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Core2 Extreme QX9000 Series
Intel Core2 Extreme QX9000 Series Manuals
Manuals and User Guides for Intel Core2 Extreme QX9000 Series. We have
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Intel Core2 Extreme QX9000 Series manuals available for free PDF download: Design Manual, Datasheet
Intel Core2 Extreme QX9000 Series Design Manual (124 pages)
Design Guidelines
Brand:
Intel
| Category:
Computer Hardware
| Size: 4.58 MB
Table of Contents
Table of Contents
3
1 Introduction
11
Document Goals and Scope
11
Importance of Thermal Management
11
Document Goals
11
Document Scope
12
References
13
Definition of Terms
14
2 Processor Thermal/Mechanical Information
17
Mechanical Requirements
17
Processor Package
17
Figure 1. Package IHS Load Areas
17
Heatsink Attach
19
General Guidelines
19
Heatsink Clip Load Requirement
19
Additional Guidelines
20
Thermal Requirements
20
Processor Case Temperature
20
Thermal Profile
21
Figure 2. Processor Case Temperature Measurement Location
21
Control
23
Figure 3. Example Thermal Profile
23
Heatsink Design Considerations
24
Heatsink Size
25
Heatsink Mass
25
Package IHS Flatness
26
Thermal Interface Material
26
System Thermal Solution Considerations
27
Chassis Thermal Design Capabilities
27
Improving Chassis Thermal Performance
27
Table 1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions
27
Table 2. Heatsink Inlet Temperature of Intel ® Boxed Processor Thermal Solutions
27
Summary
28
System Integration Considerations
28
3 Thermal Metrology
29
Characterizing Cooling Performance Requirements
29
Figure 4. Processor Thermal Characterization Parameter Relationships
30
Example
31
Processor Thermal Solution Performance Assessment
31
Local Ambient Temperature Measurement Guidelines
32
Figure 5. Locations for Measuring Local Ambient Temperature, Active Heatsink
33
Figure 6. Locations for Measuring Local Ambient Temperature, Passive Heatsink
33
Processor Case Temperature Measurement Guidelines
34
4 Thermal Management Logic and Thermal Monitor Feature
35
Processor Power Dissipation
35
Thermal Monitor Implementation
35
PROCHOT# Signal
36
Thermal Control Circuit
36
Thermal Monitor
36
Figure 7. Thermal Monitor Control
37
Thermal Monitor 2 (TM2)
37
Operation and Configuration
38
Figure 8. Thermal Monitor 2 Frequency and Voltage Ordering
38
On-Demand Mode
39
System Considerations
39
Operating System and Application Software Considerations
40
THERMTRIP# Signal
40
Cooling System Failure Warning
40
Digital Thermal Sensor
41
Figure 9. T for Digital Thermometer
41
Platform Environmental Control Interface (PECI)
42
5 Intel Thermal/Mechanical Reference Design Information
43
ATX Reference Design Requirements
43
Figure 10. Intel RCFH-4 Reference Design - Exploded View
43
Figure 11. Intel D60188-001 Reference Design ─ Exploded View
44
Validation Results for Reference Design
45
Heatsink Performance
45
Figure 12. Bottom View of Copper Core Applied by TC-1996 Grease
45
Acoustics
46
Table 4. ATX Reference Heatsink Performance (D60188-001) for Listed Processors at 95 W
46
Table 5. Acoustic Results for ATX Reference Heatsink (RCFH-4)
46
Table 6. Acoustic Results for ATX Reference Heatsink (D60188-001)
46
Altitude
47
Reference Heatsink Thermal Validation
47
Fan Performance for Active Heatsink Thermal Solution
48
Table 7. Fan Electrical Performance Requirements
48
Environmental Reliability Testing
49
Structural Reliability Testing
49
Figure 13. Random Vibration PSD
49
Random Vibration Test Procedure
49
Shock Test Procedure
49
Figure 14. Shock Acceleration Curve
50
Post-Test Pass Criteria
50
Recommended Test Sequence
50
Power Cycling
51
Recommended Bios/Processor/Memory Test Procedures
51
Material and Recycling Requirements
51
Safety Requirements
52
Geometric Envelope for Intel
52
Reference Attach Mechanism
53
Structural Design Strategy
53
