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Related Manuals for Intel QX9770 - Core 2 Extreme Quad-Core Processor
Summary of Contents for Intel QX9770 - Core 2 Extreme Quad-Core Processor
- Page 1 ® QX6800 and Intel Core™2 Δ Extreme Processor QX9770 Thermal and Mechanical Design Guidelines ® Δ — For the Intel Core™2 Extreme Processor QX6800 ® Stepping and the Intel Core™2 Extreme Processor Δ QX9770 C0 Stepping March 2008 Document Number: 316854-002...
- Page 2 Intel provides this information for customer’s convenience only. Use at your own risk. Intel accepts no liability for results if customer chooses at its discretion to implement these methods within its business operations. Intel makes no representations or warranties regarding the accuracy or completeness of the information provided.
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Page 3: Table Of Contents
Contents Introduction .....................9 Document Goals and Scope ..............9 1.1.1 Importance of Thermal Management ..........9 1.1.2 Document Goals................9 1.1.3 Document Scope ..............10 References ..................11 Definition of Terms ................11 Processor Thermal/Mechanical Information ............13 Mechanical Requirements ..............13 2.1.1 Processor Package..............13 2.1.2 Heatsink Attach ..............15 2.1.2.1 General Guidelines ............15 2.1.2.2... - Page 4 Reliability Test Results..........50 5.2.4 Recommended BIOS/CPU/Memory Test Procedures ......51 Material and Recycling Requirements ............52 Safety Requirements ................52 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design ..52 Reference Attach Mechanism..............54 Socket and Voltage Regulation Cooling Strategy ........55 ® ® Intel Quiet System Technology (Intel QST) .............57...
- Page 5 Combining Thermistor and Digital Thermal sensor Control ......103 Interaction of Thermal Profile and T ..........103 CONTROL Appendix F BTX System Thermal Considerations..............109 Appendix G Mechanical Drawings ..................113 Appendix H Intel Enabled Reference Solution Information............ 123 Thermal and Mechanical Design Guidelines...
- Page 6 Figure 14. Thermal Resistance Curve for Liquid Loss of Reservoir ......49 Figure 15. Reservoir Location................50 ® Figure 16. Intel ALCT Reference Design Major Components .........53 Figure 17. Heat Exchanger Fan Combination Foot Print View .........53 Figure 18. Structure to Motherboard Interface.............54 Figure 19.
- Page 7 Table 13. ATX FSC Settings ................106 Table 14. BTX Fan Speed Control Settings ............106 Table 15. Intel Representative Contact for Licensing Information ......123 Table 16. Intel Reference Component ATX Thermal Solution Providers ....123 Thermal and Mechanical Design Guidelines...
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Page 8: Revision History
LGA775 Socket Heatsink Loading Revision History Revision Description Revision Date Number -001 • Initial release April 2007 ® -002 • Added Intel Core™2 Extreme processor QX9770 C0 Stepping March 2008 • Edits throughout § Thermal and Mechanical Design Guidelines... -
Page 9: Introduction
Core™2 Extreme processor QX9770 C0 Stepping. The concepts given in this document are applicable to any system form factor. Specific examples used will be the Intel enabled reference solution for ATX/uATX systems. See the applicable BTX form factor reference documents to design a thermal solution for that form factor. -
Page 10: Document Scope
Chapter 4 addresses the benefits of the processor’s integrated thermal management logic for thermal design. Chapter 5 gives information on the Intel reference thermal solution called ALCT (Intel Advanced Liquid Cooling Technology) for the processor. Chapter 6 discusses the ®... -
Page 11: References
Material and concepts available in the following documents may be beneficial when reading this document. Document Location ® ® http://w.ww.intel.com/design/pro Intel Core™2 Extreme Processor QX9000 Series and Intel cessor/datashts/318726.htm Core™2 Quad Processor Q9000 Series Datasheet Δ ® http://developer.intel.com/design Intel Core™2 Extreme Quad-Core Processor QX6000 Δ... - Page 12 LGA775 Socket Heatsink Loading Term Description Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink. The maximum power dissipated by a semiconductor component.
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Page 13: Processor Thermal/Mechanical Information
Processor Thermal/Mechanical Information Processor Thermal/Mechanical Information Mechanical Requirements 2.1.1 Processor Package The processors covered in the document are packaged in a 775-Land LGA package that interfaces with the motherboard via a LGA775 socket. Refer to the datasheet for detailed mechanical specifications. The processor connects to the motherboard through a land grid array (LGA) surface mount socket. - Page 14 LGA775 Socket Heatsink Loading The primary function of the IHS is to transfer the non-uniform heat distribution from the die to the top of the IHS, out of which the heat flux is more uniform and spread over a larger surface area (not the entire IHS area). This allows more efficient heat transfer out of the package to an attached cooling device.
