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Summary of Contents for Intel Intel E7500 MCH
- Page 1 ® ® Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide for Embedded Applications March 2003 Order Number: 273819-002...
- Page 2 Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-548-4725 or by visiting Intel's website at http://www.intel.com.
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Page 3: Table Of Contents
Contents Contents Introduction............................5 Document Goals ........................5 Document Scope ........................5 Design Flow .......................... 5 Definition of Terms........................ 6 Reference Documents ......................6 Packaging Technology .........................7 Thermal Simulation ........................9 Thermal Specifications .......................11 Power..........................11 Die Temperature ......................... 11 Thermal Metrology ........................13 Die Temperature Measurements .................. - Page 4 Reliability Requirements ......................25 Mechanical Drawing List......................31 Revision History Date Revision Description ® ® Revised Table 3, “Intel E7500 and Intel E7501 Chipsets MCH Thermal Specifications.” March 2003 Revised Table 4, “Theta ja Required versus Device and Configuration.” November 2002 Initial release of this document.
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Page 5: Introduction
The goal of ® ® this document is to provide an understanding of the operating limits of the Intel E7500 and Intel E7501 chipset MCHs and describe a reference thermal solution for embedded applications. -
Page 6: Definition Of Terms
Mini Ball Grid Array. A version of the BGA with a smaller ball pitch. Memory Controller Hub. The chipset component that contains the processor interface and the memory interface. ® ® Flip Chip Ball Grid Array. A packaging technology used for the Intel E7500 and Intel E7501 FC-BGA chipset MCHs. -
Page 7: Packaging Technology
E7500 and Intel E7501 chipsets consist of three individual components, the memory ® controller hub (MCH), bus controller hub (P64H2), and I/O controller hub (ICH3-S). The Intel E7500 and E7501 MCHs utilize a 42.5 mm, 6-layer FC-BGA package shown in Figure 2. - Page 8 ® ® Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide This page intentionally left blank. Thermal Design Guide...
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Page 9: Thermal Simulation
Computational Fluid Dynamics (CFD)-based thermal analysis tool FLOTHERM* (version 3.1 or higher) by Flomerics Inc. Contact your Intel Field Sales representative to order the thermal models and user’s guides. The Intel E7500 chipset MCH thermal model may also be used for simulating the Intel E7501 chipset MCH. - Page 10 ® ® Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide This page intentionally left blank. Thermal Design Guide...
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Page 11: Thermal Specifications
Intel E7500 or Intel E7501 chipset components. Die Temperature To ensure proper operation and reliability of the Intel E7500 and Intel E7501 chipset MCHs, the die temperatures must be at or below the values specified in Table 3. - Page 12 ® ® Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide This page intentionally left blank. Thermal Design Guide...
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Page 13: Thermal Metrology
E7501 Chipsets MCH Thermal Design Guide Thermal Metrology The system designer must obtain temperature measurements in order to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques of measuring chipset MCH die temperatures. Section 5.1 provides guidelines on how to accurately measure the MCH die temperatures. -
Page 14: 0° Angle Attach Methodology
® ® Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide Figure 3 shows the 90° angle attach methodology. Figure 3. 90° Angle Attach Methodology NOTE: Drawing is not to scale. 5.1.2 0° Angle Attach Methodology 1. Mill a 3.3-mm [0.13 in] diameter hole centered on bottom of the heat sink base. The milled hole should be approximately 1.5 mm [0.06 in] deep. -
Page 15: 0° Angle Attach Methodology
® ® Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide Figure 4 shows the 0° angle attach methodology. Figure 4. 0° Angle Attach Methodology NOTE: Drawing represents the top view and is not to scale. Figure 5 shows the 0° angle attach heat sink modifications. -
Page 16: Power Simulation Software
512 Kbytes L2 cache. To assess the thermal performance of the chipset MCH thermal solution under “worst-case realistic application” conditions, Intel has developed a software utility that operates the chipset at near worst-case power dissipation. The utility has been developed solely for testing customer thermal solutions at near the thermal design power. -
Page 17: Reference Thermal Solution
