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Quectel EG060K-GT Hardware Design

Quectel EG060K-GT Hardware Design

Lte-a module series
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EG060K-GT
Design
LTE-A Module Series
Version: 1.0.0
Date: 2022-08-18
Status: Preliminary
EG060K-GT_Hardware_Design
Hardware
1 / 83

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Summary of Contents for Quectel EG060K-GT

  • Page 1 EG060K-GT Hardware Design LTE-A Module Series Version: 1.0.0 Date: 2022-08-18 Status: Preliminary EG060K-GT_Hardware_Design 1 / 83...
  • Page 2 LTE-A Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...
  • Page 3 Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.
  • Page 4 Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for your failure to comply with these precautions.
  • Page 5 LTE-A Module Series About the Document Revision History Version Date Author Description Elliot CAO/ 2022-08-18 Lewis PENG/ Creation of the document Jacen HUANG Elliot CAO/ 1.0.0 2022-08-18 Nancy SHAO/ Preliminary Jacen HUANG EG060K-GT_Hardware_Design 4 / 83...
  • Page 6 LTE-A Module Series Contents Safety Information ............................3 About the Document ..........................4 Contents ..............................5 Table Index ..............................7 Figure Index ..............................9 Introduction ............................11 1.1. Special Marks ......................... 11 Product Overview ..........................14 2.1. Frequency Bands and Functions .................... 14 2.2.
  • Page 7 LTE-A Module Series 4.7. Indication Signals........................48 4.7.1. Network Status Indication ..................... 48 4.7.2. Module Status Indication ....................49 4.7.3. MAIN_RI ........................50 4.8. PCIe Interface ......................... 50 4.9. SDIO Interface* ........................52 4.10. Antenna Tuner Control Interfaces* ..................54 4.11.
  • Page 8 LTE-A Module Series Table Index Table 1: Special Marks ............................11 Table 2: Frequency Bands and Functions ......................14 Table 3: Key Features ............................15 Table 4: I/O Parameters Definition ........................19 Table 5: Pin Description ............................ 19 Table 6: Overview of Operating Modes ......................26 Table 7: Pin Description of W_DISABLE# ......................
  • Page 9 LTE-A Module Series Table 42: VDD_EXT I/O Requirements ......................65 Table 43: SDIO_VDD Low-voltage I/O Requirements ..................65 Table 44: SDIO_VDD High-voltage I/O Requirements ..................66 Table 45: VDD_USIM High/Low-voltage I/O Requirements ................66 Table 46: Electrostatic Discharge Characteristics (Temperature: 25 ° C, Humidity: 45 %) ....... 67 Table 47: Operating and Storage Temperatures ....................
  • Page 10 LTE-A Module Series Figure Index Figure 1: Functional Diagram ..........................17 Figure 2: Pin Assignment (Top View) ........................ 18 Figure 3: DRX Run Time and Power Consumption in Sleep Mode ..............27 Figure 4: Sleep Mode Application via UART Interfaces ..................27 Figure 5: Sleep Mode Application with USB Remote Wake-up ................
  • Page 11 LTE-A Module Series Figure 42: Module Bottom Dimensions (Bottom View, Unit: mm) ..............70 Figure 43: Recommended Footprint (Top View, Unit: mm) ................71 Figure 44: Top and Bottom Views ........................72 Figure 45: Reflow Soldering Thermal Profile ..................... 74 Figure 46: Carrier Tape Dimension Drawing .....................
  • Page 12 LTE-A Module Series Introduction This document defines EG060K-GT module and describes its air and hardware interfaces which connects to your applications. With this document, you can quickly understand the module’s interfaces, electrical and mechanical specifications, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module.
  • Page 13 LTE-A Module Series radiation, maximum antenna gain (including cable loss) must not exceed: radiation, maximum antenna gain FCC Max Antenna Gain（dBi） (including cable loss) must not exceed: Operating Band LTE B41 8.00 LTE B48 -1.00 This module must not transmit simultaneously with any other antenna or transmitter The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.
