Altitude; Cleanliness - HP FlexNetwork HSR6802 Installation Manual

Table 1 Temperature requirements
Item
Operating Temperature
Storage Temperature
Table 2 Humidity requirements
Item
Operating humidity (noncondensing)
Storage humidity (noncondensing)

Altitude

Table 3 Altitude requirements
Item
Operating altitude
Storage altitude

Cleanliness

Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of
metal components and contact points, especially when indoor relative humidity is low. In the worst
case, electrostatic adsorption can cause communication failure.
Table 4 Dust concentration limit in the equipment room
Substance
Dust particles
NOTE:
Dust particle diameter ≥ 5 µm
The equipment room must also meet strict limits on salts, acids, and sulfides to eliminate corrosion
and premature aging of components, as shown in
Table 5 Harmful gas limits in an equipment room
Gas
SO
2
H S
2
NH
3
Cl
2
Temperature
0°C to 45°C (32°F to 113°F)
–40°C to +70°C (–40°F to +158°F)
Humidity
10% RH to 95% RH
5% RH to 95% RH
Altitude
–60 m (–196.85 ft) to 4 km (2.49 miles)
–60 m (–196.85 ft) to 4.5 km (2.80 miles)
Concentration limit (particles/m
4
≤ 3 x 10
(No visible dust on desk in three days)
Table
3
Max. (mg/m )
0.2
0.006
0.05
0.01
4
3
)
5.