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•
Low Order Path Tandem Connection Monitoring (according to Option 2 TC described in Recc.
ITU–T G.707)
–
Low Order Path Tandem Connection Monitoring (LTCM): SnDm_TT_Sk
•
N2[1–2]: VC–12 BIP–2 extraction and EDC calculation.
•
N2[8][73]: RDI extraction.
•
N2[5]: REI extraction.
•
N2[7][74]: ODI extraction (Outgoing Defect Indication).
•
N2[6]: OEI extraction (Outgoing Error Indication)
•
N2[7–8]: extraction from the multiframed channel N2[7–8] of:
•
N2[4]: AIS detection
b )
High Order Path layer:
•
Low Order Path layer to High Order Path layer Adaptation (HPA): Sn/Sm_A_So
•
VC–4 assembly.
•
TU pointer generator.
•
TU–AIS generator.
•
C2:
•
H4:
•
High Order Path layer Trail Termination Function (HPT): Sn_TT_So
•
J1:
•
G1:
•
B3:
•
High Order Path Overhead Monitoring Function
–
High Order Path Overhead Trail Termination (HPOM): Snm_TT_Sk
•
J1:
•
G1[1–4]: The REI information is recovered.
•
G1[5]:
•
C2:
•
B3:
•
AIS or SSF detection ––> SSF alarm
ED
02
FAS (Frame Alignment Signal) in frames 1 to 8.
trace identifier in frames 9 to 72.
TC RDI and ODI in frames 73 to 76.
Signal label insertion.
Multiframe indicator
path trace identifier is inserted.
insertion of RDI[5] and/or REI[1–4] information.
VC–4 Bip–8 calculation and insertion.
Path Trace information is recovered.
Path Status monitoring ––> HP–RDI detection.
Signal Label Monitoring ––> UNEQ and VC–AIS detection.
VC–4 BIP–8 Errored Block Count.
3AL 91669 AA AA
674
213
/
674
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