  • Page 14 LTE-A Module Series that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
  • Page 15 LTE-TDD networks. The module supports embedded operating systems such as Windows, Linux and Android. It also provides GNSS to meet specific application demands. 2.1. Frequency Bands and Functions Table 2: Frequency Bands and Functions Frequency Bands and Functions EG060K-GT LTE-TDD (with Rx-diversity) B41/B48 CA_41A-41A, , CA_41C, CA_48C GNSS GPS, GLONASS, BDS, Galileo With a compact profile of 37.0 mm ×...
  • Page 16 LTE-A Module Series 2.2. Key Features Table 3: Key Features Feature Details ⚫ Supply voltage range: 3.3–4.4 V Power Supply ⚫ Typical supply voltage: 3.8 V Transmitting Power Class 3 (23 dBm ± 2 dB)* ⚫ Supports 3GPP Rel-12 LTE-TDD ⚫...
  • Page 17 Protocol: NMEA 0183 ⚫ Data update rate: 1 Hz ⚫ Complies with 3GPP TS 27.007 and 3GPP TS 27.005 AT Commands ⚫ Quectel enhanced AT commands Two pins (NET_MODE and NET_STATUS) indicate network connectivity Network Indication status ⚫ ANT [0:1] ⚫...
  • Page 18 LTE-A Module Series ANT0 ANT_ GNSS ANT1 VBAT_RF Tx/ Rx Blocks NAND Transceiver LPDDR 2 SDRAM VBAT_BB Control QLINK VDD_EXT PMIC VDD_RF Control PWRKEY STATUS RESET_N SPI/BT_UART Baseband ADCs I2S_MCLK 38 . 4MHz eSIM ( optional ) USIMx2 PCIe UART SDIO 2.0/3.0 Figure 1: Functional Diagram...
  • Page 19 LTE-A Module Series 2.4. Pin Assignment VBAT_RF VBAT_RF VBAT_RF VBAT_RF VDD_P2 DBG_RXD DBG_TXD USIM2_CLK USIM2_RST USB_BOOT USIM2_DET USIM2_DATA OTG_PWR_EN SLEEP_IND USIM2_VDD COEX_TXD RFFE_DATA COEX_RXD NET_MODE RFFE_CLK WLAN_EN WAKEUP_IN PCM_DOUT W_DISABLE# PCM_CLK I2S_MCLK PCM_DIN PCM_SYNC VBAT_BB VBAT_BB MAIN_DTR MAIN_RI MAIN_TXD MAIN_DCD WAKE_ MAIN_RXD ON_WIRELESS...
  • Page 20 LTE-A Module Series NOTE Keep all RESERVED pins and unused pins unconnected. GND pins should be connected to ground in the design. 2.5. Pin Description Table 4: I/O Parameters Definition Type Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain...
  • Page 21 LTE-A Module Series Provide 2.85 V for Vnom = 2.7 V VDD_RF If unused, keep it open. external RF circuit. max = 120 mA 10, 13, 16, 17, 24, 30, 31, 35, 39, 44, 45, 54, 55, 63, 64, 69, 70, 75, 76, 81–84, 89, 90, 92–94, 96–100, 102–106, 108–112, 114–118, 120–126, 128–133, 141, 142, 148, 153, 154, 157, 158, 167, 174, 177, 178, 181, 184, 187, 191, 196, 202–208, 214–299 Turn On/Off...
  • Page 22 LTE-A Module Series Low-Voltage: Vmin = 1.95 V Vnom = 1.8 V Vmax = 1.65 V If USIM2 interface is USIM2_DATA USIM2 card data USIM2_VDD unused, keep it open. USIM2 card hot- If USIM2 interface is USIM2_DET USIM2_VDD plug detect unused, keep it open.
