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7012 G Series
Service Guide

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Summary of Contents for IBM 7012 G Series

  • Page 1 7012 G Series Service Guide...
  • Page 2 Third Edition (April 1997) This edition notice applies to the 7012 G Series Service Guide. This edition obsoletes all previous editions. The following paragraph does not apply to the United Kingdom or any country where such provisions are inconsistent with local law: THIS PUBLICATION IS PRINTED “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
  • Page 3: Table Of Contents

    Table of Contents Communications Statements ..........Safety Notices .
  • Page 4 ..... 3-1520-1 MAP 1520: 7012 G Series System Unit - Power Map ......
  • Page 5 ........7012 G Series Expansion Unit Unique Parts .
  • Page 6 Service Guide...
  • Page 7: Communications Statements

    Communications Statements The following statement applies to this product. The statement for other products intended for use with this product appears in their accompanying manuals. Federal Communications Commission (FCC) Statement Note: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules.
  • Page 8: Vcci Statement

    European Union (EU) Statement This product is in conformity with the protection requirements of EU Council Directive 89/336/EEC on the approximation of the laws of the Member States relating to electromagnetic compatibility. Neither the provider nor the manufacturer can accept responsibility for any failure to satisfy the protection requirements resulting from a non-recommended modification of the product, including the fitting of option cards not supplied by the manufacturer.
  • Page 9: Radio Protection For Germany

    Radio Protection for Germany Dieses Gerät ist berechtigt in Übereinstimmung mit dem deutschen EMVG vom 9.Nov.92 das EG-Konformitätszeichen zu führen. Der Aussteller der Konformitätserklärung ist die IBM Germany. Dieses Gerät erfüllt die Bedingungen der EN 55022 Klasse A. Für diese Klasse von Geräten gilt folgende Bestimmung nach dem EMVG: Geräte dürfen an Orten, für die sie nicht ausreichend entstört sind, nur mit besonderer Genehmigung des Bundesministers für Post und Telekommunikation oder des Bundesamtes...
  • Page 10 Service Guide...
  • Page 11: Safety Notices

    Safety Notices Note: For a translation of these notices, see System Unit Safety Information , order number SA23-2652. Definitions of Safety Notices A danger notice indicates the presence of a hazard that has the potential of causing death or serious personal injury. A danger notice appears on the following pages: 3-1520-1 4-44...
  • Page 12: Laser Safety Information

    Laser Safety Information The optical drive in this system unit is a laser product. The optical drive has a label that identifies its classification. The label, located on the drive, is shown below. CLASS 1 LASER PRODUCT LASER KLASSE 1 LUOKAN 1 LASERLAITE APPAREIL A LASER DE CLASSE 1 TO IEC 825:1984 CENELEC EN 60 825:1991...
  • Page 13: About This Book

    About This Book This book provides maintenance information that is specific to the 7012 G Series system unit, adapters, and attached devices that do not have their own service information. It also contains Maintenance Analysis Procedures (MAPs) that are not common to other systems.
  • Page 14: Chapter 1. Reference Information

    Chapter 1. Reference Information Use the following views of the system unit to locate the feature positions, connectors, and system board slot positions. Base Unit System Unit Locations Front Door Rear Cover Media Bays 3.5-Inch Diskette Left Side Drive Cover Key Mode Switch Reset Button...
  • Page 15: Rear View Without Cover

    Rear View without Cover Power Cord Receptacle Keyboard Adapters Mouse Power Control Port (RS-485) 9-Pin Serial Port (S3) Rear 25-Pin Serial Port (S1/S2) Parallel Port (P1) Service Guide...
  • Page 16: Side View Without Covers

    Side View without Covers Power Supply Media Drive Position A Media Drive Micro Position B Channel Key Mode Switch Adapter Cards Diskette Drive Position C RS-485 Card Operator Panel Rear Front Fan First CPU Card Position 1 System Planar Optional Second CPU Card Position 0 Memory Card Position A...
  • Page 17: Memory Cards

