Thermal Specifications; Package Thermal Specifications - Intel BX80613I7980 Datasheet

Thermal Specifications

6
Thermal Specifications
6.1

Package Thermal Specifications

The processor requires a thermal solution to maintain temperatures within its operating
limits. Any attempt to operate the processor outside these operating limits may result
in permanent damage to the processor and potentially other components within the
system. Maintaining the proper thermal environment is key to reliable, long-term
system operation.
A complete solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor integrated heat spreader (IHS).
This chapter provides data necessary for developing a complete thermal solution. For
more information on designing a component level thermal solution, refer to the
appropriate processor Thermal and Mechanical Design Guidelines (see
6.1.1 Thermal Specifications
The processor thermal specification uses the on-die Digital Thermal Sensor (DTS) value
reported using the PECI interface for all processor temperature measurements. The
DTS is a factory calibrated, analog-to-digital thermal sensor. As a result, it will no
longer be necessary to measure the processors case temperature. Consequently, there
will be no need for a Thermal Profile specification defining the relationship between the
processors T
Note: Unless otherwise specified, the term "DTS" refers to the DTS value returned by from
the PECI interface gettemp command.
Note: A thermal solution that was verified compliant to the processor case temperature
thermal profile at the customer defined boundary conditions is expected to be
compliant with this update. No redesign of the thermal solution should be necessary. A
fan speed control algorithm that was compliant to the previous thermal requirements is
also expected to be compliant with this specification. The fan speed control algorithm
can be updated to use the additional information to optimize acoustics.
To allow the optimal operation and long-term reliability of Intel processor-based
systems, the processor thermal solution must deliver the specified thermal solution
performance in response to the DTS sensor value. The thermal solution performance
will be measured using a Thermal Test Vehicle (TTV). See
Figure 6-2
performance table when DTS values are greater than T
designed to provide this level of thermal capability may affect the long-term reliability
of the processor and system. When the DTS value is less than T
solution performance is not defined and the fans may be slowed down. This is
unchanged from the prior specification. For more details on thermal solution design,
refer to the appropriate processor Thermal and Mechanical Design Guidelines (see
Section 1.2).
The processors implement a methodology for managing processor temperatures, which
is intended to support acoustic noise reduction through fan speed control and to assure
processor reliability. Selection of the appropriate fan speed is based on the relative
temperature data reported by the processor's Digital Temperature Sensor (DTS). The
Datasheet, Volume 1
and power dissipation.
CASE
for the TTV thermal profile. See
Table 6-1
Table 6-4 for the required thermal solution
. Thermal solutions not
CONTROL
CONTROL
Section 1.2).
and Figure 6-1 or
, the thermal
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