HP ProLiant DL160 Gen9 Maintenance And Service Manual
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HP ProLiant DL160 Gen9 Maintenance And Service Manual

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HPE ProLiant DL160 Gen9 Server
Maintenance and Service Guide
Abstract
This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware
components and software. This guide is for an experienced service technician. Hewlett Packard Enterprise assumes that you are qualified
in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
Part Number: 775785-004
March 2016
Edition: 4

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Summary of Contents for HP ProLiant DL160 Gen9

  • Page 1 HPE ProLiant DL160 Gen9 Server Maintenance and Service Guide Abstract This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware components and software. This guide is for an experienced service technician. Hewlett Packard Enterprise assumes that you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
  • Page 2 © Copyright 2015, 2016 Hewlett Packard Enterprise Development LP The information contained herein is subject to change without notice. The only warranties for Hewlett Packard Enterprise products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty.

  • Page 3: Table Of Contents

    Contents Customer self repair..........................6 Parts only warranty service ............................6 Illustrated parts catalog ........................... 16 Mechanical components ............................16 System components ............................... 18 Removal and replacement procedures ....................24 Required tools ................................ 24 Safety considerations ............................. 24 Preventing electrostatic discharge....................... 24 Symbols on equipment ..........................
  • Page 4 Power input module and RPS backplane characteristics ................77 Hot-plug power input module........................77 Redundant power supply backplane ......................78 HP Trusted Platform Module ..........................80 Troubleshooting ............................81 Troubleshooting resources ............................. 81 Diagnostic tools ............................82 Product QuickSpecs ............................... 82 HPE iLO .................................
  • Page 5 Documentation feedback ........................114 Index ..............................115 Contents 5...

  • Page 6: Customer Self Repair

    Customer self repair Hewlett Packard Enterprise products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period Hewlett Packard Enterprise (or Hewlett Packard Enterprise service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, Hewlett Packard Enterprise will ship that part directly to you for replacement.
  • Page 7 • Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à Hewlett Packard Enterprise de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. • Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
  • Page 8 NOTA: alcuni componenti Hewlett Packard Enterprise non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, Hewlett Packard Enterprise richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.
  • Page 9 Support Center anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien von Hewlett Packard Enterprise, die mit einem CSR-Ersatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an Hewlett Packard Enterprise zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an Hewlett Packard Enterprise zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen.
  • Page 10 deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no enviara el componente defectuoso requerido, Hewlett Packard Enterprise podrá cobrarle por el de sustitución.
  • Page 11 Enterprise u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt Hewlett Packard Enterprise alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest Hewlett Packard Enterprise zelf welke koerier/transportonderneming hiervoor wordt gebruikt. Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van Hewlett Packard Enterprise.
  • Page 12 Para obter mais informações sobre o programa de reparo feito pelo cliente da Hewlett Packard Enterprise, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da Hewlett Packard Enterprise (http://www.hpe.com/support/selfrepair). Serviço de garantia apenas para peças A garantia limitada da Hewlett Packard Enterprise pode incluir um serviço de garantia apenas para peças.
  • Page 13 Customer self repair 13...
  • Page 14 Customer self repair 14...
  • Page 15 Customer self repair 15...

  • Page 16: Illustrated Parts Catalog

    Illustrated parts catalog Mechanical components Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts information, see the Hewlett Packard Enterprise PartSurfer website (http://www.hpe.com/info/partssurfer). Item Description Spare part number Customer self repair (on page 6) Access panel 779099-001 Mandatory...
  • Page 17 Obbligatorio—Parti per le quali il cliente è tenuto a effettuare autonomamente la riparazione. Se si richiede l'intervento di Hewlett Packard Enterprise per la sostituzione di queste parti, al cliente verranno addebitate le spese di viaggio e manodopera dell'operazione. Facoltativo—Parti per le quali la riparazione in autonomia da parte del cliente è facoltativa. Queste parti sono progettate per consentire anche la riparazione da parte del cliente.

