Processor Thermal Specifications - Intel Q9300 - Core 2 Quad 2.5 GHz 6M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Datasheet

The case temperature is defined at the geometric top center of the processor. Analysis
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table 5-1
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to
Thermal Monitor 2 feature must be enabled for the processor to remain within
specification.
Table 5-1.

Processor Thermal Specifications

Core
Processor
Freq.
Number
(GHz)
QX9770 3.20
QX9650 3.00
Q9650 3.0
Q9550 2.83
Q9550 2.83
Q9505 2.83
Q9450 2.66
Q9400 2.66
Q9300 2.50
Q8400 2.66
Q8300 2.50
Q8200 2.33
Q9550S 2.83
Q9505S 2.83
Q9400S 2.66
Q8400S 2.66
Q8200S 2.33
NOTES:
1. Specification is at 37° C Tc and minimum voltage loadline. Specification is ensured by
design characterization and not 100% tested.
2.
Specification is at 34° C Tc and minimum voltage loadline. Specification is
characterization and not 100% tested.
3. Thermal Design Power (TDP) should be used for processor thermal solution design targets.
The TDP is not the maximum power that the processor can dissipate.
4. This table shows the maximum TDP for a given frequency range. Individual processors
may have a lower TDP. Therefore, the maximum T
individual processor. Refer to thermal profile figure and associated table for the allowed
combinations of power and T
5. 775_VR_CONFIG_05 guidelines provide a design target for meeting future thermal
requirements.
6. These processors have CPUID = 1067Ah.
7. These processors have CPUID = 10677h.
8. These processors have CPUID = 10676h.
76
instead of the maximum processor power consumption. The Thermal Monitor
Thermal Extended
Design HALT
Power Power
3, 4 1
(W) (W)
136 16
130 16
95 12
95 12
95 12
95 12
95 12
95 12
95 12
95 12
95 12
95 12
65 12
65 12
65 12
65 12
65 12
Thermal Specifications and Design Considerations
Section 5.2. In all cases the Thermal Monitor or
Deeper
775_VR_CO
Sleep
5
NFIG
Power
2
(W)
— —
775_VR_CO
—
NFIG_05B
8
8
—
—
—
775_VR_CO
NFIG_05A
8
—
8
8
—
8
8
775_VR_CO
8
NFIG_06
8
8
will vary depending on the TDP of the
C
.
C
Minimum Maximum T
C
T (°C) (°C)
C
See Table 5-2
5 and
Figure 5-1
See Table 5-3
5 and
Figure 5-2
5
5
5
5
See Table 5-4
5
and
5
Figure 5-3
5
5
5
5
5
5
See Table 5-5
5 and
Figure 5-4
5
5
ensured
by design
Notes
8
7, 8
6
6
7
7
7
6
7
6
6
7
6
6
6
6
6
Datasheet