Figure 15. Upward Board Deflection During Shock
53
Mechanical Interface to the Reference Attach Mechanism
54
Figure 16. Reference Clip/Heatsink Assembly
54
Figure 17. Critical Parameters for Interfacing to Reference Clip
55
Figure 18. Critical Core Dimension
55
6 Intel Quiet System Technology (Intel QST)
57
Intel ® Quiet System Technology Algorithm
57
Output Weighting Matrix
58
Proportional-Integral-Derivative (PID)
58
Figure 19. Intel Quiet System Technology Overview
58
Figure 20. PID Controller Fundamentals
59
Board and System Implementation of Intel
60
Quiet System Technology
60
Figure 21. Intel ® Quiet System Technology Platform Requirements
60
Figure 22. Example Acoustic Fan Speed Control Implementation
61
Intel ® QST Configuration and Tuning
62
Fan Hub Thermistor and Intel
62
Qst
62
Figure 23. Digital Thermal Sensor and Thermistor
62
Appendix Alga775 Socket Heatsink Loading
63
LGA775 Socket Heatsink Considerations
63
Metric for Heatsink Preload for Atx/Uatx Designs Non-Compliant with Intel Reference Design
63
Heatsink Preload Requirement Limitations
63
Motherboard Deflection Metric Definition
64
Table 8. Board Deflection Configuration Definitions
64
Board Deflection Limits
65
Figure 24. Board Deflection Definition
65
Board Deflection Metric Implementation Example
66
Additional Considerations
67
Figure 25. Example: Defining Heatsink Preload Meeting Board Deflection Limit
67
Motherboard Stiffening Considerations
68
Heatsink Selection Guidelines
68
Appendix B Heatsink Clip Load Metrology
69
Overview
69
Test Preparation
69
Heatsink Preparation
69
B.1 Overview
69
B.2 Test Preparation
69
B.2.1 Heatsink Preparation
69
Figure 26. Load Cell Installation in Machined Heatsink Base Pocket (Bottom View)
70
Figure 27. Load Cell Installation in Machined Heatsink Base Pocket (Side View)
71
Figure 28. Preload Test Configuration
71
Typical Test Equipment
72
Test Procedure Examples
72
Table 9. Typical Test Equipment
72
Preload Degradation under Bake Conditions
73
Time-Zero, Room Temperature Preload Measurement
73
Appendix C Thermal Interface Management
75
Bond Line Management
75
Interface Material Area
75
Interface Material Performance
75
Case Temperature Reference Metrology
77
Appendix D Case Temperature Reference Metrology
77
Objective and Scope
77
Supporting Test Equipment
77
Thermal Calibration and Controls
78
Figure 29. Omega Thermocouple
78
IHS Groove
79
D.4 IHS Groove
79
Figure 30. 775-LAND LGA Package Reference Groove Drawing at 6 O'clock Exit
80
Figure 32. IHS Groove at 6 O'clock Exit on the 775-LAND LGA Package
83
Figure 33. IHS Groove Orientation at 6 O'clock Exit Relative to the LGA775 Socket
83
Thermocouple Attach Procedure
84
Thermocouple Conditioning and Preparation
84
Figure 34. Inspection of Insulation on Thermocouple
84
Thermocouple Attachment to the IHS
85
Figure 35. Bending the Tip of the Thermocouple
85
Figure 36. Securing Thermocouple Wires with Kapton* Tape Prior to Attach
85
Figure 37. Thermocouple Bead Placement
86
Figure 38. Position Bead on the Groove Step
87
Figure 39. Detailed Thermocouple Bead Placement
87
Figure 40. Third Tape Installation
88
Figure 41. Measuring Resistance between Thermocouple and IHS
88
Figure 42. Applying Flux to the Thermocouple Bead
89
Figure 43. Cutting Solder
89
Solder Process
90
D.5.3 Solder Process
90
Figure 44. Positioning Solder on IHS
90
Figure 45. Solder Station Setup
91
Figure 46. View through Lens at Solder Station
92
Figure 47. Moving Solder Back Onto Thermocouple Bead
92
Cleaning and Completion of Thermocouple Installation
93
Figure 48. Removing Excess Solder
93
Figure 49. Thermocouple Placed into Groove
94
Figure 50. Removing Excess Solder
94
Figure 51. Filling Groove with Adhesive
95
Figure 52. Application of Accelerant
95
Figure 53. Removing Excess Adhesive from IHS
95
Thermocouple Wire Management
96
Figure 54. Finished Thermocouple Installation