  • Page 23 LTE-A Module Series Vmax = 1.65 V SDIO_DATA0 SDIO data bit 0 SDIO_DATA1 SDIO data bit 1 SDIO_DATA2 SDIO data bit 2 If unused, keep them SDIO_VDD open. SDIO_DATA3 SDIO data bit 3 SDIO_CMD SDIO command SDIO_CLK SDIO clock SDIO_DET SD card detect VDD_EXT If unused, keep it open.
  • Page 24 LTE-A Module Series If unused, keep it open. SPI master output SPI_MOSI VDD_EXT It can be multiplexed slave input into BT_TXD*. If unused, keep it open. SPI_CLK SPI clock VDD_EXT It can be multiplexed into BT_CTS*. If unused, keep it open. SPI master input SPI_MISO VDD_EXT...
  • Page 25 LTE-A Module Series control LTE/WLAN COEX_TXD coexistence VDD_EXT transmit LTE/WLAN COEX_RXD coexistence VDD_EXT receive WLAN function Active high. WLAN_EN VDD_EXT enable control If unused, keep it open. Awaken the host WAKE_ON_ (the module) via Active low. VDD_EXT WIRELESS an external Wi-Fi If unused, keep it open.
  • Page 26 138, 139, 159, 161, 172, 176, 192–195, 197–201, 209– unconnected. 2.6. EVB Kit To help you develop applications with the module, Quectel supplies an evaluation board (UMTS & LTE EVB R2.0) with accessories to control or test the module. For more details, see document [1]. EG060K-GT_Hardware_Design...
  • Page 27 LTE-A Module Series Operating Characteristics 3.1. Operating Modes Table 6: Overview of Operating Modes Mode Details Software is active. The module has registered on the network, and Idle it is ready to send and receive data. Full Functionality Mode Network is connected. In this mode, the power consumption is Voice/Data decided by network setting and data transfer rate.
  • Page 28 LTE-A Module Series DRX OFF Run Time Figure 3: DRX Run Time and Power Consumption in Sleep Mode The following part of this chapter presents the power saving procedure and sleep mode of the module. 3.1.1.1. UART Application Scenario If the host communicates with the module via UART interfaces, meeting the following requirements will bring the module into sleep mode.
  • Page 29 LTE-A Module Series 3.1.1.2. USB Application Scenarios USB application can be applied with USB remote wake-up function or USB suspend/resume and MAIN_RI functions. ⚫ If the host supports USB suspend/resume and remote wake-up function, meeting the following three requirements will bring the module into sleep mode. Keep MAIN_DTR high (pulled up by default).
  • Page 30 LTE-A Module Series Module Host USB_VBUS USB Interface USB Interface MAIN_RI EINT Figure 6: Sleep Mode Application with MAIN_RI Sending data to the module through USB will awaken the module. When the module has a URC to report, MAIN_RI will wake up the host. ⚫...
  • Page 31 LTE-A Module Series 3.1.2. Airplane Mode The module provides W_DISABLE# to disable or enable airplane mode via hardware operation. W_DISABLE# is pulled up by default. Driving it low will bring the module into airplane mode. Table 7: Pin Description of W_DISABLE# Pin Name Pin No.
  • Page 32 LTE-A Module Series Table 9: Pin Description of VBAT and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit Power supply for the module’s RF part VBAT_RF 85–88 Power supply for the module’s VBAT_BB 155, 156 baseband part 10, 13, 16, 17, 24, 30, 31, 35, 39, 44, 45, 54, 55, 63, 64, 69, 70, 75, 76, 81–84, 89, 90, 92–94, 96–100, 102–106, 108–112, 114–118, 120–126, 128-133, 141, 142, 148, 153, 154, 157, 158, 167, 174, 177, 178, 181, 184, 187, 191, 196, 202–208, 214–299...
  • Page 33 LTE-A Module Series VBAT VBAT_BB 100 μF 100 nF 6.8 nF 220 pF 68 pF VBAT_RF Module 100 μF 100 nF 220 pF 68 pF 15 pF 9.1 pF 4.7 pF Figure 9: Star Topology of the Power Supply 3.2.2. Reference Design for Power Supply The power design for the module is vital as the performance of the module largely relies on the power source.
