Maintenance/Expansion; Hot Swap/Hot Expansion; Table 35 Hot Swap And Hot Expansion Availability For Components (Eternus Dx60 S4) - Fujitsu ETERNUS DX60 S4 Design Manual

4.

Maintenance/Expansion

Hot Swap/Hot Expansion

"Hot swap" allows components to be replaced, or allows the firmware to be updated while the system is running.
"Hot expansion" allows components to be added while the system is running.
■
Hot Swap/Hot Expansion (ETERNUS DX60 S4)
The table below shows whether hot swap or hot expansion for components of the ETERNUS DX60 S4 is possible.

Table 35 Hot Swap and Hot Expansion Availability for Components (ETERNUS DX60 S4)

Component
Controller enclosure (CE)
Controller module (CM)
System memory
BBU
BUD
Controller firmware
SFP+
iSCSI port
SAS port
Power supply unit (PSU)
Disk (HDD)
SSD
Operation panel (PANEL)
Disk firmware
Drive enclosure (DE)
Power supply unit (PSU)
Disk (HDD)
SSD
Operation panel (PANEL)
I/O module (IOM)
Disk firmware
¡: Allowed / ´: Not allowed (cold swap is possible) / —: Not applicable
*1: Mid Plane. This is a board that is located between the front (drive side) and rear (controller (CM) or I/O
module (IOM) side) of the ETERNUS DX.
*2: When a multipath configuration is used, switch to the host paths of the CM that will not have maintenance
performed to continue operation.
*3: Hot expansion can only be performed when it is expanded together with a CM in a single-controller config-
uration.
FUJITSU Storage ETERNUS DX60 S4, ETERNUS DX60 S3 Hybrid Storage Systems Design Guide (Basic)
Hot swap Hot expansion
´ —
¡ (*2) ¡ (*3)
—
¡ (*2)
¡ (*2) —
—
¡ (*2)
¡ (*2) (*4) —
¡ (*2) ¡
—
¡
—
¡
—
¡
¡ ¡
¡ ¡
´ (*5)
—
—
¡ (*4)
¡ ¡
—
¡
¡ ¡
¡ ¡
´ (*5)
—
¡ ¡ (*3)
¡ (*4) —
140
Copyright 2019 FUJITSU LIMITED
Remarks
Replace the controller enclosure (CE) when
the MP (*1) fails.
—
—
—
—
—
—
—
—
—
—
—
—
—
Replace the drive enclosure (DE) when the
MP (*1) fails.
—
—
—
—
—
—
P3AM-8992-14ENZ0