HP ProLiant DL160 Gen9 Maintenance And Service Manual
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HP ProLiant DL160 Gen9 Maintenance And Service Manual

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HP ProLiant DL160 Gen9 Server
Maintenance and Service Guide
Abstract
This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware components and
software.
Part Number: 775785-001
September 2014
Edition: 1

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Summary of Contents for HP ProLiant DL160 Gen9

  • Page 1 HP ProLiant DL160 Gen9 Server Maintenance and Service Guide Abstract This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware components and software. Part Number: 775785-001 September 2014 Edition: 1...
  • Page 2 © Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

  • Page 3: Table Of Contents

    Four-bay LFF hot-plug drive backplane ......................31 Four-bay LFF non-hot-plug drive backplane ....................32 Eight-bay LFF hot-plug drive backplane ......................33 HP Smart Storage Battery ..........................34 FBWC module ............................35 Optical drive ............................. 36 Fan and fan blank ............................38 Fan population guidelines .........................
  • Page 4 Eight-bay SFF hot-plug drive cabling ....................83 FBWC cabling ............................85 HP Smart Storage Battery cabling ........................ 86 HP 550W Power Supply cabling (non-hot plug) .................... 87 Optical drive cabling ..........................87 Front I/O cabling ............................88 Front USB 3.0 cabling ..........................89 Specifications ..........................
  • Page 5 Acronyms and abbreviations ......................92 Documentation feedback ......................95 Index ............................96 Contents 5...

  • Page 6: Customer Self Repair

    HP specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective part back to HP within a defined period of time, normally five (5) business days. The defective part must be returned with the associated documentation in the provided shipping material.
  • Page 7 HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per la sostituzione.
  • Page 8 La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP. Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da utilizzare.
  • Page 9 Si, durante la fase de diagnóstico, HP (o los proveedores o socios de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se clasifican en dos categorías:...
  • Page 10 HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.
  • Page 11 Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
  • Page 12 No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. Customer self repair 12...
  • Page 13 Customer self repair 13...
  • Page 14 Customer self repair 14...
  • Page 15 Customer self repair 15...

  • Page 16: Illustrated Parts Catalog

    Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.
  • Page 17 Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.

  • Page 18: System Components

    System components HP continually improves and changes product parts. For complete and current supported parts information, see one of the following websites: • HP PartSurfer website (http://partsurfer.hp.com) Illustrated parts catalog 18...
  • Page 19 • HP PartSurfer mobile site (http://partsurfermobile.hp.com) Item Description Spare part Customer self number repair (on page 6) System board assembly (includes alcohol pad and thermal 779094-001 Mandatory compound) System Battery 234556-001 Optional Dedicated iLO management module 779095-001 Mandatory PCIe riser boards —...
  • Page 20 Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.
  • Page 21 Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
  • Page 22 Illustrated parts catalog 22...

  • Page 23: Removal And Replacement Procedures

    T-25 Torx screwdriver (for screws located inside the front panel quick-release levers) • T-10/T-15 Torx screwdriver • HP Insight Diagnostics (on page 68) Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts.

  • Page 24: Server Warnings And Cautions

    Get help to lift and stabilize the product during installation or removal, especially when the • product is not fastened to the rails. HP recommends that a minimum of two people are required for all rack server installations. A third person may be required to help align the server if the server is installed higher than chest level.

  • Page 25: Rack Warnings

    Extend the server from the rack (on page 28). If you are performing service procedures in an HP, Compaq branded, Telco, or third-party rack cabinet, you can use the locking feature of the rack rails to support the server and gain access to internal components.

  • Page 26: Power Down The Server

    Power down the server Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs. WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power.

  • Page 27: Non-Hot-Plug Drive

    Non-hot-plug drive CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: Back up all server data on the drive. Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source.

  • Page 28: Extend The Server From The Rack

    To replace the SFF drive blank, while pressing the release latch, slide the component into the bay until it is fully seated. Extend the server from the rack To extend the server from an HP, Compaq-branded, Telco, or third-party rack: Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source.

  • Page 29: Remove The Server From The Rack

    Get help to lift and stabilize the product during installation or removal, especially when the product is not fastened to the rails. HP recommends that a minimum of two people are required for all rack server installations. A third person may be required to help align the server if the server is installed higher than chest level.