E7501 Chipsets MCH Thermal Design Guide Reference Thermal Solution ® Intel has developed a reference thermal solution designed to meet the cooling needs of the Intel ® E7500 and Intel E7501 chipset MCHs at worst-case embedded conditions. This section describes the overall requirements for the reference thermal solution, including critical-to-function dimensions, operating environment, and validation criteria. -
Page 18: Mechanical Design Envelope
Mechanical Design Envelope Though each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on the Intel E7500 chipset and Intel E7501 chipset MCHs in embedded environments are shown in... -
Page 19: Thermal Solution Assembly
® ® Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide Figure 8 shows the reference heat sink volumetric envelope for the MCH. Figure 8. Reference Heat Sink Volumetric Envelope for the MCH NOTE: Drawing dimensions are not to scale. -
Page 20: Retention Method A
® ® Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide 6.3.1 Retention Method A Retention Method A employs the use of a clip and two solder-down through board anchors for mechanical retention. This method is preferred when layout constraints hamper the use of Retention Method B. -
Page 21: Heat Sink Retention Mechanism Layout For Retention Method A
® ® Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide Figure 10 shows the heat sink retention mechanism layout for Retention Method A. Figure 10. Heat Sink Retention Mechanism Layout for Retention Method A 56.34 [2.218] 60.91 [2.398] 2X 30.45 [1.199]... -
Page 22: Heat Sink Clip
® ® Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide 6.3.1.3 Heat Sink Clip Retention Method A employs the use of a wire clip with hooked ends. The hooks attach to anchors to fasten the clip to the board. See Figure 16 Appendix B, “Mechanical Drawings”... -
Page 23: Heat Sink Orientations
Figure 13 shows the board component keep-out for Retention Method B. Figure 13. Board Component Keep-out for Retention Method B Intel® E7500 Chipset MCH Intel® E7501 Chipset MCH NOTE: Drawing dimensions are in inches and are not to scale. Thermal Design Guide... -
Page 24: Heat Sink Push-Pin
6.3.3 Mechanical Interface Material Intel recommends the use of a mechanical interface material to avoid cracking of the exposed die under loading. The interface material reduces mechanical loads experienced by the die. The reference thermal solution uses a picture frame gasket of 0.813 mm [0.032 in] thick Poron* foam. -
Page 25: Reliability Requirements
® ® Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide Reliability Requirements Each motherboard, heat sink, and attach combination may vary the mechanical loading of the component. The user should carefully evaluate the reliability of the completed assembly prior to use in high volume. - Page 26 ® ® Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide This page intentionally left blank. Thermal Design Guide...
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Page 27: Conclusion
This document has presented the conditions and requirements to properly design a cooling solution ® ® for systems implementing Intel E7500 or Intel E7501 chipsets in an embedded application. Properly designed solutions provide adequate cooling to maintain the chipset die temperatures at or below thermal specifications. - Page 28 ® ® Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide This page intentionally left blank. Thermal Design Guide...
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Page 29: Thermal Solution Component Suppliers
® ® Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide Appendix A Thermal Solution Component Suppliers Extruded Pin Fin Heat Sink Part Supplier (Part Number) Contact Information Wendy Lin Pin Fin Heat Sink (Includes heat sink and attached... -
Page 30: Attach Hardware
® ® Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide Attach Hardware Part Intel Part Number Supplier Contact Information Mike McPherson Thermal Interface Power Devices, Inc. 916-686-1432 (Powerstrate 51*) Mike.McPherson@loctite.com Rhoda Kennedy Mechanical Interface A69141-001 Boyd 503-972-3170 (Poron*) rkennedy@boydcorp.com... -
Page 31: Mechanical Drawings
® ® Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide Appendix B Mechanical Drawings Table 6 lists the mechanical drawings included in this section. Table 6. Mechanical Drawing List Drawing Description Page Number MCH Heat Sink Heat Sink Clip... -
Page 32: Mch Heat Sink
® ® Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide Figure 15. MCH Heat Sink Used by permission. Thermal Design Guide... -
Page 33: Heat Sink Clip
® ® Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide Figure 16. Heat Sink Clip Thermal Design Guide... -
Page 34: Push-Pin
® ® Intel E7500 and Intel E7501 Chipsets MCH Thermal Design Guide Figure 17. Push-pin Used by permission. Thermal Design Guide...
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