    Memory Cards There are four types of memory cards as shown below. Memory cards can house from one to four memory module kits composed of four memory modules each, which comply with the JEDEC standard for 68 pin, ECC, 60 ns, 5 volt memory modules. The figure below illustrates the types of memory cards.
  • Page 18: Serial Port Splitter Cable

    NF256 board, based on 16M bit technology, which gives 256MB memory. It contains two MM128 memory module kits. NF512 board, based on 16M bit technology, which gives 512MB memory. It contains four MM128 memory module kits. NF1024 board, based on 16M bit technology, which gives 1024MB memory. It contains four MM256 memory module kits.
  • Page 19: Expansion Unit System Unit Locations

    Expansion Unit System Unit Locations Description of the Disk Expansion Unit The disk expansion unit is used to increase the number of media devices and/or disk drives. All hardware components inside the disk expansion unit are accessible from the left side after having removed the unit covers.
  • Page 20 Rear Side The following figure shows the rear side of the disk expansion unit. Power Cord Connector SCSI Connector To Base Unit RS-485 In Port RS-485 Out Port Rear Fan Disk Expansion Unit SCSI Bus The disk expansion unit is equipped with one internal SCSI bus. It is driven by means of a SCSI-2 single-ended controller via an external connection.
  • Page 21 RS-485 Card The RS-485 card is installed in the rear of both the base and the disk expansion units. It is provided with a variety of connectors, whose functions are explained in the following figures. Power Connector Power/Signal Connector (Coming From the Power Supply (Coming From the Operator Panel) INTERNAL VIEW EXTERNAL VIEW (BASE UNIT)
  • Page 22: Cluster Power Control

    Connectivity from any attached CPU to any disk drive drawer Central power-on and power-off through the TTY. The CPC provides ports for connection of multiple 7012 G Series system units, 7013 J Series system units, and 7015 Model R30, R40, and R50 CPU enclosures for interface connection of CPUs and disk drive drawers.
  • Page 23: System Planar Connector Locations

    System Planar Connector Locations Serial Ports 1 and 2 (with splitter) Parallel Port Serial Port 3 RS-485 Connector Keyboard/Mouse Card Connector Micro Channel Memory Adapter Slots Card CPU Card Position 1 (Optional) CPU Card Position 0 Diskette Drive Connector Power Supply Memory Signal Cable Card...
  • Page 24: Data Flow

    Data Flow Operator Panel Power Supply Micro Processor S1 BUMP Console Battery S2 Service Console Reset/Scroll Button Parallel Interface Keylock Diskette Drive System Planar System EEPROMs VPD EPROMs TOD Clock CPU Array NVRAM Flash EPROM Backup EPROM CPU card I2C bus COP bus Standard BUMP...
  • Page 25: Power Flow

    Power Flow System AC Cable Power Supply Standby Power Voltages Voltages +5 +12 –12 +5 +3,3/3,6 –12 Rear Fan Module EEPROM Front Fan Module 3.5-inch Diskette Memory Card Operator Panel System Planar System Guard CPU Cards Processor Disk Disk Local Console Access Media Media...
  • Page 26: Scsi Cable Routing

    SCSI Cable Routing 6-Position SCSI Cable Upper dev. SCSI controller Lower dev. Terminator F (2) G (3) 3rd disk 4th disk D (0) E (1) 1st disk 2nd disk 4-Position SCSI Cable Upper dev. SCSI controller Lower dev. Terminator D (0) E (1) 1st disk 2nd disk...
  • Page 27: Specifications

    Specifications Dimensions (Vertical Position) Height: 450mm (17.5 inches) Depth: 613mm (28.2 inches) Width: 173mm (6.9 inches) Weight (Maximum) 19 kg to 25 kg (43 to 55 pounds) Operating Environment – Class B Temperature: 16 to 32 C (60 to 90 F) Humidity: 8% to 80% Maximum Wet Bulb: 23 C (60 F) Maximum Altitude: 2133 m (7000 feet)
  • Page 28: Power Cables

    Power Cables To avoid electrical shock, a power cable with a grounded attachment plug is provided. Use only properly grounded outlets. Power cables used in the U.S.A. and Canada are listed by Underwriter’s Laboratories (UL) and certified by the Canadian Standards Association (CSA). These power cords consist of: Electrical cables, Type SVT or SJT.
  • Page 29: Service Inspection Guide