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Page 15: Heatsink Attach
The attach mechanism for the pump assembly developed to support the processor should create a static preload on the package between 18 lbf and 70 lbf throughout the life of the product for designs compliant with the Intel reference design assumptions: •... -
Page 16: Additional Guidelines
LGA775 Socket Heatsink Loading 2.1.2.3 Additional Guidelines In addition to the general guidelines given above, the heatsink attach mechanism for the processor should be designed to the following guidelines: • Holds the heatsink in place under mechanical shock and vibration events and applies force to the heatsink base to maintain desired pressure on the thermal interface material. -
Page 17: Thermal Profile
35 ºC + 0.5 ºC = 35.5 ºC. The slope of the thermal profile was established to be the same as the Intel liquid cooling solution thermal solution performance. This performance is expressed as the slope on the thermal profile and can be thought of as the thermal resistance of the heatsink attached to the processor, Ψ... -
Page 18: Control
0 via the digital thermometer. As a result the value will always be a negative number. See Chapter 4 for the discussion CONTROL ® the thermal management logic and features and Chapter 6 on Intel Quiet System ® Technology (Intel QST). -
Page 19: Heatsink Design Considerations
This is achieved in part by using the Ψ vs. RPM and RPM vs. Acoustics (dBA) performance curves from the Intel enabled thermal solution. A thermal solution designed to meet the thermal profile would be expected to provide similar acoustic performance of different parts with potentially different T values. -
Page 20: Heatsink Size
The package IHS flatness for the product is specified in the datasheet and can be used as a baseline to predict heatsink performance during the design phase. Intel recommends testing and validating heatsink performance in full mechanical enabling configuration to capture any impact of IHS flatness change due to combined socket and heatsink loading. -
Page 21: Thermal Interface Material
System Thermal Solution Considerations 2.4.1 Chassis Thermal Design Capabilities The Intel liquid cooling thermal solution assumes that chassis delivers a maximum T at the inlet of the processor heat exchanger (refer to Section 5.1.1). Table 1 shows the T requirements for the ALCT and the similar BTX solutions. -
Page 22: Summary
Of particular interest for package and heatsink installation and removal is the System Assembly module. A video covering system integration is also available. Contact your Intel field sales representative for further information. Thermal and Mechanical Design Guidelines... -
Page 23: Thermal Metrology
Thermal Metrology Thermal Metrology This section discusses guidelines for testing thermal solutions, including measuring processor temperatures. In all cases, the thermal engineer must measure power dissipation and temperature to validate a thermal solution. To define the performance of a thermal solution the “thermal characterization parameter”, Ψ (“psi”) will be used. Characterizing Cooling Performance Requirements The idea of a “thermal characterization parameter”, Ψ... -
Page 24: Figure 4. Processor Thermal Characterization Parameter Relationships
LGA775 Socket Heatsink Loading The case-to-local ambient thermal characterization parameter of the processor, Ψ , is comprised of Ψ , the thermal interface material thermal characterization parameter, and of Ψ , the sink-to-local ambient thermal characterization parameter: Ψ = Ψ + Ψ... -
Page 25: Example
The following provides an illustration of how one might determine the appropriate performance targets. The example power and temperature numbers used here are not related to any specific Intel processor thermal specifications, and are for illustrative purposes only. Assume the TDP, as listed in the datasheet, is 100W and the maximum case temperature from the thermal profile for 100W is 67 °C. -
Page 26: Processor Thermal Solution Performance Assessment
Assessment Thermal performance of a heatsink should be assessed using a thermal test vehicle (TTV) provided by Intel. The TTV is a stable heat source that the user can make accurate power measurement, whereas processors can introduce additional factors that can impact test results. In particular, the power level from actual processors varies significantly, even when running the maximum power application provided by Intel, due to variances in the manufacturing process. -
Page 27: Figure 5. Locations For Measuring Local Ambient Temperature, Active Heatsink
Thermal Metrology heatsink. If a barrier is used, the thermocouple can be taped directly to the barrier with a clear tape at the horizontal location as previously described, half way between the fan hub and the fan housing. If a variable speed fan is used, it may be useful to add a thermocouple taped to the barrier above the location of the temperature sensor used by the fan to check its speed setting against air temperature. -
Page 28: Figure 6. Locations For Measuring Local Ambient Temperature, Liquid-Cooling Heat
LGA775 Socket Heatsink Loading Figure 6. Locations for Measuring Local Ambient Temperature, Liquid-Cooling Heat Exchanger Front View Side View Airflow Heat Exchanger Fan Hub Spokes Measure T indicated between the hub spokes at mid- blade length NOTE: Drawing Not to Scale Figure 7. -
Page 29: Processor Case Temperature Measurement Guidelines
Thermal Metrology Processor Case Temperature Measurement Guidelines To ensure functionality and reliability, the processor is specified for proper operation when T is maintained at or below the thermal profile as listed in the datasheet. The measurement location for T is the geometric center of the IHS. Figure 2 shows the location for T measurement. - Page 30 LGA775 Socket Heatsink Loading Thermal and Mechanical Design Guidelines...