  • Page 18: System Components

    System components Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts information, see the Hewlett Packard Enterprise PartSurfer website (http://www.hpe.com/info/partssurfer). Illustrated parts catalog 18...
  • Page 19 Item Description Spare part Customer self repair (on number page 6) System boards (include alcohol pad and thermal — — compound) a) System board for Intel Xeon E5-2600 v3 779094-001 Optional processors b) System board for Intel Xeon E5-2600 v3 and v4 848082-001 Optional processors...
  • Page 20 Spare part Customer self repair (on Item Description number page 6) d) 1.80 GHz Intel Xeon E5-2630L v4, 10C, 55 W* 835608-001 Optional e) 2.00 GHz Intel Xeon E5-2660 v4, 14C, 105 W 835605-001 Optional f) 2.10 GHz Intel Xeon E5-2620 v4, 8C, 85 W* 835601-001 Optional g) 2.10 GHz Intel Xeon E5-2683 v4, 16C, 120 W*†...
  • Page 21 Spare part Customer self repair (on Item Description number page 6) RPS backplane assemblies a) AC RPS backplane assembly 784636-001 Optional b) AC/240 V DC RPS backplane assembly* 830022-001 Optional HPE 550 W Power Supply (non-hot-plug) 766879-001 Optional Hot-plug power input modules a) HPE 800 W/900 W Gold AC Power Input Module 754376-001 Mandatory b) HPE 900 W AC/240 V DC Gold Power Input...
  • Page 22 remplacement de ces pièces par Hewlett Packard Enterprise dépendent du type de service de garantie désigné pour votre produit. Non—Certaines pièces Hewlett Packard Enterprise ne sont pas conçues pour être remplacées par le client. Afin de se conformer aux exigences de la garantie la garantie du client, Hewlett Packard Enterprise demande à un fournisseur de services agréé...
  • Page 23 Illustrated parts catalog 23...

  • Page 24: Removal And Replacement Procedures

    Removal and replacement procedures Required tools You need the following items for some procedures: • T-25 Torx screwdriver (for screws located inside the front panel quick-release levers) • T-10/T-15 Torx screwdriver • Flathead screwdriver (for replacing the system battery) • HPE Insight Diagnostics (on page 85) Safety considerations Before performing service procedures, review all the safety information.

  • Page 25: Server Warnings And Cautions

    This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists. WARNING: To reduce the risk of injury from a hot component, allow the surface to cool before touching. This symbol indicates that the component exceeds the recommended weight for one individual to handle safely.

  • Page 26: Preparation Procedures

    For more information about Telco rack solutions, see the RackSolutions website (http://www.racksolutions.com/hp). • Access the product rear panel (on page 29).

  • Page 27: Power Down The Server

    To access the front panel components, unlock and then remove the security bezel. Power down the server Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs. IMPORTANT: When the server is in standby mode, auxiliary power is still being provided to the system.
  • Page 28 WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is adequately stabilized before extending a component from the rack. WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release latches and sliding the server into the rack.

  • Page 29: Access The Product Rear Panel

    After performing the installation or maintenance procedure, slide the server back into the rack, and then press the server firmly into the rack to secure it in place. Do one of the following: In a server that uses thumbscrew rack ears, tighten the captive thumbscrews. In a server that uses quick-release latch rack ears, if necessary, tighten the shipping screws.

  • Page 30: Remove The Server From The Rack

    Open the cable management arm. The cable management arm can be right-mounted or left-mounted. Remove the server from the rack WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the equipment: • Observe local occupational health and safety requirements and guidelines for manual material handling.

  • Page 31: Non-Hot-Plug Drive Carrier

    Power down the server (on page 27). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 27). Remove the server from the rack (on page 30). Remove the access panel ("Access panel"...

  • Page 32: Non-Hot-Plug Drive

    CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: Power down the server (on page 27). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server.

  • Page 33: Hot-Plug Drive Blanks

    Remove the drive from the carrier. To replace the component, reverse the removal procedure. Hot-plug drive blanks CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: If installed, remove the security bezel ("Remove the security bezel...

