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Summary of Contents for DFI SH960MD-CM236/QM170
- Page 1 SH960MD-CM236/QM170 COM Express Basic Module User’s Manual A52000910 Chapter 1 Introduction www.dfi .com...
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Page 2: Copyright
Copyright FCC and DOC Statement on Class B This publication contains information that is protected by copyright. No part of it may be re- This equipment has been tested and found to comply with the limits for a Class B digital produced in any form or by any means or used to make any transformation/adaptation without device, pursuant to Part 15 of the FCC rules. -
Page 3: Table Of Contents
Table of Contents Copyright ................2 Trademarks .................2 COM Express Specification Reference ........2 FCC and DOC Statement on Class B ........2 Warranty ................4 Static Electricity Precautions ..........4 Safety Measures..............4 About the Package ..............5 Optional Items ..............5 Before Using the System Board ...........5 Chapter 1 - Introduction ............6 Specifications ................6 Features ..................7... -
Page 4: Warranty
Warranty Static Electricity Precautions 1. Warranty does not cover damages or failures that arised from misuse of the product, in- It is quite easy to inadvertently damage your PC, system board, components or devices even ability to use the product, unauthorized replacement or alteration of components and prod- before installing them in your system unit. -
Page 5: About The Package
About the Package The package contains the following items. If any of these items are missing or damaged, please contact your dealer or sales representative for assistance. • One SH960MD-CM236/QM170 board • One Cooler (Height: 36.58mm) Optional Items • COM332-B carrier board kit •... -
Page 6: Chapter 1 - Introduction
Chapter 1 Chapter 1 - Introduction Specifications System Processor 6th Generation Intel Processors, BGA 1440 Audio Interface HD Audio ® Intel Xeon E3-1515M v5 Processor, Quad Core, 8M Cache, 2.8GHz ® ® Ethernet Controller 1 x Intel ® I210IT PCIe (10/100/1000Mbps) (3.7GHz), 45W (Support ECC) 4 x USB 3.0 Intel... -
Page 7: Features
Chapter 1 Features • Watchdog Timer The Watchdog Timer function allows your application to regularly “clear” the system at the set time interval. If the system hangs or fails to function, it will reset at the set time interval so that your system will continue to operate. -
Page 8: Chapter 2 - Concept
Chapter 2 - Concept COM Express Module Standards The figure below shows the dimensions of the different types of COM Express modules. SH960MD-CM236/QM170 is a COM Express Basic module. The dimension is 95mm x 125mm. Common for all Form Factors Extended only... -
Page 9: Specification Comparison Table
Chapter 2 Specification Comparison Table The table below shows the COM Express standard specifications and the corresponding specifications supported on the SH960MD-CM236/QM170 module. Module Pin-out - Required and Optional Features A-B Connector. COM Express Module Base Specification Type 6 DFI SH960MD... -
Page 10: Chapter 3 - Hardware Installation
Chapter 3 Chapter 3 - Hardware Installation Board Layout Intel Xeon/ Core/ Celeron Intel DDR4 PTN3460 CM236/QM170 CPU Fan SH960MD-CM236: CM236 Intel SH960MD-QM170: QM170 I210IT SPI Flash BIOS CH7517 Standby Power Top View IT8528E D110 COM Express Connector C110 B110 COM Express Connector A110 Bottom View... -
Page 11: System Memory
Chapter 3 Important: Electrostatic discharge (ESD) can damage your board, processor, disk drives, add-in boards, and other components. Perform installation procedures at an ESD workstation only. If such a station is not available, you can provide some ESD protection by wear- ing an antistatic wrist strap and attaching it to a metal part of the system chassis. -
Page 12: Connectors
Chapter 3 Connectors COM Express Connectors The COM Express connectors are used to interface the SH960MD COMe board with a carrier CPU Fan Connector board. Connect the COM Express connectors (located on the solder side of the board) to the COM Express connectors on the carrier board. - Page 13 Chapter 3 COM Express Connectors Chapter 3 Hardware Installation www.dfi .com...
- Page 14 Chapter 3 Chapter 3 Hardware Installation www.dfi .com...
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Page 15: Com Express Connectors Signal Description
Chapter 3 COM Express Connectors Signal Description Pin Types Input to the Module Output from the Module I/O Bi-directional input / output signal OD Open drain output RSVD pins are reserved for future use and should be no connect. Do not tie the RSVD pins together. HDA Signals Descriptions Signal Pin#... - Page 16 Chapter 3 SATA Signals Descriptions Signal Pin# Pin Type Pwr Rail /Tolerance SH960MD PU/PD Module Base Specification R2.1 Description COM Express Carrier Design Guide R2.0 Description SATA0_TX+ O SATA AC coupled on Module AC Coupling capacitor Serial ATA channel 0 Serial ATA or SAS Channel 0 transmit differential pair.
- Page 17 Chapter 3 PCI Express Lanes Signals Descriptions Signal Pin# Pin Type Pwr Rail /Tolerance SH960MD PU/PD Module Base Specification R2.1 Description COM Express Carrier Design Guide R2.0 Description PCIE_TX3+ AC Coupling capacitor O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 3 PCIe channel 3.
- Page 18 Chapter 3 PEG Signals Descriptions Signal Pin# Pin Type Pwr Rail /Tolerance SH960MD PU/PD Module Base Specification R2.1 Description COM Express Carrier Design Guide R2.0 Description PEG_TX1+ AC Coupling capacitor O PCIE AC coupled on Module PCI Express Graphics transmit differential pairs 1 PEG channel 1, Transmit Output differential pair.
