4
Mechanical Specifications
This chapter provides the mechanical specifications of the Itanium 2 processor.
4.1
Mechanical Dimensions
The Itanium 2 processor package is comprised of an interposer, a processor package substrate, and
an integrated heat spreader (IHS), as illustrated in
socket and the power pod and contains 611 pins which are positioned in a 25 x 28 grid. The IHS,
which is mounted on the top surface of the processor package substrate, efficiently transfers the
heat generated by the die to its surface.
Figure 4-1. Itanium
Figure 4-2
Figure 4-3
and are not to scale.
Datasheet
®
2 Processor Package
Processor
Package
Substrate
(OLGA)
Interposer
contains mechanical drawings and dimensions for the Itanium 2 processor package.
contains mechanical drawing for the power tab. All dimensions are measured in mm
Figure
4-1. The interposer interfaces with the
IHS
001160e
69