  • Page 30: Hot-Plug Drive

    Disconnect each power cord from the power source. Disconnect each power cord from the server. Remove the drive carrier. To replace the component, slide the component into the bay until it clicks. Hot-plug drive CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

  • Page 31: Four-Bay Lff Hot-Plug Drive Backplane

    CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage. Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source.

  • Page 32: Four-Bay Lff Non-Hot-Plug Drive Backplane

    Remove all hot-plug hard drives. Disconnect all cables connected to the drive backplane. Remove the hot-plug drive backplane. To replace the component, reverse the removal procedure. Four-bay LFF non-hot-plug drive backplane To remove the component: Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source.

  • Page 33: Eight-Bay Lff Hot-Plug Drive Backplane

    Remove the non-hot-plug drive backplane. To replace the component, reverse the removal procedure. Eight-bay LFF hot-plug drive backplane To remove the component: Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server.

  • Page 34: Hp Smart Storage Battery

    HP Smart Storage Battery For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the HP website (http://www.hp.com/go/qs). CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up.

  • Page 35: Fbwc Module

    Remove the HP Smart Storage Battery. To replace the component, reverse the removal procedure. FBWC module WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

  • Page 36: Optical Drive

    Disconnect the cache module backup power cable from the cache module. Remove the cache module. To replace the component, reverse the removal procedure. Optical drive CAUTION: To prevent improper cooling and thermal damage, do not operate the chassis unless all bays are populated with a component or a blank. To remove the component: Power down the server (on page 26).
  • Page 37 Remove the server from the rack (on page 29). Remove the access panel ("Access panel" on page 30). Disconnect the optical drive cable from the drive. Remove the optical drive: Four-bay LFF drive model Removal and replacement procedures 37...

  • Page 38: Fan And Fan Blank

    Eight-bay SFF drive model To replace the component, reverse the removal procedure. Fan and fan blank Fan population guidelines Configuration Fan bay 1 Fan bay 2 Fan bay 3 Fan bay 4 Fan bay 5 Fan bay 6 Fan bay 7 Blank Blank Blank...

  • Page 39: Fan Blank

    Two processors, redundant • In a single-processor, nonredundant configuration, fans 4, 6, and 7 cool the server. To enable the redundant fan mode, install a new fan in the fan bay 5. • In a dual-processor, nonredundant configuration, fans 1, 2, 3, 5, 6, and 7 cool the server. To enable the redundant fan mode, install a new fan in the fan bay 4.

  • Page 40: Hot-Swap Fan

    Remove the fan blank. CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To replace the component, reverse the removal procedure. Hot-swap fan WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

  • Page 41: Dimms

    Disconnect the fan cable from the system board and remove the fan. To replace the component, reverse the removal procedure. DIMMs To remove the component: Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server.

  • Page 42: Heatsink

    Remove the DIMM. To replace the component, reverse the removal procedure. Heatsink WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. To remove the component: Power down the server (on page 26).
  • Page 43 Remove the heatsink from the processor backplate. To replace the component: Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. Remove the thermal interface protective cover from the heatsink. Install the heatsink: Position the heatsink on the processor backplate.

  • Page 44: Processor

    Finish the installation by completely tightening the screws in the same sequence. Install the access panel. Do one of the following: Slide the server into the rack. Install the server into the rack. Connect each power cord to the server. Connect each power cord to the power source.
  • Page 45 IMPORTANT: Processor socket 1 must be populated at all times or the server does not function. In a multiprocessor configuration, to optimize system performance, HP recommends balancing the total capacity of the DIMMs across the processors. To remove the component: Power down the server (on page 26).
  • Page 46 Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts. Remove the processor from the processor retaining bracket.
  • Page 47 Apply all the grease to the top of the processor in the following pattern to ensure even distribution. Install the heatsink: Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws. Finish the installation by completely tightening the screws in the same sequence. Install the access panel.

  • Page 48: Expansion Board

    Expansion board To remove the component: Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 28). Remove the server from the rack (on page 29).

  • Page 49: Primary Pcie Riser Board

    Slot 2 Slot 3 To replace the component, reverse the removal procedure. Primary PCIe riser board To remove the component: Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 28).

