SCHEMATIC DIAGRAMS
MICRO COMPONENT MD SYSTEM
UX-QD70S,UX-QD70W
(SP-UXK30S)
(SP-UXK30W)
Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade)
Contents
Block diagrams
Standard schematic diagrams
Printed circuit boards
CD-ROM No.SML200512
(CA-UXQD70S)
(CA-UXQD70W)
COPYRIGHT
2005 Victor Company of Japan, Limited.
Area suffix
UB ---------------------- Hong Kong
(SP-UXK30S)
(SP-UXK30W)
2-1
2-2
2-11 to 15
No.MB496SCH
2005/12