    Service Inspection Guide Perform a service inspection on the system when: The system is inspected for a maintenance agreement. Service is requested and service has not recently been performed. An alterations and attachments review is performed. Changes have been made to the equipment that may affect the safe operation of the equipment.
  • Page 30 7. Check for alterations or attachments. If there are any, check for obvious safety hazards such as broken wires, sharp edges, or broken insulation. 8. Check the internal cables for damage. 9. Check for dirt, water, and any other contamination within the system unit. 10.Check the voltage label on the back of the system unit to ensure that it matches the voltage at the outlet.
  • Page 31: Chapter 2. Using System Guard

    Chapter 2. Using System Guard This chapter introduces the SystemGuard service processor which is included in all Symmetric Multiprocessor models. Introduction SMP servers include a service processor, called SystemGuard, as a standard feature. SystemGuard continually monitors the hardware as well as the operating system. If, for instance, a CPU fails, the system detects this, reboots itself automatically and runs the built-in diagnostics on the hardware.
  • Page 32: Systemguard Power

    SystemGuard Power SystemGuard has its own DC power boundary. This means that even if the system power is off (power button of the system in the off position), SystemGuard is still powered on, as long as the unit is still plugged into a power outlet. This allows control of the system even though the system is down.
  • Page 33: The Operator Panel

    Reset Button Operator Panel Display Note: In the 7012 G Series the system board contains the NVRAM, the NVRAM battery, and the TOD. You can drain NVRAM by disconnecting the NVRAM battery. When NVRAM is drained it results in a reset of the TOD to 1969 which affects applications.
  • Page 34: Systemguard Consoles

    SystemGuard Consoles SystemGuard works with two types of consoles: The Bump Console , which is an ASCII terminal attached to the S1 serial port. This console provides the normal input to the BUMP. It can be local or remote. The line speed for the BUMP console must be set to 9600 baud for either type of connection.
  • Page 35: Init Phase

    Init Phase Init phase is entered when the power button on the Operator Panel is pressed on or when the power-on command is entered on the BUMP Console or Service Console. If the System Key is in Normal mode, the BUMP runs the built-in or resident power-on (PON)-tests on the system hardware, IPLs on the first available processor, runs the functional power on self-tests (POST) on the I/O subsystem to check the system, and finally loads the AIX operating system.
  • Page 36 Phase Change (Stand-By to Init Stage) The phase change from Stand-By to Init is called crossing the power boundary. This is achieved by pushing the power button on the Operator Panel or by typing the keyword power at the Stand-By prompt (>). Note that if you type power while the power button is not pushed in, nothing happens until you press the power button.
  • Page 37 Power-on (PON) Tests PON tests are run by SystemGuard whenever the system power comes on. There are two types of tests: A comprehensive set of tests are performed on the processors, cache, memory and related hardware when the Fast-IPL flag is disabled. A minimum core set of tests are performed on the processors, cache, memory and related hardware during fast-IPL which cannot be turned off.
  • Page 38 Enabling at least one processor from the STAND-BY MENU There are other resident PON tests to check other system resources. These tests are a subset of the SystemGuard maintenance offline tests, and reside within the flash EEPROM. These tests are divided into the following groups: BUMP Quick I/O Test Group These tests check the accessibility and the functions of the standard and direct I/O components from the BUMP: Async lines...
  • Page 39: Systemguard Parameters And Flags

    Phase Change (Init to Boot) The maintenance phase is entered from the Init phase if the system key is in service mode. If the BUMP console present flag is set, the MAINTENANCE MENU is displayed on the BUMP console, and the system waits for an operator action. The maintenance menu choices are described on page 2-21.
  • Page 40: Working With Systemguard

    Working with SystemGuard You can change SystemGuard parameters and flags from different locations They can be changed from the SystemGuard STAND-BY MENU, the SystemGuard MAINTENANCE MENU, the Diagnostics interface, and also from AIX. When the key signal is received, SystemGuard clears the screen and displays the SystemGuard prompt.
  • Page 41: Systemguard Menus