  • Page 34: Hot-Plug Drive

    Hot-plug drive CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: Back up all server data on the drive. If installed, remove the security bezel ("Remove the security bezel (optional)"...

  • Page 35: Four-Bay Lff Non-Hot-Plug Drive Backplane

    If the access panel latch is locked, use a T-15 Torx screwdriver to unlock the latch. To replace the component, reverse the removal procedure. Four-bay LFF non-hot-plug drive backplane To remove the component: If installed, remove the security bezel ("Remove the security bezel (optional)"...

  • Page 36: Four-Bay Lff Hot-Plug Drive Backplane

    Remove the non-hot-plug drive backplane. To replace the component, reverse the removal procedure. Four-bay LFF hot-plug drive backplane To remove the component: If installed, remove the security bezel ("Remove the security bezel (optional)" on page 26). Power down the server (on page 27). Remove all power: Disconnect each power cord from the power source.

  • Page 37: Eight-Bay Sff Hot-Plug Drive Backplane

    Remove the hot-plug drive backplane. To replace the component, reverse the removal procedure. Eight-bay SFF hot-plug drive backplane To remove the component: If installed, remove the security bezel ("Remove the security bezel (optional)" on page 26). Power down the server (on page 27). Remove all power: Disconnect each power cord from the power source.

  • Page 38: Smart Storage Battery

    Remove the hot-plug drive backplane. To replace the component, reverse the removal procedure. Smart Storage Battery For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs). WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

  • Page 39: Smart Storage Battery Holder

    Remove the Smart Storage Battery ("Smart Storage Battery" on page 38). To replace the component, reverse the removal procedure. Smart Storage Battery holder WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.

  • Page 40: Fbwc Module

    Remove the Smart Storage Battery holder from the chassis. To replace the component, reverse the removal procedure. FBWC module WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up.

  • Page 41: M.2 Ssd Enablement Kit

    Disconnect the cache module backup power cable from the cache module. Remove the cache module. To replace the component, reverse the removal procedure. M.2 SSD enablement kit M.2 SSD enablement board WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them.
  • Page 42 Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 27). Remove the server from the rack (on page 30). Remove the access panel ("Access panel"...

  • Page 43: M.2 Ssd Module

    Slot 1 To replace the component, reverse the removal procedure. M.2 SSD module WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any system installation.

  • Page 44: Optical Drive

    Remove the SSD module. To replace the component, reverse the removal procedure. Optical drive WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any system installation.
  • Page 45 Disconnect the optical drive cable from the drive. Remove the optical drive: Four-bay LFF drive model Removal and replacement procedures 45...

  • Page 46: Fan And Fan Blank

    Eight-bay SFF drive model To replace the component, reverse the removal procedure. Fan and fan blank Fan population guidelines Configuration Fan bay Fan bay Fan bay Fan bay Fan bay Fan bay Fan bay Blank Blank Blank Blank One processor, non-redundant Blank Blank...

  • Page 47: Fan Blank

    Two processors, redundant • In a single-processor, nonredundant configuration, fans 4, 6, and 7 cool the server. To enable the redundant fan mode, install a new fan in the fan bay 5. • In a dual-processor, nonredundant configuration, fans 1, 2, 3, 5, 6, and 7 cool the server. To enable the redundant fan mode, install a new fan in the fan bay 4.

  • Page 48: Hot-Swap Fan

    Remove the fan blank. CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To replace the component, reverse the removal procedure. Hot-swap fan WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

  • Page 49: Dimms

    To replace the component, reverse the removal procedure. DIMMs Memory-processor compatibility information • Intel Xeon E5-2600 v3 processors are optimized for: Single-rank and dual-rank PC4-2133 (DDR4-2133) RDIMMs operating at up to 2133 MT/s Dual-rank and quad-rank PC4-2133 (DDR4-2133) LRDIMMs operating at up to 2133 MT/s •...

  • Page 50: Heatsink

    Remove the server from the rack (on page 30). Remove the access panel ("Access panel" on page 34). Open the DIMM slot latches. Remove the DIMM. To replace the component, reverse the removal procedure. Heatsink WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
  • Page 51 Remove the heatsink from the processor backplate. To replace the component: Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. Remove the thermal interface protective cover from the heatsink. Install the heatsink: Position the heatsink on the processor backplate.

