Package Mechanical Specifications; Package Mechanical Drawing; Processor Package Assembly Sketch - Intel BX80613I7980 Datasheet

Package Mechanical Specifications

3
Package Mechanical
Specifications
The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with
the motherboard using an LGA1366 socket. The package consists of a processor
mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to
the package substrate and core and serves as the mating surface for processor thermal
solutions, such as a heatsink.
components and how they are assembled together. Refer to the appropriate processor
Thermal and Mechanical Design Guidelines (see
the LGA1366 socket.
The package components shown in
• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor core (die)
• Package substrate
• Capacitors
Figure 3-1.

Processor Package Assembly Sketch

Substrate Substrate
System Board System Board
Note:
1. Socket and motherboard are included for reference and are not part of the processor package.
3.1

Package Mechanical Drawing

The package mechanical drawings are shown in
drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:
• Package reference with tolerances (total height, length, width, etc.)
• IHS parallelism and tilt
• Land dimensions
• Top-side and back-side component keep-out dimensions
• Reference datums
• All drawing dimensions are in mm.
• Guidelines on potential IHS flatness variation with socket load plate actuation and
installation of the cooling solution is available in the appropriate processor Thermal
and Mechanical Design Guidelines (see
Datasheet, Volume 1
Figure 3-1 shows a sketch of the processor package
Figure 3-1
Die
IHS IHS
Section 1.2) for complete details on
include the following:
TIM TIM
Capacitors Capacitors
Figure 3-2 and Figure
Section 1.2).
LGA LGA1366 Socket
3-3. The
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