Supermicro X13SEED-F User Manual page 3

About This Manual
This manual is written for system integrators, IT technicians and knowledgeable end users.
It provides information for the installation and use of the X13SEED-F/-SF motherboard.
About This Motherboard
The Supermicro X13SEED-F/-SF motherboard supports the 4th Generation Intel® Xeon®
Scalable Processor series in an LGA4677 socket with a thermal design power (TDP)
of up to 350W. Built with the Intel C741 chipset, the motherboard supports up to 2TB
DDR5 ECC RDIMM/3DSRDIMM memory with speeds of up to 4800 MT/s. It features superior
I/O expandability, including two PCIe 5.0 x16 right riser slots with FH/HL PCIe card support,
one PCIe 5.0 x16 left riser slot with LP PCIe card support, and two PCIe 5.0 x4 M.2 M-Key
slots in the 2280/22110 form factors. It also offers the most advanced data protection capability
with a Trusted Platform Module (TPM) 2.0 chip onboard. This motherboard is optimized for the
high-performance, high-end computing SuperEdge product line and addresses Telco, Cloud,
and IoT embedded needs with a short depth, high density Edge server solution.
The X13SEED-F supports a 1GbE RJ45 LAN port, and the X13SEED-SF supports a 1G
SFP port.
Note that this motherboard is intended to be installed and serviced by professional technicians
only. For processor/memory updates, refer to our website at
products/.
Conventions Used in the Manual
Special attention should be given to the following symbols for proper installation and to prevent
damage done to the components or injury to yourself:
Warning! Indicates important information given to prevent equipment/property damage
or personal injury.
Warning! Indicates high voltage may be encountered when performing a procedure.
Important: Important information given to ensure proper system installation or to
relay safety precautions.
Note: Additional Information given to differentiate various models or provides infor-
mation for correct system setup.
Preface
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Preface
http://www.supermicro.com/