The MI/O compact form factor SBC is a new-generation SBC design with a variety of
mechanical improvements. Here is the quick installation guide for our thermal design
and MIOe module installation.
4.1
Quick Installation Guide:
1.
There is a Heatsink / Cooler in the white box inside the package. Carefully
remove the release paper from the thermal pad before installation.
Remove Release Paper
PAD XR-Pe 13.9x13.9x1mm
2.
There are six screws and six studs inside the white box, please install the heat-
sink into place as per illustration below:
MIO-5251 User Manual
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