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Page 31: Thermal Management Logic And Thermal Monitor Feature
In the absence of power saving technologies, ever increasing frequencies will result in processors with power dissipations in the hundreds of watts. Fortunately, there are numerous ways to reduce the power consumption of a processor, and Intel is aggressively pursuing low power design techniques. For example, decreasing the operating voltage, reducing unnecessary transistor activity, and using more power efficient circuits can significantly reduce processor power consumption. -
Page 32: Prochot# Signal
LGA775 Socket Heatsink Loading 4.2.1 PROCHOT# Signal The primary function of the PROCHOT# signal is to provide an external indication that the processor has exceeded its maximum operating temperature. While PROCHOT# is asserted, the TCC will be active. Assertion of the PROCHOT# signal is independent of any register settings within the processor. -
Page 33: Thermal Monitor 2
Thermal Management Logic and Thermal Monitor Feature Figure 8. Concept for Clocks under Thermal Monitor Control PROCHOT# Normal clock Internal clock Duty cycle control Resultant internal clock 4.2.3 Thermal Monitor 2 The processor supports an enhanced Thermal Control Circuit. In conjunction with the existing Thermal Monitor logic, this capability is known as Thermal Monitor 2. -
Page 34: Operation And Configuration
LGA775 Socket Heatsink Loading Once the processor has sufficiently cooled, and a minimum activation time has expired, the operating frequency and voltage transition back to the normal system operating point. Transition of the VID code will occur first, in order to insure proper operation once the processor reaches its normal operating frequency. -
Page 35: On-Demand Mode
4.2.6 System Considerations Intel requires the Thermal Monitor and Thermal Control Circuit to be enabled for all processors. The thermal control circuit is intended to protect against short term thermal excursions that exceed the capability of a well designed processor thermal solution. -
Page 36: Operating System And Application Software Considerations
LGA775 Socket Heatsink Loading activation of the thermal control circuit. This data is used to derive the TDP targets published in the processor datasheet. A system designed to meet the thermal profile at TDP and T values published in C-MAX the processor datasheet greatly reduces the probability of real applications causing the thermal control circuit to activate under normal operating conditions. -
Page 37: Digital Thermal Sensor
Thermal Management Logic and Thermal Monitor Feature 4.2.10 Digital Thermal Sensor The processor utilizes the Digital Thermal Sensor (DTS) as the on-die sensor to use for fan speed control (FSC). The DTS replaces the on-die thermal diode used in previous product. The DTS is monitoring the same sensor that activates the TCC (See Section 4.2.2). -
Page 38: Platform Environmental Control Interface (Peci)
Feature Set Overview. For additional information on the PECI see the processor datasheet. The PECI bus is available on pin G5 of the LGA 775 socket. Intel chipsets beginning with the ICH8 have included PECI host controller. The PECI interface and the ®... -
Page 39: Intel Thermal/Mechanical Reference Design Information
Intel Thermal/Mechanical Reference Design Information The Intel Advanced Liquid Cooling Technology or ALCT is composed of three components: a liquid to air radiator type heat exchanger; a 12 0mm fan; and an integrated pump with cold plate. The heat exchanger is connected to the pump with flexible hoses. -
Page 40: Heatsink Performance
LGA775 Socket Heatsink Loading 5.1.1 Heatsink Performance ® Table 2 provides the Intel ALCT Reference Design performance for the Intel Core™2 Extreme processor QX6800 B3 Stepping and QX9770 C0 Stepping. The results are based on the test procedure described in Section 5.1.4. -
Page 41: Altitude
T specifications described CONTROL in section 2.2.3. Intel recommendation is to use the Fan Specification for 4 Wire PWM Controlled Fans to implement fan speed control capability based on the digital thermal sensor. Refer to Chapter 6 for further details. -
Page 42: Fan Motor Performance
LGA775 Socket Heatsink Loading 5.1.5 Fan Motor Performance The fan power requirements for proper operation are given Table 4. Table 4. Fan Electrical Performance Requirements Requirement Value Maximum Average fan current draw 1.5 A Fan start-up current draw 2.2 A Fan start-up current draw maximum duration 1.0 second Fan header voltage... -
Page 43: Pump Motor Performance
