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Step 3
Install the memory thermal pad on the top of the DRAM memory module.
Figure 30: Installing memory thermal pad
The memory thermal pad is used for memory cooling, and to ensure the
operating temperature of the memory module should not exceed to 60°C.
This helps to prevent damage of the memory module. The memory thermal
pad to be used is requires a certain thickness in order to make contact with the
memory thermal plate and to excellently disperse the heat.
Important:
1.
The customer/user should consider using the memory thermal pad and adding memory thermal
plate on their chassis design.
2.
The memory thermal plate material to be used should have an excellent thermal conductivity.
Avoid using plastic or rubber materials.
3.
The thickness of memory thermal pad should be based on customer's design. However, the
minimum value of thermal conductivity K (W/m.k) is 1.5 and the maximum of hardness is 5
(Shore A).
EPIA-P900 User Manual
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