96
Figure 55. Thermocouple Wire Management
97
Appendix E Balanced Technology Extended (BTX) System Thermal Considerations
99
Figure 56. System Airflow Illustration with System Monitor Point Area Identified
100
Figure 57. Thermal Sensor Location Illustration
101
Appendix F Mechanical Drawings
103
Figure 58. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
103
Figure 59. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
103
Figure 60. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
103
Figure 72. Intel ® RCFH4 Reference Solution Assembly
103
Figure 73. Intel RCFH4 Reference Solution Assembly
103
Figure 74. Intel D60188-001 Reference Solution Assembly
103
Figure 75. Intel D60188-001 Reference Solution Heatsink
103
Figure 61. Balanced Technology Extended (BTX) Thermal Module Keep out Volumetric - Sheet 1
107
Figure 62. Balanced Technology Extended (BTX) Thermal Module Keep out Volumetric - Sheet 2
108
Figure 63. Balanced Technology Extended (BTX) Thermal Module Keep out Volumetric - Sheet 3
109
Figure 64. Balanced Technology Extended (BTX) Thermal Module Keep out Volumetric - Sheet 4
110
Figure 65. Balanced Technology Extended (BTX) Thermal Module Keep out Volumetric - Sheet 5
111
Figure 66. ATX Reference Clip - Sheet 1
112
Figure 67. ATX Reference Clip - Sheet 2
113
Figure 68. Reference Fastener - Sheet 1
114
Figure 69. Reference Fastener - Sheet 2
115
Figure 70. Reference Fastener - Sheet 3
116
Figure 71. Reference Fastener - Sheet 4
117
Intel Enabled Reference Solution Information
123
Table 10. Intel Representative Contact for Licensing Information of RCFH-4 and BTX
123
Table 11. RCFH-4 Reference Thermal Solution Providers
123
Table 12. D60188-001 Reference Thermal Solution Providers
124
Table 13. Balanced Technology Extended (BTX) Thermal Solution Providers
124
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Intel Core2 Extreme QX9000 Series Datasheet (104 pages)
Data Sheet
Brand:
Intel
| Category:
Computer Hardware
| Size: 2.88 MB
Table of Contents
Table of Contents
3
1 Introduction
11
Core™2 Quad Processor Q9000 Series)
11
Terminology
12
Processor Terminology Definitions
12
References
14
2 Electrical Specifications
15
Power and Ground Lands
15
Decoupling Guidelines
15
VCC Decoupling
15
Vtt Decoupling
15
FSB Decoupling
16
Voltage Identification
16
Voltage Identification Definition
17
Reserved, Unused, and TESTHI Signals
18
Power Segment Identifier (PSID)
18
Voltage and Current Specification
19
Absolute Maximum and Minimum Ratings
19
DC Voltage and Current Specification
20
Voltage and Current Specifications
21
VCC Static and Transient Tolerance
24
VCC
24
VCC Overshoot
25
Die Voltage Validation
25
Signaling Specifications
26
FSB Signal Groups
26
Signal Characteristics
27
Signal Reference Voltages
27
CMOS and Open Drain Signals
28
Processor DC Specifications
28
GTL+ Signal Group DC Specifications
28
Open Drain and TAP Output Signal Group DC Specifications
28
Platform Environment Control Interface (PECI) DC Specifications
29
CMOS Signal Group DC Specifications
29
GTL+ Front Side Bus Specifications
30
PECI DC Electrical Limits
30
GTL+ Bus Resistance Definitions
30
Clock Specifications
31
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking
31
Core Frequency to FSB Multiplier Configuration
31
FSB Frequency Select Signals (BSEL[2:0])
32
Phase Lock Loop (PLL) and Filter
32
BCLK[1:0] Specifications
32
BSEL[2:0] Frequency Table for BCLK[1:0]
32
Front Side Bus Differential BCLK Specifications
32
FSB Differential Clock Specifications (1600 Mhz FSB)
33
FSB Differential Clock Specifications (1333 Mhz FSB)
33
Differential Clock Waveform
34
Measurement Points for Differential Clock Waveforms
34
3 Package Mechanical Specifications
35
Package Mechanical Drawing
35
Processor Package Assembly Sketch
35
Processor Package Drawing (Sheet 1 of 3)
36
Processor Package Drawing (Sheet 2 of 3)
37