  • Page 50: Secondary Pcie Riser Board

    Remove the server from the rack (on page 29). Remove the access panel ("Access panel" on page 30). Disconnect all cables connected to existing expansion boards. Remove the PCI riser cage ("Primary PCIe riser board" on page 49). Remove any existing expansion board from the riser board. Remove the riser board from the cage.

  • Page 51: System Battery

    To remove the component: Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 28). Remove the server from the rack (on page 29).

  • Page 52: Dedicated Ilo Management Module

    Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, use BIOS/Platform Configuration (RBSU) in the UEFI System Utilities ("HP UEFI System Utilities" on page 65) to reconfigure the system. To replace the component, reverse the removal procedure.

  • Page 53: Front I/O Modules For Lff And Sff Drive Models

    Remove the primary PCI riser cage ("Primary PCIe riser board" on page 49). Remove the dedicated iLO management module. To replace the component, reverse the removal procedure. Front I/O modules for LFF and SFF drive models To remove the component: Power down the server (on page 26).
  • Page 54 — Remove the front I/O module from the chassis assembly. — Disconnect the front I/O module cables from the chassis assembly. Removal and replacement procedures 54...

  • Page 55: System Board

    ("Primary PCIe riser board" on page 49). Remove the dedicated iLO management module. Disconnect all cables connected to the system board. Remove the HP Smart Storage Battery ("HP Smart Storage Battery" on page 34). Remove all DIMMs ("DIMMs" on page 41).
  • Page 56 Remove the heatsink: Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws. Completely loosen all screws in the same sequence. Remove the heatsink from the processor backplate. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.
  • Page 57 Remove the processor from the processor retaining bracket. CAUTION: When returning a damaged system board to HP, always install all processor socket covers to prevent damage to the processor sockets and system board. Remove the system board: Remove the system board screws.
  • Page 58 To replace the system board assembly: Install the system board assembly. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. Removal and replacement procedures 58...
  • Page 59 Remove the clear processor socket cover. Retain the processor socket cover for future use. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
  • Page 60 CAUTION: Close and hold down the processor cover socket while closing the processor locking levers. The levers should close without resistance. Forcing the levers closed can damage the processor and socket, requiring system board replacement. Close the processor retaining bracket. When the processor is installed properly inside the processor retaining bracket, the processor retaining bracket clears the flange on the front of the socket.
  • Page 61 Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws. Finish the installation by completely tightening the screws in the same sequence. Install the fans. Install all components removed from the failed system board. Connect all cables disconnected from the failed system board.

  • Page 62: Hp 550-W Power Supply

    Press the Esc key to close the menu. Press the Esc key to exit RBSU. Press the F10 key to confirm exiting RBSU. The server automatically reboots. HP 550-W Power Supply WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

  • Page 63: Hp Trusted Platform Module

    If you suspect a TPM board failure, leave the TPM installed and remove the system board. Contact an HP authorized service provider for a replacement system board and TPM board.

  • Page 64: Troubleshooting

    • Simplified Chinese (http://www.hp.com/support/Gen9_TSG_zh_cn) The HP ProLiant Gen9 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages and information to assist with interpreting and resolving error messages on ProLiant servers and server blades. To view the guide, select a language: •...

  • Page 65: Diagnostic Tools

    Diagnostic tools HP UEFI System Utilities The HP UEFI System Utilities is embedded in the system ROM. The UEFI System Utilities enable you to perform a wide range of configuration activities, including: • Configuring system devices and installed options •...

  • Page 66: Flexible Boot Control

    OS installation if the defaults are restored. To avoid this issue, use the User Defined Defaults feature in UEFI System Utilities to override the factory default settings. For more information, see the HP UEFI System Utilities User Guide for HP ProLiant Gen9 Servers on the HP website (http://www.hp.com/go/ProLiantUEFI/docs).

  • Page 67: Embedded Uefi Shell

    Embedded UEFI shell The system BIOS in all HP ProLiant Gen9 servers includes an Embedded UEFI Shell in the ROM. The UEFI Shell environment provides an API, a command line prompt, and a set of CLIs that allow scripting, file manipulation, and system information.

