Heat Pipe Considerations; Atca Heatsink Performance Curves - Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Design Manual
Xeon processor c5500/c3500 series and lga1366 socket hermal/mechanical design guide
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Also See for X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor:
- Datasheet (104 pages) ,
- Specification (42 pages)
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Thermal Solutions
For the ATCA reference heatsink, see
specifies Ψ
the ATCA heatsink versus the airflow provided. Best-fit equations are provided to
prevent errors associated with reading the graph.
Figure 7-2.
ATCA Heatsink Performance Curves
2.5
1.5
0.5
7.2
Heat Pipe Considerations
Figure 7-3
positioned similar to the processor die.
August 2010
Order Number: 323107-002US
target at 30 CFM per blade.
CA
2
1
0
0
5
10
shows the orientation and position of the TTV die. The TTV die is sized and
Appendix B
for detailed drawings.
Figure 7-2
shows Ψ
Δ P = 1.3e-04 CFM^2 +1.1e-02 CFM
Mean Ψ
= 0.337 + 1.625 * CFM
ca
15
20
25
CFM Through Fins
®
®
Intel
Xeon
Processor C5500/C3500 Series and LGA1366 Socket
Table 7-1
and pressure drop for
CA
2
1.6
1.2
0.8
0.4
-0.939
0
30
35
Thermal/Mechanical Design Guide
56
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