Intel Thermal/Mechanical Reference Design Information 5.1.6 Pump Motor Performance The pump power requirements for proper operation are given Table 5 Table 5. Pump Electrical Performance Requirements Requirement Value Maximum Average motor current draw 1.5 A Motor start-up current draw 2.2 A Motor header voltage 12 V ±5%... -
Page 44: Environmental Reliability Testing
LGA775 Socket Heatsink Loading Environmental Reliability Testing 5.2.1 Structural Reliability Testing Structural reliability tests consist of unpackaged, board-level vibration and shock tests of a given thermal solution in the assembled state. The thermal solution should meet the specified thermal performance targets after these tests are conducted; however, the test conditions outlined here may differ from your own system requirements. -
Page 45: Shock Test Procedure
Intel Thermal/Mechanical Reference Design Information 5.2.1.2 Shock Test Procedure Recommended performance requirement for a motherboard: • Quantity: 3 drops for + and - directions in each of 3 perpendicular axes (i.e., total 18 drops). • Profile: 50 G trapezoidal waveform, 11 ms duration, 170 in/sec minimum velocity change. -
Page 46: Power Cycling
LGA775 Socket Heatsink Loading 5.2.1.2.2 Post-Test Pass Criteria The post-test pass criteria are: 1. No significant physical damage to the pump assembly attach mechanism (including such items as clip and motherboard fasteners). 2. The assembly must remain attached to the motherboard. 3. -
Page 47: Table 6. The Reliability Test Matrix
Intel Thermal/Mechanical Reference Design Information A list of failure mechanisms that were considered in design reliability testing are: Pump assembly cracking causing liquid loss Vapor loss through plastic walls and joints causing liquid loss Thermal performance degradation due to internal mechanisms affecting... -
Page 48: Tubing Material Selection
LGA775 Socket Heatsink Loading 5.2.3.1 Tubing Material Selection Tubing material selection requires balancing several different criteria. The parameters that were considered were cost, flexibility, flammability and vapor transmissibility. Three different types of tubing materials were tested for liquid loss by connecting a know length of tubing to the ALCT pump and measuring the assembly weight prior to the start and periodically during the test to quantify the loss. -
Page 49: Figure 13. The Assembly Cumulative Mass Loss Data In Continuous Operation
Intel Thermal/Mechanical Reference Design Information Figure 13. The Assembly Cumulative Mass Loss Data in Continuous Operation Test at 50 ºC and 1450 RPM Pump-1 Pump-2 Pump-3 Week The reservoir presence in assembly and its impact on thermal performance was also confirmed by drawing the liquid out in the increment of 5 mL and measuring thermal performance at each increment. -
Page 50: Reliability Test Results
LGA775 Socket Heatsink Loading The reservoir is located in the heat exchanger at its top as shown in Figure 15. An air spring or an accumulator is needed to prevent high-pressure situation due to operating or storage temperature changes. 8 mL air volume is provided on the top of the reservoir to develop an air spring that minimizes the sensitivity to temperature change on pump internal pressure. -
Page 51: Recommended Bios/Cpu/Memory Test Procedures
Intel Thermal/Mechanical Reference Design Information Table 8. Reliability Test Results Test Conditions Failure Results Condition mechanism Continuous = 75 ºC 0/10 failure LIQUID Operation for 16 weeks = 50 ºC 0.25-0.30 grams/week LIQUID = 50 ºC Insignificant change in Ψca for 3... -
Page 52: Material And Recycling Requirements
Geometric Envelope for Intel Reference ATX Thermal Mechanical Design Figure 66, Figure 67, and Figure 68 in Appendix G gives detailed reference ATX/μATX motherboard keep-out information for the reference thermal/mechanical enabling design. -
Page 53: Figure 16. Intel Alct Reference Design Major Components
Intel Thermal/Mechanical Reference Design Information ® Figure 16. Intel ALCT Reference Design Major Components ® Development vendor information for the Intel ALCT Reference Solution is provided in Appendix A. Figure 17. Heat Exchanger Fan Combination Foot Print View Thermal and Mechanical Design Guidelines... -
Page 54: Reference Attach Mechanism
LGA775 Socket Heatsink Loading Reference Attach Mechanism The ALCT pump is attached to the motherboard through the use of a backside stiffener plate. Prior to motherboard installation in the chassis the backside stiffener plate is attached with two screws. Once installed these screws remain installed unless the stiffener plate requires removal. -
Page 55: Socket And Voltage Regulation Cooling Strategy
IHS. The Intel ALCT Reference Design incorporates a voltage regulation and socket cooling scheme that eliminates the need for additional fan(s) on these components. -