  • Page 52: Processor

    Finish the installation by completely tightening the screws in the same sequence. Install the access panel. Do one of the following: Slide the server into the rack. Install the server into the rack. Connect each power cord to the server. Connect each power cord to the power source.
  • Page 53 IMPORTANT: Processor socket 1 must be populated at all times or the server does not function. In a multiprocessor configuration, to optimize system performance, Hewlett Packard Enterprise recommends balancing the total capacity of the DIMMs across the processors. To remove the component: Power down the server (on page 27).
  • Page 54 Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts.
  • Page 55 To replace the component: Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
  • Page 56 Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing.

  • Page 57: Expansion Board

    Finish the installation by completely tightening the screws in the same sequence. Install the access panel. Do one of the following: Slide the server into the rack. Install the server into the rack. Connect each power cord to the server. Connect each power cord to the power source.
  • Page 58 Remove the PCI riser cage (on page 30). Remove the expansion board. Slot 1 Slot 2 Removal and replacement procedures 58...

  • Page 59: Primary Pcie Riser Board

    Slot 3 To replace the component, reverse the removal procedure. Primary PCIe riser board WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any system installation.

  • Page 60: Secondary Pcie Riser Assembly

    Remove the PCI riser cage (on page 30). Remove any existing expansion board from the riser board ("Expansion board" on page 57). Remove the riser board from the cage. To replace the component, reverse the removal procedure. Secondary PCIe riser assembly CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all PCI slots have either an expansion slot cover or an expansion board installed.

  • Page 61: Flexiblelom Riser Board

    Do one of the following: Extend the server from the rack (on page 27). Remove the server from the rack (on page 30). Remove the access panel ("Access panel" on page 34). Disconnect all cables connected to existing expansion boards. Remove all expansion boards ("Expansion board"...
  • Page 62 Disconnect the FlexibleLOM sideband cable. Remove the FlexibleLOM riser cage. Removal and replacement procedures 62...

  • Page 63: System Battery

    Remove the FLexibleLOM adapter from the riser cage. Remove the FlexibleLOM riser board from the riser cage. To replace the component, reverse the removal procedure. System battery If the server no longer automatically displays the correct date and time, then replace the battery that provides power to the real-time clock.
  • Page 64 To remove the component: Power down the server (on page 27). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 27). Remove the server from the rack (on page 30).

  • Page 65: Dedicated Ilo Management Module

    IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, use BIOS/Platform Configuration (RBSU) in the UEFI System Utilities ("HPE UEFI System Utilities" on page 84) to reconfigure the system. To replace the component, reverse the removal procedure. For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider.
  • Page 66 CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any system installation. Improper grounding can cause electrostatic discharge. To remove the component: Power down the server (on page 27). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server.

  • Page 67: System Board

    Remove the front I/O module panel. Disconnect the front I/O module from the system board. Detach the ambient thermal sensor cable from its clip. Remove the screws and disconnect the front I/O module connectors from the front panel. To replace the component, reverse the removal procedure. System board WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them.
  • Page 68 CAUTION: To avoid ESD damage, when removing electrostatic-sensitive components from the failed system board, place the components on a static-dissipating work surface or inside separate antistatic bags. To remove the system board assembly: Power down the server (on page 27). Remove all power: Disconnect each power cord from the power source.
  • Page 69 Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts.
  • Page 70 Lift the system board out of the chassis. Remove the two DIMM guards from the system board. Removal and replacement procedures 70...
  • Page 71 To replace the system board assembly: Install the two DIMM guards removed from the system board on the system board replacement. Install the system board assembly. Removal and replacement procedures 71...
  • Page 72 Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. Remove the clear processor socket cover. Retain the processor socket cover for future use. Removal and replacement procedures 72...
  • Page 73 Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: Do not press down on the processor.
  • Page 74 Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. Install the processor socket cover on the failed system board. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing.
  • Page 75 Finish the installation by completely tightening the screws in the same sequence. Install the fans. Install all components removed from the failed system board. Connect all cables disconnected from the failed system board. Install the PCI riser cages. Install the access panel. Do one of the following: Slide the server into the rack.