  • Page 34 LTE-A Module Series supply. 3.2.3. Power Supply Voltage Monitoring AT+CBC command can be used to monitor the VBAT_BB voltage value. See document [2] for details. 3.3. Turn On The module can be turned on via PWRKEY. Table 10: Pin Description of PWRKEY Pin Name Pin No.
  • Page 35 LTE-A Module Series PWRKEY Close to S1 Figure 12: Turn On With a Button The turn-on scenario is illustrated in the following figure. NOTE1 VBAT ≥ 500 ms ≥ 1.3 V ≤ 0.5 V PWRKEY RESET_N ≈9 s STATUS ≈10 s MAIN_ Inactive Active...
  • Page 36 LTE-A Module Series 3.4. Turn Off The module can be turned off normally via two methods: using PWRKEY or executing AT+QPOWD. 3.4.1. Turn Off with PWRKEY Driving PWRKEY low for at least 800 ms, the module will execute the power-down procedure after PWRKEY is released.
  • Page 37 LTE-A Module Series Table 11: Pin Description of RESET_N Pin Name Pin No. Description Comment Pulled up internally. RESET_N Reset the module Active low. The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver can control RESET_N. 250–600 ms RESET_N Reset pulse...
  • Page 38 LTE-A Module Series Application Interfaces 4.1. USIM Interfaces The module provides two USIM interfaces. The circuitry of USIM interfaces meets ETSI and IMT-2000 requirements. The interfaces support both 1.8 V and 3.0 V USIM cards and Dual USIM Single Standby function.
  • Page 39 LTE-A Module Series VDD_EXT USIM_VDD 100 nF USIM Card Connector USIM_VDD USIM_RST Module USIM_CLK USIM_DET USIM_DATA NM NM TVS array Figure 17: Reference Circuit of a USIM Interface with an 8-Pin USIM Card Connector If USIM card detection function is unnecessary, keep USIM_DET open. A reference circuit for a USIM interface with a 6-pin USIM card connector is illustrated in the following figure.
  • Page 40 LTE-A Module Series ⚫ Keep USIM card signals away from RF and VBAT traces. ⚫ Make sure the ground between the module and the USIM card connector is short and wide. Keep the trace width of ground and USIM_VDD not less than 0.5 mm to maintain the same electric potential. ⚫...
  • Page 41 LTE-A Module Series The USB interface is recommended to be reserved for firmware upgrade in your designs. The following figure shows a reference circuit of USB 2.0 and USB 3.0 interfaces. Test Points Minimize these stubs Host Module NM_0R NM_0R TVS Array USB_VBUS USB_DM...
  • Page 42 LTE-A Module Series possible. ⚫ Junction capacitance of the ESD protection components might influence USB data traces, so pay attention to the selection of the components. Typically, the stray capacitance should be less than 2.0 pF for USB 2.0, and less than 0.4 pF for USB 3.0. ⚫...
  • Page 43 LTE-A Module Series CTS: Connect to DTE’s CTS. CTS: DTE clear to send MAIN_CTS signal from DCE If unused, keep it open. RTS: DTE request to send RTS: Connect to DTE's RTS. MAIN_RTS signal to DCE If unused, keep it open. MAIN_RXD Main UART receive Main UART data carrier...
  • Page 44 LTE-A Module Series 4.3.4. UART Application The module provides 1.8 V UART interfaces. A level-shifting circuit should be used if the application is equipped with a 3.3 V UART interface. A voltage-level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. VDD_EXT VCCA VCCB...
  • Page 45 LTE-A Module Series 1. Transistor circuit solution is not suitable for applications with high baud rates over 460 kbps. 2. Please note that the module CTS is connected to the host CTS, and the module RTS is connected to the host RTS. 4.4.
  • Page 46 LTE-A Module Series 4.5. PCM and I2C Interfaces The module supports audio communication via PCM (Pulse Code Modulation) digital interface and I2C interfaces. Besides, the two interfaces can be applied to audio codec and SLIC designs. Table 19: Pin Description of PCM and I2C Interfaces Pin Name Pin No.