Page 56: Figure 20. Cpu Maximum Current Draw For Heat Exchanger Fan Speed
LGA775 Socket Heatsink Loading Using the cooling approach on the Intel D975XBX2 Desktop Board the CPU current draw vs. heat exchanger fan speed is shown in Figure 20 and Table 9 as well as the performance of not having this cooling feature. This was measured as the maximum current draw before the VR circuitry reaches its maximum temperature and asserts the PROCHOT# signal. -
Page 57: Quiet System Technology
The ME provides integrated fan speed control in lieu of the mechanisms available in a SIO or a stand-alone ASIC. The Intel QST is time based as compared to the linear or state control used by the current generation of FSC devices. -
Page 58: Output Weighting Matrix
6.1.1 Output Weighting Matrix Intel QST provides an Output Weighting Matrix that provides a means for a single thermal sensor to affect the speed of multiple fans. An example of how the matrix could be used is if a sensor located next to the memory is sensitive to changes in both the processor heatsink fan and a 2 fan in the system. -
Page 59: Figure 22. Pid Controller Fundamentals
Intel® Quiet System Technology (Intel® QST) Figure 22. PID Controller Fundamentals Integral (time averaged) Integral (time averaged) Integral (time averaged) Integral (time averaged) Actual Actual Temperature Temperature Limit Limit Proportional Proportional Proportional Proportional Temperature Temperature Error Error Error Error Derivative (Slope) -
Page 60: Board And System Implementation Of Intel
• ME system (S0-S1) with Controller Link connected and powered • DRAM with Channel A DIMM 0 installed and 2 MB reserved for Intel QST FW execution • SPI Flash with sufficient space for the Intel QST Firmware •... -
Page 61: Figure 24. Example Acoustic Fan Speed Control Implementation
(see Appendix F for BTX recommendations for placement). Figure 24. Example Acoustic Fan Speed Control Implementation Intel has engaged with a number of major manufacturers of thermal / voltage sensors to provide devices for the SST bus. Contact your Intel Field Sales representative for the current list of manufacturers and visit their web sites or local sales representatives for a part suitable for your design. -
Page 62: Intel ® Qst Configuration & Tuning
® Fan Hub Thermistor and Intel There is no closed loop control between Intel QST and the thermistor, but they can work in tandem to provide the maximum fan speed reduction. The BTX reference design includes a thermistor on the fan hub. This Variable Speed Fan curve will determine the maximum fan speed as a function of the inlet ambient temperature and by design provides a Ψ... -
Page 63: Appendix A Lga775 Socket Heatsink Loading
Heatsink clip load is traditionally used for: • Mechanical performance in mechanical shock and vibration ⎯ Refer to Section 5.6 above for information on the structural design strategy for the Intel ALCT Reference Design • Thermal interface performance ⎯ Required preload depends on TIM ⎯... -
Page 64: Metric For Heatsink Preload For Atx/Uatx Designs Non-Compliant With Intel Reference Design
LGA775 Socket Heatsink Loading Metric for Heatsink Preload for ATX/uATX ® Designs Non-Compliant with Intel Reference Design A.2.1 Heatsink Preload Requirement Limitations Heatsink preload by itself is not an appropriate metric for solder joint force across various mechanical designs and does not take into account for example (not an exhaustive list): •... -
Page 65: Figure 26. Board Deflection Definition
LGA775 Socket Heatsink Loading Table 10. Board Deflection Configuration Definitions Configuration Processor + Socket Heatsink Parameter Name Parameter load plate d_ref BOL deflection, no preload d_BOL BOL deflection with preload d_EOL EOL deflection BOL: Beginning of Life EOL: End of Life Figure 26. -
Page 66: Board Deflection Limits
It assumes no creep to occur in the clip. However, there is a small amount of creep accounted for in the plastic fasteners. This situation is somewhat similar to the Intel Reference Design. The impact of the creep to the board deflection is a function of the clip stiffness: •... -
Page 67: Additional Considerations
A.2.5 Additional Considerations Intel recommends to design to {d_BOL – d_ref = 0.15 mm} at BOL when EOL conditions are not known or difficult to assess The following information is given for illustration only. It is based on the reference keep-out, assuming there is no fixture that changes board stiffness: d_ref is expected to be 0.18 mm on average, and be as high as 0.22 mm... -
Page 68: A.2.5.1 Motherboard Stiffening Considerations
Solutions derived from the reference design comply with the reference heatsink preload, for example: • The Intel ALCT reference design available from licensed suppliers (refer to Appendix H for contact information) § Thermal and Mechanical Design Guidelines... -