    When the system is in Stand-By mode and the System Key (Physical or Electronic Key) is in Service mode, the STAND-BY MENU can be accessed and SystemGuard executed. If you turn the system unit power on from Stand-By mode with the System Key in the Normal position, the system boots to AIX Multi-User.
  • Page 42: Stand-By Menu

    Stand-By Menu The STAND-BY MENU can only be entered when the system is in Stand-By mode (the word Stand-By must be displayed on the LCD display). Perform the following steps to bring up the STAND-BY MENU. 1. With Stand-By displayed on the LCD display press the Enter key on the BUMP console. The Stand-By prompt is the greater than (>) sign.
  • Page 43 Display Configuration (option 0). The first-level screen is displayed with features and devices that can be configured. Here is an example of the display configuration screen for a 7013 J Series system. The screens for the 7012 G Series are similar: Display Configuration SID TM...
  • Page 44 Display Configuration SIB14 PS04 SIB24 SIB15 PS05 SIB25 SIB16 PS06 SIB26 fc8e000000000000 SIB17 PS07 SIB27 D78605 19H0464 D78605 01 C fc8e000000000000 MCAe 01 C e1ff000000000000 02 C f48e000000000000 MCAe 02 C 708f000000000000 03 C fc8e000000000000 MCAe 03 C ec8f000000000000 04 C ffde000000000000 MCAe 04 C fc8e000000000000...
  • Page 45: Set Flags

    CPUx EC+s: The agent status information of the CPU cards and the VPD information is given. MCx EC+s: This field gives the memory card VPD values. MCAx loc. code+status: This parameter contains the location code and the status information of the Micro Channel adapters (MCA). The contents of the 8 programmable option select (POS) registers are also displayed in the second column.
  • Page 46: Set Unit Number

    and parameters (set during manufacturing), see the table in “Default Parameter Values” on page B–1 of the service guide for your system. The following flags can be managed: Remote Authorization: Only the local operator can enable this flag to enable remote maintenance to be performed.
  • Page 47 Set Configuration This menu option enables you to configure or unconfigure units and devices. 1. Enter 3 in the main menu to select this option. 2. You should then see a first-level screen similar to the following. It displays the units and devices that can be configured, along with their menu index number: Set Configuration 00 CPU0...
  • Page 48: Ssbus Maintenance

    SSBus Maintenance This option is used to investigate and check devices on the SSBus and is meant only for trained service personnel. Use this option to investigate and check devices on the SSBus. 1. Enter 4 in the main menu to select this option. SystemGuard displays the following menu, which allows you to read the time of day (TOD) registers and to read or write the non-volatile random access memory (NVRAM) and lines S1 and S2.
  • Page 49 C Maintenance Use this option to do maintenance operations on the I C buses of a selected unit, in order to investigate and check the connected devices. When exiting this menu, the previous status of the OP and SIB microcontrollers are restored (except for voltage margins). 1.
  • Page 50 Set voltage margins Note: This option can be only used for error analysis or factory test and must be used only by trained service personnel. Restore nominal voltage values before restarting other operations. Any data written on the disk in marginal mode must be removed before restarting normal operations.
  • Page 51: Maintenance Menu

    Maintenance Menu The MAINTENANCE MENU also enables you to display the configuration of the system in a non-cryptic, easily understandable way, to perform various tests, to continue IPL either from network, a specific SCSI device or from the boot list, and to set flags concerning various system operation.
  • Page 52: Display Configuration

    Display Configuration Use this option to view the system hardware configuration. This option provides different screens with the following levels of information: System-level information Unit-level information Device-level information. Enter 0 in the MAINTENANCE MENU to select the Display Configuration option. Display Configuration –...
  • Page 53 Voltage Margins for CPUs, ASICs, and other components. Device status information. Options to select various types of devices. DISPLAY CONFIGURATION – MAIN UNIT MARGINS VALUE: +5 VOLT –> Normal CPU (3.65 VOLT) –> Normal ASIC (3.6 VOLT) –> Normal SCSI DEVICES: Present –>...
  • Page 54 1. To see device-level information, enter the corresponding command number for the device. The device-level screen is displayed. 2. Enter x to return to the system-level configuration display screen. Display Configuration – Device Level This screen is shown when you select one of the devices of your choice from either the Main Unit or Unit 1 screen.
  • Page 55: Display Bump Error Log

