Electrical Requirements; Thermal Module Assembly Power Supply; Assembly Stack Including The Support And Retention Module - Intel HH80552PG0962M - Pentium 4 3.4 GHz Processor Datasheet

Balanced Technology Extended (BTX) Boxed Processor Specifications
Document, Balanced Technology Extended (BTX) System Design Guide, and the
appropriate processor Thermal and Mechanical Design Guidelines (see
more detailed information regarding the support and retention module and chassis
interface and keepout zones.
SRM.
Figure 29.

Assembly Stack Including the Support and Retention Module

8.2

Electrical Requirements

8.2.1

Thermal Module Assembly Power Supply

The boxed processor's Thermal Module Assembly (TMA) requires a +12 V power
supply. The TMA will include power cable to power the integrated fan and will plug into
the 4-wire fan header on the baseboard. The power cable connector and pinout are
shown in
the boxed processor.
the TMA.
The TMA outputs a SENSE signal, which is an open- collector output that pulses at a
rate of 2 pulses per fan revolution. A baseboard pull-up resistor provides V
the system board-mounted fan speed monitor requirements, if applicable. Use of the
SENSE signal is optional. If the SENSE signal is not used, pin 3 of the connector should
be tied to GND.
The TMA receives a Pulse Width Modulation (PWM) signal from the motherboard from
th
the 4 pin of the connector labeled as CONTROL.
Datasheet
Figure 29
Thermal Module Assembly
• Heatsink & Fan
• Clip
• Structural Duct
Motherboard
SRM
Chassis Pan
Figure 30. Baseboards must provide a compatible power header to support
Table 36 contains specifications for the input and output signals at
illustrates the assembly stack including the
Section 1.2) for
to match
OH
99