Page 69: Heatsink Clip Load Metrology
• Heatsink preload for the LGA775 socket • Quantify preload degradation under bake conditions. Note: This document reflects the current metrology used by Intel. Intel is continuously exploring new ways to improve metrology. Updates will be provided later as this document is revised as appropriate. -
Page 70: Figure 28. Load Cell Installation In Machined Heatsink Base Pocket - Bottom View
Heatsink Clip Load Metrology Remarks: Alternate Heatsink Sample Preparation As mentioned above, making sure that the load cells have minimum protrusion out of the heatsink base is paramount to meaningful results. An alternate method to make sure that the test setup will measure loads representative of the non-modified design •... -
Page 71: Figure 29. Load Cell Installation In Machined Heatsink Base Pocket - Side View
Heatsink Clip Load Metrology Figure 29. Load Cell Installation in Machined Heatsink Base Pocket – Side View Wax to maintain load cell in position during heatsink installation Height of pocket ~ height of selected load cell Load cell protrusion (Note: to be optimized depending on assembly stiffness) Figure 30. -
Page 72: Typical Test Equipment
Heatsink Clip Load Metrology B.2.2 Typical Test Equipment For the heatsink clip load measurement, use equivalent test equipment to the one listed Table 11. Table 11. Typical Test Equipment Part Number Item Description (Model) Honeywell*-Sensotec* Model AL32 13 subminiature load cells, compression only Select a load range depending on load level being tested. -
Page 73: Time-Zero, Room Temperature Preload Measurement
Heatsink Clip Load Metrology B.3.1 Time-Zero, Room Temperature Preload Measurement 1. Pre-assemble mechanical components on the board as needed prior to mounting the motherboard on an appropriate support fixture that replicate the board attach to a target chassis ⎯ For example: standard ATX board should sit on ATX compliant stand-offs. If the attach mechanism includes fixtures on the back side of the board, those must be included, as the goal of the test is to measure the load provided by the actual heatsink mechanism. - Page 74 Heatsink Clip Load Metrology Thermal and Mechanical Design Guidelines...
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Page 75: Appendix C Thermal Interface Management
Thermal Interface Management Appendix C Thermal Interface Management To optimize a heatsink design, it is important to understand the impact of factors related to the interface between the processor and the heatsink base. Specifically, the bond line thickness, interface material area and interface material thermal conductivity should be managed to realize the most effective thermal solution. - Page 76 Thermal Interface Management § Thermal and Mechanical Design Guidelines...
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Page 77: Appendix D Case Temperature Reference Metrology
Case Temperature Reference Metrology Appendix D Case Temperature Reference Metrology Objective and Scope This appendix defines a reference procedure for attaching a thermocouple to the IHS of a 775-land LGA package for T measurement. This procedure takes into account the specific features of the 775-land LGA package and of the LGA775 socket for which it is intended. -
Page 78: Supporting Test Equipment
Case Temperature Reference Metrology Supporting Test Equipment To apply the reference thermocouple attach procedure, it is recommended to use the equipment (or equivalent) given in the table below. Item Description Part Number Measurement and Output Microscope Olympus* Light microscope or equivalent SZ-40 Digital Multi Meter for resistance measurement Fluke 79 Series... -
Page 79: Thermal Calibration And Controls
1. It is recommended to follow company standard procedures and wear safety items like glasses for cutting the IHS and gloves for chemical handling. 2. Ask your Intel field sales representative if you need assistance to groove and/or install a thermocouple according to the reference process. -
Page 81: Figure 33. Ihs Groove On The 775-Land Lga Package
Case Temperature Reference Metrology The orientation of the groove relative to the package pin 1 indicator (gold triangle in one corner of the package) is shown. Figure 33 for the 775-Land LGA package IHS. Figure 33. IHS Groove on the 775-LAND LGA Package IHS Groove Pin1 indicator... -
Page 82: Thermocouple Attach Procedure
Case Temperature Reference Metrology Thermocouple Attach Procedure The procedure to attach a thermocouple with solder takes about 15 minutes to complete. Before proceeding turn on the solder block heater, as it can take up to 30 minutes to reach the target temperature of 153 – 155°C. Note: To avoid damage to the TTV or processor ensure the IHS temperature does not exceed 155 °C. -