    Display BUMP Error Log Use this option to view the BUMP firmware error log. 1. Enter 1 in the MAINTENANCE MENU to select this option. The contents of the logging buffer are displayed as shown in the following screen: DISPLAY BUMP ERROR LOG EVENT # 1: 40140100000000000000000000000000000000000000000000000000000000000 00000000000000000000000000000000000000000000000000000000000000000...
  • Page 56: System Boot

    1. Enter 0 to select the bus identification number. The system displays: BUS# [0>Internal | 1>External or x: exit] BUS 0 represents the Micro Channel bus in the 7012 G Series, The Change Bus option is not available on the 7012 G Series because the Micro Channel bus is not extended beyond the system board.
  • Page 57 2. Enter 1 to select the slot number. The system displays: SLOT# [1–6 (Internal Bus) | or x: exit] Enter your choice. The displayed location code is updated. Note: Bus choice is not available on 7012 systems. 3. Enter 2 to select the SCSI identification number. The system displays: SCSI ID [0–F or x: exit] Enter your choice.
  • Page 58: Off-Line Tests

    Off-Line Tests Attention: These menus are only to be used when directed by service support personnel. Some of the tests described require test equipment or resources not available on your system. This option under the MAINTENANCE MENU enables you to run the off-line tests in a controlled and interactive mode.
  • Page 59: Build Test List

    Displays the build test menu, which enables you to specify the test list (see “Build Test List” below). Displays and enables modification of the tests in the build list (see page 2-31). Deletes the tests in the build list, after operator confirmation. Attempting to delete tests from an empty list causes an error message to be displayed.
  • Page 60 3. Once you have selected the test groups, you can specify individual tests within a group. For example, the following screen enables you to specify individual BUMP Quick IO tests: BUILD TEST LIST GROUP 01 BUMP QUICK IO TEST DESCRIPTION TEST DESCRIPTION DEBUG LINE...
  • Page 61: Modify/Display Test List

    Modify/Display Test List Once the test list is built, you can use this option to view or modify it. Each test is identified by a number xxyy , where xx is the group number and yy is the test number. 1.
  • Page 62: Execute Test List

    Execute Test List This command enables you to run the test list once it is built (and possibly modified). All the tests in the test list are run one at a time with the selected execution options. Enter 3 in the OFF-LINE TESTS main menu to run the selected tests. The following screen displays the selected execution parameters for the test list.
  • Page 63: Power-On Command Parameters

    Power-On Command Parameters During the standby idle phase, the system power can be turned on (and the IPL started) by entering a BUMP console power-on string through line S1 or a service console power-on string through line S2 (see “Working with SystemGuard” on page 2-10 for a description of available keywords).
  • Page 64 Set Configuration This command is used to configure electronic boards like I/O cards or Micro Channel adapter (MCA) devices. 1. Enter 2 in the SET PARAMETERS menu to display the SET CONFIGURATION menu as shown below: SET CONFIGURATION 0> CPU CARD 1>...
  • Page 65 1. Enter 3 in the SET PARAMETERS menu to display the PHONE NUMBERS menu shown here: PHONE NUMBERS 0> SERVICE CENTER DIAL–OUT (1) –> 1> SERVICE CENTER DIAL–OUT (2) –> 2> CUSTOMER HUB DIAL–OUT (1) –> 3> CUSTOMER HUB DIAL–OUT (2) –> 4>...
  • Page 66 Enter 4 in the SET PARAMETERS menu to display the MISCELLANEOUS PARAMETERS menu. The value set for all the flags, except Fast IPL , is permanent until a new change is made. MISCELLANEOUS PARAMETERS 0> BUMP CONSOLE –> Present 1> AUTOSERVICE IPL –> Disabled 2>...
  • Page 67 2. The new flag status (opposite of the previous state) is displayed. Boot Multiuser AIX In Service Flag Enables multiuser AIX boots to proceed even if the Mode Switch is in the Service position (when booting by selecting option 6 in the MAINTENANCE MENU).
  • Page 68: Set National Language

