Package Thermal Specifications - Intel 80C186EB Manual

16-bit high-integration embedded processors
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80C186EB 80C188EB 80L186EB 80L188EB
PACKAGE THERMAL
SPECIFICATIONS
The 80C186EB 80L186EB is specified for operation
when T
(the case temperature) is within the range
C
of
40 C to
100 C (PLCC package) or
b
a
114 C (QFP package) T
a
any environment to determine whether the proces-
sor is within the specified operating range The case
temperature must be measured at the center of the
top surface
Table 10 Thermal Resistance (i
i
CA
i
CA
i
CA
22
40 C to
b
may be measured in
C
CA
Airflow Linear ft min (m sec)
0
200
(0) (1 01) (2 03) (3 04) (4 06) (5 07)
(PLCC)
30
24
(QFP)
58
47
(SQFP)
70
TBD
T
(the ambient temperature) can be calculated
A
from i
(thermal resistance from the case to ambi-
CA
ent) with the following equation
T
T
e
A
C
Typical values for i
at various airflows are given
CA
in Table 10 P (the maximum power consumption
specified in watts) is calculated by using the maxi-
mum ICC as tabulated in the DC specifications and
V
of 5 5V
CC
) at Various Airflows (in C Watt)
400
600
800
1000
21
19
17
16 5
43
40
38
36
TBD
TBD
TBD
TBD
P i
b
CA

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