  • Page 76: Hpe 550 W Power Supply (Non-Hot-Plug)

    HPE 550 W Power Supply (non-hot-plug) WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.

  • Page 77: Redundant Power Supply Components

    Remove the non-hot-plug power supply. To replace the component, reverse the removal procedure. Redundant power supply components Power input module and RPS backplane characteristics • HPE 800 W/900 W Gold AC Power Input Module (744689-B21) This module is compatible with the AC RPS backplane (745813-B21). The module wattage rating changes depending on whether one or two power input modules are installed in the server: —...

  • Page 78: Redundant Power Supply Backplane

    Release the power cord from the hook-and-loop strap. Disconnect the power cord from the power source. Remove the power input module. To replace the component, reverse the removal procedure. Redundant power supply backplane WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
  • Page 79 Release the power cord from the hook-and-loop strap. Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Remove all installed power input modules ("Hot-plug power input module" on page 77). Remove the server from the rack (on page 30). Place the server on a sturdy, level surface.

  • Page 80: Hp Trusted Platform Module

    Remove the RPS backplane. To replace the component, reverse the removal procedure. HP Trusted Platform Module The TPM is not a customer-removable part. CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data.

  • Page 81: Troubleshooting

    Troubleshooting Troubleshooting resources The HPE ProLiant Gen9 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: •...

  • Page 82: Diagnostic Tools

    Diagnostic tools Product QuickSpecs For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs). HPE iLO The iLO 4 subsystem is a standard component of ProLiant servers that simplifies initial server setup, server health monitoring, power and thermal optimization, and remote server administration.

  • Page 83: Hpe Proliant Pre-Boot Health Summary

    • Rich configuration history • Health and service alerts • Easy export and upload to Service and Support The Active Health System monitors and records changes in the server hardware and system configuration. The Active Health System assists in diagnosing problems and delivering rapid resolution if server failures occur.

  • Page 84: Integrated Management Log

    Integrated Management Log The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity. You can view recorded events in the IML in several ways, including the following: • From within HPE SIM •...

  • Page 85: Embedded Diagnostics Option

    • Upon the first system power-up • After defaults have been restored Default configuration settings are sufficient for typical server operations; however, you can modify configuration settings as needed. The system prompts you for access to the UEFI System Utilities each time the system is powered up.

  • Page 86: Hpe Insight Diagnostics Survey Functionality

    HPE Insight Diagnostics survey functionality HPE Insight Diagnostics (on page 85) provides survey functionality that gathers critical hardware and software information on ProLiant servers. This functionality supports operating systems that are supported by the server. For operating systems supported by the server, see the Hewlett Packard Enterprise website (http://www.hpe.com/info/supportos).

  • Page 87: External Usb Functionality

    • Enabled—If Enabled, USB 3.0 capable devices operate at USB 3.0 speeds at all times (including the pre-boot environment) when in UEFI Boot Mode. This mode should not be used with operating systems that do not support USB 3.0. If operating in Legacy Boot BIOS Mode, the USB 3.0 ports cannot function in the pre-boot environment and are not bootable.

  • Page 88: Component Identification

    Component identification Front panel components • Four-bay LFF drive model Item Description Optical drive (optional) Serial label pull tab The serial number/iLO information pull tab is double-sided. The top side shows the server serial number and the customer asset tag label. The reverse side shows the default iLO account information and QR code label.

  • Page 89: Front Panel Leds And Buttons

    Item Description Serial label pull tab The serial number/iLO information pull tab is double-sided. The top side shows the server serial number and the customer asset tag label. The reverse side shows the default iLO account information and QR code label. Use your mobile device to scan the QR code label to display the server mobile product page (http://www.hpe.com/qref/dl160gen9).
  • Page 90 • Eight-bay SFF drive model Item Description Status UID button/LED Solid blue = Activated Flashing blue: • 1 flash per second = Remote management or firmware upgrade in progress • 4 flashes per second = iLO manual reboot sequence initiated •...

