Instrument Layout - Agilent Technologies 1200 Series Manual

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Introduction

Instrument Layout

Instrument Layout
The industrial design of the module incorporates several innovative features.
It uses Agilent's E-PAC concept for the packaging of electronics and
mechanical assemblies. This concept is based upon the use of expanded
polypropylene (EPP) layers foam plastic spacers in which the mechanical and
electronic boards components of the module are placed. This pack is then
housed in a metal inner cabinet which is enclosed by a plastic external
cabinet. The advantages of this packaging technology are:
• virtual elimination of fixing screws, bolts or ties, reducing the number of
• the plastic layers have air channels molded into them so that cooling air can
• the plastic layers help cushion the electronic and mechanical parts from
• the metal inner cabinet shields the internal electronics from
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components and increasing the speed of assembly/disassembly,
be guided exactly to the required locations,
physical shock, and
electromagnetic interference and also helps to reduce or eliminate radio
frequency emissions from the instrument itself.
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