should be considered as general guidelines. Validation test plans should be defined by the user based on anticipated use conditions and resulting reliability requirements.

  • Page 30: Table 6. Balanced Technology Extended (Btx) Reference Thermal Solution Environmental Reliability Requirements (System Level)

    Reference Thermal Solution Table 6. Balanced Technology Extended (BTX) Reference Thermal Solution Environmental Reliability Requirements (System Level) Test Requirement Pass/Fail Criteria Mechanical • 3 drops for + and - directions in each of 3 Visual\Electrical Shock perpendicular axes (i.e., total 18 drops). Check •...

  • Page 31: Appendix A Enabled Suppliers

    Enabled suppliers for the (G)MCH reference thermal solution are listed in Table 7 and Table 8. The supplier contact information is listed in Table 9. Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices.

  • Page 32: Table 9. Supplier Contact Information

    Enabled Suppliers Table 9. Supplier Contact Information Supplier Contacts Phone Email David Chao +886-2-2299-6930 ext. david_chao@avc.com.tw 7619 AVC (Asia Vital Components) Raichel Hsu +886-2-2299-6930 ext. raichel_hsi@avc.com.tw 7630 Monica Chih +886-2-2995-2666 monica_chih@ccic.com.tw CCI(Chaun Choung Technology) Harry Lin (714) 739-5797 hlinack@aol.com Jack Chen (408) 919-6121 jack.chen@foxconn.com Foxconn...

  • Page 33: Appendix B Mechanical Drawings

    Mechanical Drawings Appendix B Mechanical Drawings The following table lists the mechanical drawings available in this document: Drawing Name Page Number . (G)MCH Package Drawing . (G)MCH Component Keep-Out Restrictions for ATX Platforms . (G)MCH Component Keep-Out Restrictions for Balanced Technology Extended (BTX) Platforms .

This manual is also suitable for:

P45G43P43G41Q43Q45 ... Show all

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