  • Page 68: Hp Proliant Pre-Boot Health Summary

    When power is available to the server but the server is not powered on, iLO runs on auxiliary power and can take control of the server video adapter to display the HP ProLiant Pre-boot Health Summary. For additional information, see the HP iLO 4 User Guide on the HP website (http://www.hp.com/go/ilo) or the HP ProLiant Gen9 Troubleshooting Guide, Volume I: Troubleshooting.

  • Page 69: Active Health System

    HP Active Health System does not parse or change operating system data from third-party error event log activities, such as content created or passed through by the operating system. The data that is collected is managed according to the HP Data Privacy policy. For more information see the HP website (http://www.hp.com/go/privacy).

  • Page 70: Integrated Management Log

    OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB 2.0 devices through legacy USB support, which is enabled by default in the system ROM. USB 3.0 ports are not functional before the OS loads. The native OS provides USB 3.0 support through appropriate xHCI drivers.

  • Page 71: Component Identification

    Component identification Front panel components • Four-bay LFF drive model Item Description Optical drive (optional) Serial number pull tab* USB 2.0 connector LFF drives (8.89 cm, 3.5 in) *The serial number/iLO information pull tab is double-sided. The top side shows the server serial number and the customer asset tag label.

  • Page 72: Front Panel Leds And Buttons

    Front panel LEDs and buttons • Four-bay LFF drive model Item Description Status UID button/LED* Solid blue = Activated Flashing blue: • 1 Hz/cycle per sec = Remote management or firmware upgrade in progress • 4 Hz/cycle per sec = iLO manual reboot sequence initiated •...

  • Page 73: Power Fault Leds

    • Eight-bay SFF drive model Item Description Status Health LED* Solid green = Normal Flashing green (1 Hz/cycle per sec) = iLO is rebooting. Flashing amber = System degraded** Flashing red (1 Hz/cycle per sec) = System critical** Power On/Standby button Solid green = System on and system power LED* Flashing green (1 Hz/cycle per sec) = Performing power on sequence...

  • Page 74: Rear Panel Components

    3 flashes Memory 4 flashes Riser board PCIe slots 5 flashes FlexibleLOM 6 flashes Removable HP Flexible Smart Array controller/Smart SAS HBA controller 7 flashes System board PCIe slots 8 flashes Power backplane or storage backplane 9 flashes Power supply...

  • Page 75: Rear Panel Leds

    Rear panel LEDs Item Description Status UID LED Solid blue = Activated Flashing blue: • 1 Hz/cycle per sec = Remote management or firmware upgrade in progress • 4 Hz/cycle per sec = iLO manual reboot sequence initiated • 8 Hz/cycle per sec = iLO manual reboot sequence in progress Off = Deactivated NIC link LED...

  • Page 76: System Board Components

    Fan connector 4 Fan connector 3 Fan connector 2 Fan connector 1 Reserved 24-pin power supply connector HP Smart Storage Battery connector Power supply sideband signal connector 20-pin drive power connector 10-pin RPS connector System battery NMI header TPM connector...

  • Page 77: Dimm Slot Locations

    Item Description System maintenance switch FlexibleLOM sideband signal connector * For more information on the riser board slots supported by the onboard PCI riser connectors, see "PCIe riser board slot definitions (on page 75)." DIMM slot locations DIMM slots are numbered sequentially (1 through 8) for each processor. The supported AMP modes use the letter assignments for population guidelines.

  • Page 78: Nmi Functionality

    • Use the iLO Virtual NMI feature. • Short the NMI header ("System board components" on page 76). For more information, see the HP website (http://www.hp.com/support/NMI). Drive numbering • Four-bay LFF drive model • Eight-bay SFF drive model Component identification 78...

  • Page 79: Hp Smartdrive Led Definitions

    HP SmartDrive LED definitions HP SmartDrives are the latest HP drive technology, and they are supported beginning with ProLiant Gen8 servers and server blades. The HP SmartDrive is not supported on earlier generation servers and server blades. Identify an HP SmartDrive by its carrier, shown in the following illustration.

  • Page 80: Fan Locations

    Fan locations Component identification 80...

  • Page 81: Cabling

    For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website (http://www.hp.com/products/servers/platforms). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.

  • Page 82: Four-Bay Lff Hot-Plug Drive Cabling

    Four-bay LFF hot-plug drive cabling • Four-bay LFF drive cage connected to the system board Item Description Drive power cable Mini-SAS cable • Four-bay LFF drive cage connected to a P440 controller in the low-profile expansion slot Item Description Drive power cable Mini-SAS cable Cabling 82...