- Page 19 Chapter 3 PEG Signals Descriptions Signal Pin# Pin Type Pwr Rail /Tolerance SH960MD PU/PD Module Base Specification R2.1 Description COM Express Carrier Design Guide R2.0 Description PEG_TX9+ AC Coupling capacitor O PCIE AC coupled on Module PCI Express Graphics transmit differential pairs 9 PEG channel 9, Transmit Output differential pair.
- Page 20 Chapter 3 ExpressCard Signals Descriptions Signal Pin# Pin Type Pwr Rail /Tolerance SH960MD PU/PD Module Base Specification R2.1 Description COM Express Carrier Design Guide R2.0 Description PCI ExpressCard: PCI Express capable card request, active low, one PCI ExpressCard0: PCI Express capable card request, active low, EXCD0_CPPE# I CMOS 3.3V /3.3V...
- Page 21 Chapter 3 USB Signals Descriptions Signal Pin# Pin Type Pwr Rail /Tolerance SH960MD PU/PD Module Base Specification R2.1 Description COM Express Carrier Design Guide R2.0 Description USB over-current sense, USB channels 6 and 7. A pull-up for this line PU 10K to 3.3V shall be present on the Module.
- Page 22 Chapter 3 LVDS Signals Descriptions Signal Pin# Pin Type Pwr Rail /Tolerance SH960MD PU/PD Module Base Specification R2.1 Description COM Express Carrier Design Guide R2.0 Description LVDS_B0+ O LVDS LVDS LVDS channel B differential signal pair 0 LVDS_B0- LVDS_B1+ LVDS Channel B differential pairs O LVDS LVDS LVDS channel B differential signal pair 1...
- Page 23 Chapter 3 SPI Signals Descriptions Signal Pin# Pin Type Pwr Rail /Tolerance SH960MD PU/PD Module Base Specification R2.1 Description COM Express Carrier Design Guide R2.0 Description Chip select for Carrier Board SPI - may be sourced from chipset SPI0 or Chip select for Carrier Board SPI –...
- Page 24 Chapter 3 DDI Signals Descriptions Signal Pin# Pin Type Pwr Rail /Tolerance SH960MD PU/PD Module Base Specification R2.1 Description COM Express Carrier Design Guide R2.0 Description DDI for Display Port: DP1_LANE 3 differential pairs DDI1_PAIR3+ DP1_LANE3+ for DP / TMDS1_CLK+ DDI for SDVO: SDVO1_CK±...
- Page 25 Chapter 3 DDI Signals Descriptions Signal Pin# Pin Type Pwr Rail /Tolerance SH960MD PU/PD Module Base Specification R2.1 Description COM Express Carrier Design Guide R2.0 Description DDI2_PAIR3+ DP2_LANE3+ for DP / TMDS2_CLK+ DDI for Display Port: DP2_LANE 3 differential pairs O PCIE AC coupled off Module DDI for HDMI/DVI: TMDS2_CLK differential pairs...
- Page 26 Chapter 3 DDI Signals Descriptions Signal Pin# Pin Type Pwr Rail /Tolerance SH960MD PU/PD Module Base Specification R2.1 Description COM Express Carrier Design Guide R2.0 Description PU 100K to 3.3V (S/W IC between DDI for Display Port: DP3_AUX- Differetial pairs I/O PCIE AC coupled on Module DP3_AUX- for DP...
- Page 27 Chapter 3 Power and System Management Signals Descriptions Signal Pin# Pin Type Pwr Rail /Tolerance SH960MD PU/PD Module Base Specification R2.1 Description COM Express Carrier Design Guide R2.0 Description A falling edge creates a power button event. Power button events can Power button low active signal used to wake up the system from PWRBTN# I CMOS...
- Page 28 Chapter 3 Thermal Protection Signals Descriptions Signal Pin# Pin Type Pwr Rail /Tolerance SH960MD PU/PD Module Base Specification R2.1 Description COM Express Carrier Design Guide R2.0 Description Thermal Alarm active low signal generated by the external THRM# I CMOS 3.3V / 3.3V PU 10K Input from off-Module temp sensor indicating an over-temp situation.
- Page 29 Chapter 3 Power and GND Signal Descriptions Signal Pin# Pin Type Pwr Rail /Tolerance SH960MD PU/PD Module Base Specification R2.1 Description COM Express Carrier Design Guide R2.0 Description A1, A11, A21, A31, A41, A51, A57, A60, A66, A70, A80, A90, A100, A110, B1, B11, B21 ,B31, B41, B51, B60, B70, B80,...
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Page 30: Standby Power Led
Chapter 3 Cooling Option Standby Power LED Heat Spreader with Heat Sink and Fan Note: The system board used in the following illustrations may not resemble the actual board. These illustrations are for reference only. DDR4 Standby Power LED This LED will light up when the system is in the standby mode. Top View of the Heat Sink Bottom View of the Heat Sink •... -
Page 31: Installing Come Board Onto A Carrier Board
Chapter 3 2. Install the COMe board by applying even pressure to the lower end of the module first, Installing COMe Board onto a Carrier Board and then push down the upper end of the module. You will feel a distinctive click that indicates the module is securely locked into position. - Page 32 Chapter 3 3. Use the provided spring screws to install the heat sink onto the module. Align the mounting holes of the heat sink with the mounting holes of the module and screw on the heat sink in sequence as indicated in the following image. This will avoid damaging the CPU.
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