    Set National Language Use this option in the main menu to set the national language used for “SystemGuard”. Once selected, the effect is immediate and all the console messages are presented in the selected language. 1. Enter 9 in the MAINTENANCE MENU to select this option. The following menu is displayed: SET NATIONAL LANGUAGE 0>...
  • Page 69: Some Common Systemguard Tasks

    Some Common SystemGuard Tasks The following tasks are done through the STAND-BY and MAINTENANCE MENUs that are part of SystemGuard. Note that these tasks can also be carried out from AIX diagnostics. How to Set the Electronic Key The key can be set electronically, making it easier to provide remote support without physically touching the machine.
  • Page 70 DISPLAY CONFIGURATION MACHINE TYPE/MODEL: 7013J30 45067 FIRMWARE RELEASE: Standby –> 1600 Backup eprom –> 0701 Flash eprom –> 0704 SERVICE CONTRACT: Last update (yymmdd) –> 950707 Validity –> Unlimited contract Remote service support –> Valid Quick On Call service –> Not valid AUTO DIAL: Disabled CONSOLES:...
  • Page 71 Setting Fast IPL through the Maintenance Menu 1. Enter the MAINTENANCE MENU. 2. Enter 8 to select the SET PARAMETERS menu. 3. Enter 4 from the SET PARAMETERS menu to select the MISCELLANEOUS PARAMETERS Menu. 4. Option 3 in this menu should show the current status of the Fast IPL flag. If it is disabled, simply enter 3, and the flag changes to enabled.
  • Page 72 How to Set the Service Line Speed By default, the service line speed is 1200 baud or 2400 baud depending on the level of SystemGuard. This speed can be changed through the SystemGuard MAINTENANCE MENU. In order to use the Service Console properly, the terminal connected to the S2 connector has to be set to the same speed.
  • Page 73 Setting Line Speed through AIX 1. With AIX up and running, log in as user root . 2. Type the following command to view current settings: mpcfg –dm The following is the output of the command: Index Name Value Modem Parameters File Name Service Line Speed Protocol Inter Data Block Delay Protocol Time Out...
  • Page 74 How to Set Up Console Mirroring Console Mirroring Concepts Console mirroring is a way to provide the customer a view of what the person working remotely from the Service Console is doing on the system. When mirroring is active, the Service Console and the BUMP Console are logically identical, and both are tty0 (tty1 is disabled when the mirroring starts).
  • Page 75 Setting Up Console Mirroring In order to setup console mirroring, you need first to authorize the Service Console, and set up the right line speed. Refer to previous chapters on how to set up the service line speed and how to authorize the Service Console. Then do the following: 1.
  • Page 76 How to Enable Surveillance Surveillance is implemented by the survd daemon. This daemon, when started, establishes a heartbeat between AIX and SystemGuard. In case of an AIX hang, SystemGuard detects it and reboots the system. To implement the surveillance, do the following: 1.
  • Page 77: Modem Configuration