Page 83: Thermocouple Attachment To The Ihs
Case Temperature Reference Metrology 5. Using the microscope and tweezers, bend the tip of the thermocouple at approximately 10 degree angle by about 0.8 mm [.030 inch] from the tip (Figure 36). Figure 36. Bending the Tip of the Thermocouple D.5.2 Thermocouple Attachment to the IHS 6. -
Page 84: Figure 38. Thermocouple Bead Placement
Case Temperature Reference Metrology 9. Lift the wire at the middle of groove with tweezers and bend the front of wire to place the thermocouple in the groove ensuring the tip is in contact with the end and bottom of the groove in the IHS (Figure 38-A and B). Figure 38. -
Page 85: Figure 39. Position Bead On The Groove Step
Case Temperature Reference Metrology 11. While still at the microscope, press the wire down about 6mm [0.125”] from the thermocouple bead using the tweezers or your finger. Place a piece of Kapton* tape to hold the wire inside the groove (Figure 39). Refer to Figure 40 for detailed bead placement. -
Page 86: Figure 41. Third Tape Installation
Case Temperature Reference Metrology Figure 41. Third Tape Installation 12. Place a 3 piece of tape at the end of the step in the groove as shown in Figure 41. This tape will create a solder dam to prevent solder from flowing into the larger IHS groove section during the melting process. -
Page 87: Figure 43. Applying Flux To The Thermocouple Bead
Case Temperature Reference Metrology 14. Using a fine point device, place a small amount of flux on the thermocouple bead. Be careful not to move the thermocouple bead during this step (Figure 43). Ensure the flux remains in the bead area only. Figure 43. -
Page 88: Solder Process
Case Temperature Reference Metrology 16. Place the two pieces of solder in parallel, directly over the thermocouple bead (Figure 45) Figure 45. Positioning Solder on IHS 17. Measure the resistance from the thermocouple end wires again using the DMM (refer to Section D.5.1, step 2) to ensure the bead is still properly contacting the IHS. -
Page 89: Figure 46. Solder Station Setup
Case Temperature Reference Metrology Figure 46. Solder Station Setup 21. Remove the land side protective cover and place the device to be soldered in the solder station. Make sure the thermocouple wire for the device being soldered is exiting the heater toward you. Note: Do not touch the copper heater block at any time as this is very hot. -
Page 90: Figure 47. View Through Lens At Solder Station
Case Temperature Reference Metrology 24. You may need to move the solder back toward the groove as the IHS begins to heat. Use a fine tip tweezers to push the solder into the end of the groove until a solder ball is built up (Figure 47 and Figure 48) Figure 47. -
Page 91: Cleaning And Completion Of Thermocouple Installation
Case Temperature Reference Metrology 25. Lift the heater block and magnified lens, using tweezers quickly rotate the device 90 degrees clockwise. Using the back of the tweezers press down on the solder this will force out the excess solder Figure 49. Removing Excess Solder 26. -
Page 92: Figure 50. Thermocouple Placed Into Groove
Case Temperature Reference Metrology Figure 50. Thermocouple placed into groove 29. Using a blade carefully shave the excess solder above the IHS surface. Only shave in one direction until solder is flush with the groove surface (Figure 51). Figure 51. Removing Excess Solder Note: Take usual precautions when using open blades 30. -
Page 93: Figure 52. Filling Groove With Adhesive
Case Temperature Reference Metrology 31. Fill the rest of the groove with Loctite* 498 Adhesive. Verify under the microscope that the thermocouple wire is below the surface along the entire length of the IHS groove (Figure 52). Figure 52. Filling Groove with Adhesive 32. -
Page 94: Figure 54. Removing Excess Adhesive From Ihs
Case Temperature Reference Metrology Figure 54. Removing Excess Adhesive from IHS 33. Using a blade, carefully shave any adhesive that is above the IHS surface (Figure 54). The preferred method is to shave from the edge to the center of the IHS. -
Page 95: Thermocouple Wire Management
Case Temperature Reference Metrology Thermocouple Wire Management When installing the processor into the socket, make sure that the thermocouple wires exit above the load plate as Figure 56. Pinching the thermocouple wires between the load plate and the IHS will likely damage the wires. Note: When thermocouple wires are damaged, the resulting reading maybe wrong. - Page 96 Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines...
