Processor Thermal Specifications; Processor Series - Intel Core i7-800 Specifications

Section 6.2. To ensure maximum flexibility for future processors, systems should be
designed to the Thermal Solution Capability guidelines, even if a processor with lower
power dissipation is currently planned.
Table 6-1.

Processor Thermal Specifications

Product
Intel Core™ i7-800
and i5-700 desktop

processor series

(95 W)
Notes:
1. The package C-state power is the worst case power in the system configured as follows:
- Memory configured for DDR3 1333 and populated with 2 DIMM per channel.
- DMI and PCIe links are at L1.
2. Specification at DTS = -50 and minimum voltage loadline.
3. Specification at DTS = -50 and minimum voltage loadline.
4. Specification at DTS = -64 and minimum voltage loadline.
5. These DTS values (in Notes 2-4) are based on the TCC Activation MSR having a value of 100, see
Section
6. These values are specified at V
Systems must be designed to ensure the processor is not to be subjected to any static V
combination wherein V
datasheet.
7. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at DTS = -1.
TDP is achieved with the Memory configured for DDR3 1333 and 2 DIMMs per channel.
8. The 2009B (09B) guidelines provide a design target for meeting all planned processor frequency
requirements. The 2009B (09B) is equivalent to the thermal requirements for the Intel
Q9000 processor series. The 2009A (09A) is equivalent to the thermal requirements for the Intel
Duo E8000 processor series. Reuse of those thermal solutions is recommended with the updated
mechanical attach to straddle the LGA1156 socket.
9. Not 100% tested. Specified by design characterization.
36
Max
Power
Guidelines 8 Package
C1E
1,2,5,9
(W)
2009B
28
(09B)
6.2.1.
CC_MAX
exceeds V
CCP CCP_MAX
Max Max
Power Power
Package Package
C3 C6
1,3,5,9 1,4,5,9
(W) (W)
22 5.5
and V for all other voltage rails for all processor frequencies.
NOM
at specified I . Refer to the loadline specifications in the
CCP
Thermal/Mechanical Specifications and Design Guidelines
Thermal Specifications
TTV
Thermal Min Maximum
Design T TTV TCASE
CASE
Power (°C) (°C)
6,7
(W)
Figure 6-1
95 5
Table 6-2
and I
CC CC
®
Core™ 2 Quad
®
Core™ 2
&