  • Page 47 LTE-A Module Series 125 μs PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN Figure 23: Primary Mode Timing 125 μs PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN Figure 24: Auxiliary Mode Timing The PCM clock and primary/auxiliary mode can be configured by AT+QDAI, and the default configuration is master mode using short frame synchronization format with 2048 kHz PCM_CLK and 8 kHz PCM_SYNC.
  • Page 48 LTE-A Module Series MICBIAS PCM_CLK BCLK PCM_SYNC LRCK PCM_DOUT PCM_DIN LOUTP I2C_SCL I2C_SDA LOUTN Module Codec 1.8 V Figure 25: Reference Circuit of PCM and I2C Application with Audio Codec NOTE The module works as a master device pertaining to I2C interface. 4.6.
  • Page 49 LTE-A Module Series Table 21: Characteristics of ADC Interfaces Parameter Min. Typ. Max. Unit ADC0 Voltage Range 1.875 ADC1 Voltage Range 1.875 ADC Resolution bits NOTE The input voltage of ADC should not exceed 1.875 V. It is prohibited to supply any voltage to ADC pins without VBAT. It is recommended to use a resistor divider circuit for ADC application.
  • Page 50 LTE-A Module Series Flicker quickly (125 ms High/125 ms Low) Data transfer ongoing A reference circuit is shown in the following figure. VBAT Module 2.2K 4.7K NET_MODE/ NET_STATUS Figure 26: Reference Circuit of the NET_MODE and NET_STATUS 4.7.2. Module Status Indication The STATUS pin is set as the module’s status indicator.
  • Page 51 LTE-A Module Series 4.7.3. MAIN_RI Execute AT+QCFG="risignaltype","physical" command to configure MAIN_RI behavior. No matter on which port a URC is presented, the URC will trigger the behavior of MAIN_RI. The behavior of MAIN_RI can be altered by executing AT+QCFG="urc/ri/ring" command. In addition, MAIN_RI behavior can be configured flexibly.
  • Page 52 LTE-A Module Series If unused, keep them open. PCIE_REFCLK_M PCIe reference clock (-) PCIE_TX_M PCIe transmit (-) PCIE_TX_P PCIe transmit (+) PCIE_RX_M PCIe receive (-) PCIE_RX_P PCIe receive (+) Input signal in master mode. PCIE_CLKREQ_N PCIe clock request If unused, keep it open. Output signal in master mode.
  • Page 53 LTE-A Module Series Module WLAN 100 nF PCIE_RX_P PCIE_TX_P 100 nF PCIE_RX_M PCIE_TX_M 100 nF PCIE_TX_P PCIE_RX_P 100 nF Wi-Fi PCIE_TX_M PCIE_RX_M Antenna PCIE_REFCLK_P PCIE_REFCLK_P PCIE_REFCLK_M PCIE_REFCLK_M VDD_EXT PCIE_RC_RST_N PCIE_RST_N PCIE_CLKREQ_N PCIE_CLKREQ_N PCIE_WAKE_N PCIE_WAKE_N Figure 28: PCIe Interface Reference Circuit (RC Mode) Table 27: PCIe Trace Length Inside the Module Pin No.
  • Page 54 LTE-A Module Series Table 28: Pin Description of SDIO Interface* Pin Name Pin No. Description Comment If a SD card is used, connect VDD_P2 to SDIO_VDD. If an eMMC* is used or the VDD_P2 Power input for SDIO interface SDIO interface* is unused, connect...
  • Page 55 LTE-A Module Series ⚫ The voltage of SD power supply ranges from 2.7 V to 3.6 V and a sufficient current up to 0.8 A should be provided. As the maximum output current of SDIO_VDD is 50 mA which can only work as SDIO pull-up resistors, the SD card needs an external power supply.