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Page 97: Appendix E Legacy Fan Speed Control
Legacy Fan Speed Control Appendix E Legacy Fan Speed Control A motherboard design may opt to use a SIO or ASIC based fan speed control device that uses the existing look up or state based fan speed control. The fan speed control implementations consist of the following items •... -
Page 98: Minimum Fan Speed Set Point
Legacy Fan Speed Control Figure 57. Thermistor Set Points Variable Speed Fan (VSF) Curve Variable Speed Fan (VSF) Curve Full Full Speed Speed Min. Min. Operating Operating Fan Inlet Fan Inlet Temperature (°C) Temperature (°C) E.1.2 Minimum Fan Speed Set Point The final aspect of thermal solution design is to determine the minimum speed the fan will be allowed to operate. -
Page 99: Board And System Implementation
PWM signal. These components can be a discrete device or a super IO (SIO) with the functionality embedded. Intel has engaged with a number of major manufacturers of FSC components to provide devices that have a PECI host controller. -
Page 100: Temperature To Begin Fan Acceleration
Legacy Fan Speed Control These are the minimum parameters required to implement acoustic fan speed control. See Figure 59 for an example. There may be vendor specific options that offer enhanced functionality. See the appropriate vendor datasheet on how to implement those features. -
Page 101: Figure 60. Temperature Range = 5 °C
Legacy Fan Speed Control Figure 60. Temperature Range = 5 °C Fan RPM Tdiode Tcontrol Tlow 3500 3000 2500 2000 1500 1000 Time (s) An alternate would be to consider a slightly larger value such as T = 10 °C. In RANGE this case the design is trading off the acoustic margin for thermal margin. -
Page 102: Minimum Pwm Duty Cycle
Legacy Fan Speed Control Figure 61. Temperature Range = 10 °C Fan RPM Tdiode Tcontrol Tlow 3500 3000 2500 2000 1500 1000 Time (s) It should be noted that having T above T is expected for workloads near SENSOR CONTROL TDP power levels and high system ambient. -
Page 103: Combining Thermistor And Digital Thermal Sensor Control
Thermal Profile. The minimum requirement for thermal compliance is to ensure the thermal solution, by design, meets the thermal profile. If the system design will incorporate acoustic speed fan control, Intel requires monitoring the digital thermal sensor to implement acoustic fan speed control. The value of the digital thermal sensor temperature determines which specification must be met. -
Page 104: Table 12. Fsc Definitions
Legacy Fan Speed Control To use all of the features in the Intel reference heatsink design or the Boxed Processor, system integrators should verify the following functionality is present in the board design. Refer to the Fan Specification for 4 wire PWM Controlled Fans and Chapter 5 for complete details on the Intel enabled thermal solution. -
Page 105: Figure 63. Fsc Definition Example
Legacy Fan Speed Control Figure 63. FSC Definition Example Requirements Classification • Required – an essential part of the design necessary to meet specifications. Should be considered a pass or fail in selection of a board. • Suggested – highly desired for consistency among designs. May be specified or expanded by the system integrator. -
Page 106: Table 13. Atx Fsc Settings
2 °C NOTES: ® 1. A PWM frequency of 25 kHz is the design target for the reference and for the Intel Boxed Processor and the reference design.. 2. Use the lowest time available in this range for the device selected. - Page 107 Legacy Fan Speed Control spike smoothing). Please select the lowest setting available close to 4.0 seconds by the fan speed control device 4. The Fan Speed Controller, or Health Monitor Component, takes the result of the two fan speed ramps (processor and system) and drives the TMA fan to the highest resulting PWM duty cycle (%) 5.
- Page 108 Legacy Fan Speed Control Thermal and Mechanical Design Guidelines...
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Page 109: Appendix Fbtx System Thermal Considerations
BTX System Thermal Considerations Appendix F BTX System Thermal Considerations There are anticipated system operating conditions in which the processor power may be low but other system component powers may be high. If the only Fan Speed Control (FSC) circuit input for the Thermal Module Assembly (TMA) fan is from the processor diode then the fan speed and system airflow is likely to be too low in this operating state. -
Page 110: Figure 64. System Airflow Illustration With System Monitor Point Area Identified
BTX System Thermal Considerations The thermal sensor location and elevation are reflected in the Flotherm thermal model ® airflow illustration and pictures (see Figure 64and Figure 65).The Intel Boxed Boards in BTX form factor have implemented a System Monitor thermal sensor. The following... -
Page 111: Figure 65. Thermal Sensor Location Illustration
BTX System Thermal Considerations Figure 65. Thermal sensor Location Illustration Thermal Sensor MCH Heatsink § Thermal and Mechanical Design Guidelines... - Page 112 BTX System Thermal Considerations Thermal and Mechanical Design Guidelines...
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Page 113: Appendix G Mechanical Drawings
The following table lists the mechanical drawings included in this appendix. These drawings refer to the reference thermal mechanical enabling components for the processor. Note: Intel reserves the right to make changes and modifications to the design as necessary. Drawing Description Page Number ATX/µATX Motherboard Keep-out Footprint Definition and Height... - Page 114 47.50 45.26 40.00 39.01 36.78 36.00 32.51 27.81 27.51 23.47 7.30 2 0.00 5.90 ) 16.87 23.47 27.00 27.51 32.51 36.49 33.00 36.78 36.00 40.00 39.01 44.00 45.26 47.50...
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Page 123: Appendix H Intel Enabled Reference Solution Information
Components Co., Ltd) Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice.