Terminology; Processor Terminology Definitions - Intel Q9300 - Core 2 Quad 2.5 GHz 6M L2 Cache 1333MHz FSB LGA775 Quad-Core Processor Datasheet

The processor uses some of the infrastructure already enabled by 775_VR_CONFIG_05
platforms including heatsink, heatsink retention mechanism, and socket.
Manufacturability is a high priority; hence, mechanical assembly may be completed
from the top of the baseboard and should not require any special tooling.
1.1

Terminology

A '#' symbol after a signal name refers to an active low signal, indicating a signal is in
the active state when driven to a low level. For example, when RESET# is low, a reset
has been requested. Conversely, when NMI is high, a nonmaskable interrupt has
occurred. In the case of signals where the name does not imply an active state but
describes part of a binary sequence (such as address or data), the '#' symbol implies
that the signal is inverted. For example, D[3:0] = 'HLHL' refers to a hex 'A', and
D[3:0]# = 'LHLH' also refers to a hex 'A' (H= High logic level, L= Low logic level).
"Front Side Bus" refers to the interface between the processor and system core logic
(a.k.a. the chipset components). The FSB is a multiprocessing interface to processors,
memory, and I/O.
1.1.1

Processor Terminology Definitions

Commonly used terms are explained here for clarification:
• Intel
Edition processor in the FC-LGA6 package with two 6 MB L2 cache.
• Intel
LGA8 package with two 6 MB L2 caches or two 3 MB L2 caches.
• Intel
FC-LGA8 package with two 4 MB L2 caches or two 2 MB L2 caches..
• Intel
processor in the FC-LGA8 package with two 6 MB L2 caches or two 3 MB L2 caches.
• Intel
processor in the FC-LGA8 package with two 4 MB L2 caches or two 2 MB L2 caches
caches.
• Processor — For this document, the term processor is the generic form of the
®
Intel
processor Q9000, Q9000S, Q8000, and Q8000S series.
• Enhanced Intel
architecture-based desktop, mobile and mainstream server multi-core processors.
For additional information refer to:
coremicro/
• Keep-out zone — The area on or near the processor that system design can not
utilize.
• Processor core — Processor die with integrated L2 cache.
• LGA775 socket — The processor mates with the system board through a surface
mount, 775-land, LGA socket.
• Integrated heat spreader (IHS) —A component of the processor package used
to enhance the thermal performance of the package. Component thermal solutions
interface with the processor at the IHS surface.
• Retention mechanism (RM) — Since the LGA775 socket does not include any
mechanical features for heatsink attach, a retention mechanism is required.
Component thermal solutions should attach to the processor via a retention
mechanism that is independent of the socket.
• FSB (Front Side Bus) — The electrical interface that connects the processor to
the chipset. Also referred to as the processor system bus or the system bus. All
12
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Core™2 Extreme processor QX9000 series — Quad core Extreme
®
Core™2 Quad processor Q9000 series — Quad core processor in the FC-
®
Core™2 Quad processor Q8000 Series — Quad core processor in the
®
Core™2 Quad processor Q9000S series — Low power Quad core
®
Core™2 Quad Processor Q8000S Series — Low power Quad core
Core™2 Extreme processor QX9000 series, the Intel
® TM
Core microarchitecture — A new foundation for Intel
http://www.intel.com/technology/architecture/
Introduction
®
Core™2 Quad
®
Datasheet