  • Page 56 LTE-A Module Series Table 30: Pin Description of USB_BOOT Interface Pin Name Pin No. Description Comment Force the module into emergency Active high. USB_BOOT download mode If unused, keep it open. The following figure shows a reference circuit of USB_BOOT. Module VDD_EXT Test point...
  • Page 57 LTE-A Module Series RF Specifications The module provides one main antenna interface, one diversity antenna interface, and one GNSS antenna interface. The impedance of antenna port is 50 Ω. 5.1. Cellular Network 5.1.1. Antenna Interface & Frequency Bands Table 31: Pin Description of the Main/Diversity Antenna Interfaces Pin Name Pin No.
  • Page 58 LTE-A Module Series 5.1.3. Rx Sensitivity Table 34: Dual-Antenna Conducted Rx Sensitivity Primary Diversity Frequency Bands SIMO (dBm) 3GPP (SIMO) (dBm) (dBm) LTE-TDD B41 (10 MHz) -94.3 dBm LTE-TDD B48 (10 MHz) -95 dBm 5.1.4. Reference Design A reference design of ANT0, ANT1, interfaces is shown as below. It requires a π-type matching circuit for better RF performance.
  • Page 59 LTE-A Module Series 5.2. GNSS 5.2.1. Antenna Interface & Frequency Bands The module includes a fully integrated global navigation satellite system solution that supports GPS, GLONASS, BDS, and Galileo. The module supports standard NMEA 0183 protocol, and outputs NMEA sentences at 1 Hz data update rate via USB interface by default. By default, the module GNSS engine is off.
  • Page 60 LTE-A Module Series XTRA enabled Autonomous Warm start @ open sky XTRA enabled Autonomous Hot start @ open sky XTRA enabled Autonomous Accuracy CEP-50 @ open sky NOTE Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously).
  • Page 61 LTE-A Module Series 5.3. RF Routing Guidelines For user’s PCB, the characteristic impedance of all RF traces should be 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, height from the reference ground to the signal layer (H), and the space between RF traces and grounds...
  • Page 62 LTE-A Module Series Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design: ⚫...
  • Page 63 LTE-A Module Series ⚫ Frequency range: 1559–1609 MHz ⚫ Polarization: RHCP or linear ⚫ VSWR: < 2 (Typ.) ⚫ GNSS Passive antenna gain: > 0 dBi ⚫ Active antenna noise figure: < 1.5 dB ⚫ Active antenna gain: > 0 dBi ⚫...
  • Page 64 LTE-A Module Series Figure 38: Specifications of Mated Plugs The following figure describes the space factor of mating plugs. Figure 39: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. EG060K-GT_Hardware_Design 63 / 83...
  • Page 65 LTE-A Module Series Electrical Characteristics and Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 39: Absolute Maximum Ratings Parameter Min. Max.
  • Page 66 LTE-A Module Series 6.3. Power Consumption Table 41: Power Consumption Description Conditions Typ. Unit OFF state Power down µA Sleep state TDD-LTE PF=64(USB disconnected) 12.43 TDD-LTE PF=64(USB2.0 connected) 18.91 Idle state LTE-TDD B41 CH41490 @ 22.48 dBm LTE-TDD B48 CH55340 @ 22.61 dBm LTE-TDD B41 CH41490 @ 22.48 dBm LTE data transfer (GNSS OFF)
  • Page 67 LTE-A Module Series Input high voltage 1.27 Input low voltage -0.3 0.58 Output high voltage Output low voltage 0.45 Table 44: SDIO_VDD High-voltage I/O Requirements Parameter Description Min. Max. Unit Input high voltage 0.625 × SDIO_VDD SDIO_VDD + 0.3 Input low voltage -0.3 0.25 ×...
  • Page 68 LTE-A Module Series Table 46: Electrostatic Discharge Characteristics (Temperature: 25 ° C, Humidity: 45 %) Tested Points Contact Discharge Air Discharge Unit VBAT, GND ± 5 ± 10 Antenna Interfaces ± 4 ± 8 Other Interfaces ± 0.5 ± 1 6.6.
