Table Of Contents - Intel Itanium 2 Processor Datasheet

2 processor 1.66 ghz with 9 mb l3 cache / 1.66 ghz with 6 mb l3 cache / 1.6 ghz with 9 mb l3 cache / 1.6 ghz with 6 mb l3 cache/ 1.5 ghz with 6 mb l3 cache / 1.5 ghz with 4 mb l3 cache / 1.4 ghz with 4 mb l3 cache / 1.3 ghz with 3 mb l3 cache / 1.0 ghz wi
Table of Contents

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Contents
1
Introduction....................................................................................................................... 11
1.1
1.2
1.3
1.4
1.5
1.6
2
Electrical Specifications.................................................................................................... 15
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
3
Pinout Specifications ........................................................................................................ 37
4
Mechanical Specifications ................................................................................................ 69
4.1
4.2
5
Thermal Specifications ..................................................................................................... 75
5.1
5.2
6
System Management Feature Specifications................................................................... 79
6.1
Datasheet
Overview ............................................................................................................. 11
Processor Abstraction Layer ............................................................................... 11
Terminology......................................................................................................... 12
State of Data ....................................................................................................... 12
Reference Documents......................................................................................... 13
®
2 Processor System Bus ...................................................................... 15
2.1.1
System Bus Power Pins ......................................................................... 15
2.1.2
System Bus No Connect ........................................................................ 15
System Bus Signals ............................................................................................ 15
2.2.1
Signal Groups......................................................................................... 15
2.2.2
Signal Descriptions................................................................................. 16
Package Specifications ....................................................................................... 17
Signal Specifications ........................................................................................... 18
2.4.1
Maximum Ratings................................................................................... 22
2.5.1
Overshoot/Undershoot Magnitude ......................................................... 23
2.5.2
Overshoot/Undershoot Pulse Duration................................................... 24
2.5.3
Activity Factor......................................................................................... 24
2.5.4
2.5.5
Specifications ......................................................................................... 25
2.5.6
Wired-OR Signals................................................................................... 28
Power Pod Connector Signals ............................................................................ 30
®
Recommended Connections for Unused Pins ....................................................35
Mechanical Dimensions ...................................................................................... 69
Package Marking................................................................................................. 72
4.2.1
Processor Top-Side Marking.................................................................. 72
4.2.2
Processor Bottom-Side Marking............................................................. 72
Thermal Features ................................................................................................ 75
5.1.1
Thermal Alert.......................................................................................... 75
5.1.2
Enhanced Thermal Management ........................................................... 76
5.1.3
Thermal Trip ........................................................................................... 76
Case Temperature ..............................................................................................76
System Management Bus ................................................................................... 79
6.1.1
System Management Bus Interface ....................................................... 79
6.1.2
System Management Interface Signals.................................................. 79
3

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