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1.3
Specifications
Form factor
CPU
Memory
Chipset
I/O Chipset
Ethernet
BIOS
Manageability
OS
H/W Status Monitor
Expansion slot
Battery
Power requirement
Board size
Gross weight
Operating
temperature
Storage temperature
Operating humidity
Power compliance
EMI
1-2
SYSTEM
uATX
LGA1155 socket for Intel
Core™ i3 / Pentium
/ Celeron
®
Supports Intel
22nm / 32nm CPU
®
Supports Intel
Turbo Boost Technology 2.0
®
• The Intel
Turbo Boost Technology 2.0 support depends on the CPU types.
®
2 x DIMM (8GB per DIMM), max. 16GB, DDR3 1600 / 1333 / 1066MHz
Dual-channel memory architecture
Intel
H61 Express Chipset
®
Fintek F81866D-I
Realtek
8111F-VB-CG, 10/100/1000Base-TX
®
2 x RJ-45 ports
64Mb Flash ROM, UEFI AMI BIOS, PnP, DMI 2.0, SM BIOS, ACPI
2.0a
WOL by PME, PXE
Windows
XP 32-bit, Windows
®
Monitors CPU/system temperature
Monitors Vcore, 3.3V/5V/12V voltages
Monitors CPU/chassis fan speed
1 x PCI Express 2.0 x16 slot
1 x PCI Express 2.0 x1 slot
1 x PCI slot
1 x PCI Express Mini Card slot
Lithium battery
1 x 24-pin ATX connector
1 x 4-pin ATX 12V power connector
1 x CPU fan
1 x Chassis fan
9.6 in. x 9.6 in. (24.4 cm x 24.4 cm)
1.1 lb (0.5 Kg)
32
F~140
F (0
C~60
o
o
o
o
-40
F~176
F (-40
C~80
o
o
o
0%~90% relative humidity, non-condensing
Compliant with Eup/ErP
CE (include CE-LVD), FCC
(continued on the next page)
3rd/2nd Generation Core™ i7 / Core™ i5 /
®
processors
®
7 32/64-bit, Fedora 17
®
C)
C)
o
IMBM-H61A
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