Processor Package Drawing (Sheet 3 of 3)
38
Processor Component Keep-Out Zones
39
Package Loading Specifications
39
Package Handling Guidelines
39
Processor Loading Specifications
39
Package Insertion Specifications
40
Processor Mass Specification
40
Processor Materials
40
Processor Markings
40
Processor Top-Side Markings Example
40
Processor Land Coordinates and Quadrants, Top View
42
4 Land Listing and Signal Descriptions
43
Processor Land Assignments
43
Land-Out Diagram (Top View - Left Side)
44
Land Listing and Signal Descriptions
44
Land-Out Diagram (Top View - Right Side)
45
Alphabetical Land Assignments
47
VCC
48
Numerical Land Assignment
59
Alphabetical Signals Reference
64
Signal Description
64
5 Thermal Specifications and Design Considerations
75
Processor Thermal Specifications
75
Thermal Specifications
75
Processor Thermal Specifications
76
Core™2 Extreme Processor QX9770 Thermal Profile
77
Intel Core™2 Extreme Processor QX9650 Thermal Profile
78
Core™2 Quad Processor Q9000 and Q8000 Series Thermal Profile
79
Core™2 Quad Processor Q9000S and Q8000S Series Thermal Profile
80
Thermal Metrology
81
Processor Thermal Features
81
Thermal Monitor
81
Thermal Monitor 2
81
On-Demand Mode
83
Thermal Monitor 2 Frequency and Voltage Ordering
83
PROCHOT# Signal
84
THERMTRIP# Signal
84
Platform Environment Control Interface (PECI)
85
Introduction
85
TCONTROL and TCC Activation on PECI-Based Systems
85
Conceptual Fan Control Diagram on PECI-Based Platforms
85
PECI Specifications
86
PECI Command Support
86
PECI Device Address
86
PECI Fault Handling Requirements
86
PECI Gettemp0() Error Code Support
86
Gettemp0() Error Codes
86
6 Features
87
Power-On Configuration Options
87
Clock Control and Low Power States
87
Power-On Configuration Option Signals
87
Normal State
88
HALT and Extended HALT Powerdown States
88
HALT Powerdown State
88
Processor Low Power State Machine
88
Extended HALT Powerdown State
89
Stop Grant and Extended Stop Grant States
89
Stop-Grant State
89
Extended HALT Snoop State, Extended Stop Grant Snoop State
90
Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant Snoop State, and Stop Grant Snoop State
90
Extended Stop Grant State
90
HALT Snoop State, Stop Grant Snoop State
90
Sleep State
90
Deep Sleep State
91
Deeper Sleep State
91
Enhanced Intel Speedstep ® Technology
92
Processor Power Status Indicator (PSI) Signal
92
7 Boxed Processor Specifications
93
Introduction
93
Mechanical Representation of the Boxed Processor
93
Mechanical Specifications
94
Boxed Processor Cooling Solution Dimensions
94
Space Requirements for the Boxed Processor (Side View)
94
Space Requirements for the Boxed Processor (Top View)
94
Boxed Processor Fan Heatsink Weight
95
Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly
95
Electrical Requirements
95
Fan Heatsink Power Supply
95
Space Requirements for the Boxed Processor (Overall View)
95
Boxed Processor Fan Heatsink Power Cable Connector Description
96
Baseboard Power Header Placement Relative to Processor Socket
96
Fan Heatsink Power and Signal Specifications
96
Thermal Specifications
97
Boxed Processor Cooling Requirements
97
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View)
97
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)
97
Variable Speed Fan
98
Boxed Processor Fan Heatsink Set Points
98
Fan Heatsink Power and Signal Specifications
98
Boxed Intel
99
Core™2 Extreme Processor QX9650
99
Specifications
99
Boxed Intel ® Core™2 Extreme Processor QX9650 Fan Heatsink Weight
100
Space Requirements for the Boxed Processor (Side View)
100
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View)
100
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)
101
8 Debug Tools Specifications
103
Logic Analyzer Interface (LAI)
103
Mechanical Considerations
103
Electrical Considerations
103
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