  • Page 69 LTE-A Module Series processor, power amplifier, and power supply. ⚫ Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. ⚫ Follow the principles below when the heatsink is necessary: Do not place large size components in the area where the module is mounted on your PCB to reserve enough place for heatsink installation.
  • Page 70 LTE-A Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ± 0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Pin 1 Figure 41: Module Top and Side Dimensions (Top View) EG060K-GT_Hardware_Design 69 / 83...
  • Page 71 LTE-A Module Series Pin 1 Figure 42: Module Bottom Dimensions (Bottom View, Unit: mm) NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. EG060K-GT_Hardware_Design 70 / 83...
  • Page 72 LTE-A Module Series 7.2. Recommended Footprint Pin 1 Figure 43: Recommended Footprint (Top View, Unit: mm) NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. EG060K-GT_Hardware_Design 71 / 83...
  • Page 73 7.3. Top and Bottom Views Figure 44: Top and Bottom Views NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, see the module received from Quectel. EG060K-GT_Hardware_Design 72 / 83...
  • Page 74 LTE-A Module Series Storage, Manufacturing & Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 ± 5 ° C and the relative humidity should be 35–60 %.
  • Page 75 LTE-A Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3.
  • Page 76 2. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 3. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [4].
  • Page 77 LTE-A Module Series 8.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts injection tray packaging and details are as follow: 8.3.1.
  • Page 78 LTE-A Module Series 8.3.2. Plastic Reel Figure 47: Plastic Reel Dimension Drawing Table 50: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 56.5 8.3.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover them; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection.
  • Page 79 LTE-A Module Series Place the vacuum-packed plastic reel into a pizza box. Put 4 pizza boxes into 1 carton and seal it. One carton can pack 800 modules. Figure 48: Packaging Process EG060K-GT_Hardware_Design 78 / 83...
  • Page 80 LTE-A Module Series Appendix References Table 51: Related Documents Document Name [1] Quectel_UMTS&LTE_EVB_R2.0_User_Guide [2] Quectel_EG06xK&Ex120K&EM060K_Series_AT_Commands_Manual [3] Quectel_RF_Layout_Application_Note [4] Quectel_Module_Secondary_SMT_Application_Note Table 52: Term and Abbreviation Abbreviation Description Adaptive Multi-Rate AMR-WB Adaptive Multi-Rate Wideband Average Power Tracking BeiDou Navigation Satellite System bit(s) per second Carrier Aggregation CHAP Challenge-Handshake Authentication Protocol...
  • Page 81 LTE-A Module Series Downlink Discontinuous Reception Data Terminal Ready Discontinuous Transmission eMMC Embedded Multi Media Card Enhanced Full Rate Electrostatic Discharge Evaluation Board Full Rate File Transfer Protocol GLONASS Global Navigation Satellite System (Russia) GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellite System Global Positioning System Half Rate...
  • Page 82 LTE-A Module Series Medium Access Control MBIM Mobile Broadband Interface Model Multiple Chip Package Mobile Equipment MIMO Multiple Input Multiple Output Mobile Originated MOSFET Metal-Oxide-Semiconductor Field-Effect Transistor Mobile Station Mobile Terminated Machine to Machine NAND NON-AND(gate) NITZ Network Identity and Time Zone/Network Informed Time Zone Password Authentication Protocol Personal Computer Printed Circuit Board...
  • Page 83 LTE-A Module Series Radio Frequency RHCP Right Hand Circular Polarization Reset Receive SD Card Secure Digital Card SDRAM synchronous dynamic random-access memory SIMO Single Input Multiple Output SLIC Subscriber Line Interface Circuit Surface Mounted Devices Short Message Service Transmission Control Protocol Time Division Duplex Transmit User Datagram Protocol...
  • Page 84 LTE-A Module Series Minimum High-level Output Voltage Maximum Low-level Output Voltage Minimum Low-level Output Voltage VSWR Voltage Standing Wave Ratio WLAN Wireless Local Area Networks EG060K-GT_Hardware_Design 83 / 83...