  • Page 91: Front Panel Led Power Fault Codes

    Front panel LED power fault codes The following table provides a list of power fault codes, and the subsystems that are affected. Not all power faults are used by all servers. Subsystem Front panel LED behavior 1 flash System board 2 flashes Processor 3 flashes...

  • Page 92: Rear Panel Leds

    Rear panel LEDs Item Description Status UID LED Solid blue = Activated Flashing blue: • 1 flash per second = Remote management or firmware upgrade in progress • 4 flashes per second = iLO manual reboot sequence initiated • 8 flashes per second = iLO manual reboot sequence in progress Off = Deactivated NIC link LED...

  • Page 93: System Board Components

    System board components Item Description Primary PCIe riser board connectors* Dedicated iLO module connector microSD slot SATA 5 connector (for M.2 SSD 2) SATA 4 connector (for M.2 SSD 1 or optical drive) Internal USB 3.0 connector (for USB flash devices) 8SFF front USB 3.0 connector Mini-SAS connector 1 Mini-SAS connector 2...

  • Page 94: Dimm Slot Locations

    Item Description NMI header TPM connector Secondary PCIe riser board connectors* System maintenance switch FlexibleLOM sideband signal connector * For more information on the riser board slots supported by the onboard PCI riser connectors, see "PCIe riser board slot definitions (on page 92)." DIMM slot locations DIMM slots are numbered sequentially (1 through 8) for each processor.

  • Page 95: Nmi Functionality

    Position Default Function — Reserved — Reserved — Reserved To access the redundant ROM, set S1, S5, and S6 to On. When the system maintenance S6 switch is set to the On position, the system will erase all system configuration settings from both CMOS and NVRAM on the next reboot. CAUTION: Clearing CMOS and/or NVRAM deletes configuration information.

  • Page 96: Drive Numbering

    Drive numbering • Four-bay LFF drive model • Eight-bay SFF drive model Hot-plug drive LED definitions Item Status Definition Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update.

  • Page 97: Fan Locations

    The blue Locate LED is behind the release lever and is visible when illuminated. IMPORTANT: The Dynamic Smart Array B140i Controller is only available in UEFI Boot Mode. It cannot be enabled in Legacy BIOS Boot Mode. If the B140i controller is disabled, drives connected to the system board Mini-SAS connectors operate in AHCI or Legacy mode.

  • Page 98: Cabling

    Cabling Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, refer to the white paper on high-density deployment at the Hewlett Packard Enterprise website (http://www.hpe.com/info/servers). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.

  • Page 99: Four-Bay Lff Hot-Plug Drive Cabling

    Four-bay LFF hot-plug drive cabling • Four-bay LFF drive backplane connected to the system board Item Description Drive power cable Mini-SAS cable • Four-bay LFF drive backplane connected to a P440 controller in the low-profile expansion slot Item Description Drive power cable Mini-SAS cable Cabling 99...

  • Page 100: Eight-Bay Sff Hot-Plug Drive Cabling

    • Four-bay LFF drive backplane connected to a H240 adapter in the low-profile expansion slot Item Description Drive power cable Mini-SAS cable Eight-bay SFF hot-plug drive cabling • Eight-bay SFF drive backplane connected to the system board Item Description Drive power cable Mini-SAS cable Cabling 100...
  • Page 101 • Eight-bay SFF drive backplane connected to a P440 controller in the low-profile expansion slot Item Description Drive power cable Mini-SAS cable • Eight-bay SFF drive backplane connected to a H240 adapter in the low-profile expansion slot Item Description Drive power cable Mini-SAS cable Cabling 101...

  • Page 102: M.2 Ssd Cabling

    M.2 SSD cabling • Slot 1 cable routing • Slot 2 cable routing Cabling 102...