  • Page 83: Eight-Bay Sff Hot-Plug Drive Cabling

    • Four-bay LFF drive cage connected to a H240 adapter in the low-profile expansion slot Item Description Drive power cable Mini-SAS cable Eight-bay SFF hot-plug drive cabling • Eight-bay SFF drive cage connected to the system board Item Description Drive power cable Mini-SAS cable Cabling 83...
  • Page 84 • Eight-bay SFF drive cage connected to a P440 controller in the low-profile expansion slot Item Description Drive power cable Mini-SAS cable • Eight-bay SFF drive cage connected to a H240 adapter in the low-profile expansion slot Item Description Drive power cable Mini-SAS cable Cabling 84...

  • Page 85: Fbwc Cabling

    FBWC cabling The FBWC solution is a separately purchased option. This server only supports FBWC module installation when an HP Smart Array P-Series controller is installed. Depending on the controller option installed, the actual storage controller connectors might look different from what is shown in this section.

  • Page 86: Hp Smart Storage Battery Cabling

    • FBWC module slot 3 cabling HP Smart Storage Battery cabling Cabling 86...

  • Page 87: Hp 550W Power Supply Cabling (Non-Hot Plug)

    HP 550W Power Supply cabling (non-hot plug) Item Description 24-pin power supply cable 16-pin power supply sideband signal cable Optical drive cabling • Optical drive cabling in the four-bay LFF drive configuration Item Description Drive power cable Optical drive cable...

  • Page 88: Front I/O Cabling

    • Optical drive cabling in the eight-bay SFF drive configuration Item Description Drive power cable Optical drive cable Front I/O cabling • Front I/O cabling in LFF configuration Cabling 88...

  • Page 89: Front Usb 3.0 Cabling

    • Front I/O cabling in SFF configuration Front USB 3.0 cabling Cabling 89...

  • Page 90: Specifications

    40°C to 45°C (104°F to 113°F) at sea level with an altitude derating of 1.0°C per every 125 m (1.8°F per every 410 ft) above 900 m (2953 ft) to a maximum of 3048 m (10,000 ft). The approved hardware configurations for this system are listed on the HP website (http://www.hp.com/servers/ASHRAE).

  • Page 91: Power Supply Specifications

    Power supply specifications The server supports the HP 550-W Power Supply (PN 730941-B21). This is an Entry Level Power Supply product for HP ProLiant servers. For more information about the power supply features, specifications, and compatibility, see the HP website (http://www.hp.com/go/proliant/powersupply).

  • Page 92: Acronyms And Abbreviations

    ABEND abnormal end alternating current Advanced Memory Protection Customer Self Repair FBWC flash-backed write cache graphics processing unit host bus adapter HP SIM HP Systems Insight Manager hertz Integrated Lights-Out Integrated Management Log large form factor Acronyms and abbreviations 92...
  • Page 93 Power-On Self Test power supply unit RBSU ROM-Based Setup Utility serial attached SCSI SATA serial ATA Secure Digital small form factor HP Service Pack for ProLiant Trusted Platform Module UEFI Unified Extensible Firmware Interface unit identification Acronyms and abbreviations 93...
  • Page 94 universal serial bus Acronyms and abbreviations 94...

  • Page 95: Documentation Feedback

    Documentation feedback HP is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback (mailto:docsfeedback@hp.com). Include the document title and part number, version number, or the URL when submitting your feedback.
  • Page 96 HP Insight Diagnostics survey functionality 68 customer self repair (CSR) 6 HP Smart Storage Battery 34 HP Smart Storage Battery cabling 86 HP Systems Insight Manager (SIM) 68, 70 HP technical support 6 dedicated iLO management module 52 humidity 90...
  • Page 97 LEDs, power supply 73 removing server from rack 29 LEDs, unit identification (UID) 72 required tools 23 legacy USB support 70 requirements, environmental 90 riser board 49, 75 ROM-Based Setup Utility (RBSU) 65 management tools 65 mechanical components 16 mechanical specifications 90 safety considerations 23 memory dump 78 security bezel, removing 26...

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