Processor Thermal Specifications For 775_Vr_Config_05A Processors; Processor Thermal Specifications For 775_Vr_Config_06 Processors - Intel HH80552PG0962M - Pentium 4 3.4 GHz Processor Datasheet
Pentium 4 processor 6x1 sequence, on 65 nm process in the 775-land lga package supporting hyper-threading technology and 64 arhitecture
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The case temperature is defined at the geometric top center of the processor. Analysis
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table 26
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to
Thermal Monitor 2 feature must be enabled for the processor to remain within
specification.
Table 26.
Processor Thermal Specifications for 775_VR_CONFIG_05A Processors
Processor
Number
631
641
651
661
NOTES:
1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the
maximum power that the processor can dissipate.
2. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP.
Therefore, the maximum T
Figure 12
Table 27.
Processor Thermal Specifications for 775_VR_CONFIG_06 Processors
Processor
Number
631
641
651
NOTES:
1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the
maximum power that the processor can dissipate.
2. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP.
Therefore, the maximum T
figure and associated table for the allowed combinations of power and T
76
instead of the maximum processor power consumption. The Thermal Monitor
Core
Thermal
Frequency
Design
(GHz)
Power (W)
3 GHz
3.20 GHz
3.40 GHz
3.60 GHz
will vary depending on the TDP of the individual processor. Refer to
C
for the allowed combinations of power and T
Core
Thermal
Frequency
Design
(GHz)
Power (W)
3 GHz
3.20 GHz
3.40 GHz
will vary depending on the TDP of the individual processor. Refer to thermal profile
C
Thermal Specifications and Design Considerations
Section
5.2. In all cases the Thermal Monitor or
Minimum
T
(°C)
C
86
5
86
5
86
5
86
5
.
C
Minimum
T
(°C)
C
65
5
65
5
65
5
Maximum T
(°C)
Notes
C
See
Table 28
and
Figure 12
See
Table 28
and
Figure 12
See
Table 28
and
Figure 12
See
Table 28
and
Figure 12
Table 28
Maximum T
(°C)
Notes
C
See
Table
29and
Figure 13
.
C
Datasheet
1, 2
1,
2
1,
2
1,
2
and
1, 2
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