  • Page 103: Fbwc Cabling

    • Slot 3 cable routing FBWC cabling The FBWC solution is a separately purchased option. This server only supports FBWC module installation when a Smart Array P-Series controller is installed. Depending on the controller option installed, the actual storage controller connectors might look different from what is shown in this section.
  • Page 104 • FBWC module slot 2 cabling • FBWC module slot 3 cabling Cabling 104...

  • Page 105: Smart Storage Battery Cabling

    Smart Storage Battery cabling FlexibleLOM cabling Cabling 105...

  • Page 106: Power Supply Cabling

    Power supply cabling • HPE 550 W non-hot-plug power supply cabling Item Description 24-pin power supply cable 16-pin power supply sideband signal cable • HPE 800 W/900 W hot-plug power supply cabling Item Description 24-pin power supply cable 16-pin power supply sideband signal cable 10-pin RPS connector Cabling 106...

  • Page 107: Optical Drive Cabling

    • HPE AC/240 V DC RPS backplane Item Description 24-pin power supply cable 16-pin power supply sideband signal cable 10-pin RPS connector Optical drive cabling • Optical drive cabling in the four-bay LFF drive configuration Item Description Drive power cable Optical drive SATA and power cable Cabling 107...

  • Page 108: Front I/O Cabling

    • Optical drive cabling in the eight-bay SFF drive configuration Item Description Drive power cable Optical drive SATA and power cable Front I/O cabling • Front I/O cabling in LFF configuration Cabling 108...

  • Page 109: Front Usb 3.0 Cabling

    • Front I/O cabling in SFF configuration Front USB 3.0 cabling Cabling 109...

  • Page 110: Specifications

    Specifications Environmental specifications Specification Value — Temperature range* 10°C to 35°C (50°F to 95°F) Operating -30°C to 60°C (-22°F to 140°F) Nonoperating — Relative humidity (noncondensing) Minimum to be the higher (more moisture) of Operating -12°C (10.4°F) dew point or 8% relative humidity Maximum to be 24°C (75.2°F) dew point or 90% relative humidity...

  • Page 111: Power Supply Specifications

    Power supply specifications Depending on the installed options and/or the regional location where the server was purchased, the server is configured with one of the following power supplies: • HPE 550 W Power Supply (PN 730941-B21) • HPE 800 W/900 W Gold AC Power Input Module (PN 744689-B21) •...

  • Page 112: Acronyms And Abbreviations

    Acronyms and abbreviations ABEND abnormal end alternating current Advanced Memory Protection Customer Self Repair FBWC flash-backed write cache graphics processing unit host bus adapter HPE SIM HPE Systems Insight Manager HPE SSA HPE Smart Storage Administrator hertz Integrated Lights-Out Integrated Management Log large form factor Acronyms and abbreviations 112...
  • Page 113 nonmaskable interrupt NVRAM nonvolatile memory PCIe Peripheral Component Interconnect Express POST Power-On Self Test power supply unit RBSU ROM-Based Setup Utility serial attached SCSI SATA serial ATA Secure Digital small form factor Service Pack for ProLiant Trusted Platform Module UEFI Unified Extensible Firmware Interface unit identification universal serial bus...

  • Page 114: Documentation Feedback

    Documentation feedback Hewlett Packard Enterprise is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback (mailto:docsfeedback@hpe.com). When submitting your feedback, include the document title, part number, edition, and publication date located on the front cover of the document. For online help content, include the product name, product version, help edition, and publication date located on the legal notices page.
  • Page 115 111 dedicated iLO management module, removing 65 hot-swap fan 48 diagnostic tools 82, 84, 85, 87 HP Trusted Platform Module option 80 dimensions and weight 110 HPE Insight Diagnostics 85, 86 DIMM slot locations 94 HPE Insight Diagnostics survey functionality 85, 86...
  • Page 116 internal USB connector 86, 93 re-entering the server serial number 85 remote support and analysis tools 86 removal and replacement procedures 24 remove PCI riser cage 30 LEDs, drive 96 remove server from rack 30 LEDs, front panel 96 required tools 24 LEDs, power fault 91 requirements, airflow 25 legacy USB support 86...

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