    Modem Configuration The modem on line S2 must be configured using an ASCII modem configuration file which describes various parameters using a specific syntax. AIX uses this file directly. SystemGuard uses the same information (in condensed form) stored in non-volatile memory (NVRAM).
  • Page 78 How to Reboot AIX from the Remote Service Console It is possible for the remote personnel connected via the Service Console to reboot AIX from the remote site. Prerequisites The following procedure must be carried out from the BUMP Console in order to allow AIX to boot remotely from the Service Console.
  • Page 79 Rebooting to Single-User and then to Multi-User This allows the remote support personnel connected to the system via a modem to the S2 port to shut down and reboot the system in Diagnostics mode for hardware diagnostics purposes. After running diagnostics, the remote personnel can reboot the system in AIX Multi-User without having a need to physically touch the machine.
  • Page 80 3. From this menu, enter 4. to select the MISCELLANEOUS PARAMETERS menu, which is similar to the following: MISCELLANEOUS PARAMETERS 0> BUMP CONSOLE –> Present 1> AUTOSERVICE IPL –> Disabled 2> DIAL_OUT AUTHORIZATION –> Disabled 3> FAST IPL –> Enabled 4>...
  • Page 81 10.At this point, a BOOT FROM SCSI DEVICE screen appears. This displays the PRESENT DEVICE LOCATION CODE. If it is not the device you want to boot from, go through each option and change it to the desired BUS, SLOT, SCSI ID, and LUN ID. Option 4 allows you to change all these options at once.
  • Page 82 How to Boot from the Network The system can be booted from the network through the MAINTENANCE MENU. Network boot allows a system to be reinstalled via the network and also allows various maintenance tasks to be carried out on the local machine. Use the following procedure to boot from the network: 1.
  • Page 83 5. The SELECT BOOT (STARTUP) DEVICE menu appears, which is similar to the following: SELECT BOOT (STARTUP) DEVICE Select the device to BOOT (Startup) this machine. WARNING: If you are using Token–Ring, selection of an incorrect data rate can result in total disruption of the Token–Ring network.
  • Page 84 7. Enter the appropriate IP addresses, and enter 99 to return to the MAIN MENU. A screen similar to the following appears: MAIN MENU Select BOOT (Startup) Device Select Language for these Menus Send Test Transmission (PING) Exit Main Menu and Start System (BOOT) Type the number for your selection, then press ”ENTER”...
  • Page 85 How to Disable and Enable Processors In the SMP servers, it is possible to disable/enable processors. A suspected faulty processor can be disabled so that the system can run without it. The processors can be disabled/enabled through the STAND-BY MENU, MAINTENANCE MENU, Diagnostics, or through AIX commands.
  • Page 86 5. Enter 04 to deconfigure CPU1. You should see the status changed to D, disabled. CPU1 | Status 00 CPU0 01 CPU0 02 CPU0 03 CPU1 04 CPU1 05 CPU1 Select(x:exit): 6. Now, once the system is rebooted, it runs without processor 1. 7.
  • Page 87 5. The CPU CARD screen appears and looks similar to the following: CPU CARD – (CPU1) PRESENT CONDITIONS: PR #0 –> Valid & Enabled PR #1 –> Valid & Enabled COMMANDS: 0> ENABLE 1> DISABLE 2> TEMPORARY DISABLE SELECT [x:exit]: 6.
  • Page 88: Customizing Systemguard For Your Needs

    Customizing SystemGuard For Your Needs SystemGuard is controlled by several flags. The flags consist of Contract Flags, Operational Flags, Remote Maintenance Flags, and Test Flags. Remote Service Flag This flag is disabled at the factory and must be enabled for remote service Operational Flags The Operational Flags are the BUMP Console flag, the AutoService IPL flag, and Set Mode to Normal When Booting flag, which are enabled at the factory, however, they can be...
  • Page 89 Phone Numbers If remote maintenance is used, SystemGuard requires several phone numbers to be entered. Additional information is provided in “Phone Numbers” on page 2-34. Service Line Speed Parameters If remote maintenance is used, SystemGuard requires that the line speed be configured. The default is 1200 baud.
  • Page 90: Reloading The Flash Eeprom

    Reloading the Flash EEPROM Follow this procedure to load a new version of SystemGuard into the flash EEPROM. Only system administrators should perform this procedure. Prerequisites To install a new version of the FLASH EEPROM firmware, you need either a firmware diskette containing a binary firmware image, or a file containing the firmware.
  • Page 91: Chapter 3. Maintenance Analysis Procedures (Maps)

    MAP step in the Diagnostic Information For Micro Channel Bus Systems . This procedure is used to locate power problems in 7012 G Series system units. If a problem is detected, this procedure helps you isolate the problem to a failing unit.
  • Page 92: Power Supply Status

    Power Supply Status In 7012 G Series models, if the system detects a power supply failure on the base unit or MCA expansion unit, it turns the power off and displays SRN 409-Axy, where xy is the hexadecimal value of the power status register and gives some information on the power fault, as described in this MAP.
  • Page 93 Step 3 (from Step 2) Is the operator panel display illuminated? Go to Step 4 Go to Step 6 Step 4 (from Step 3) 1. Check that the external power cable to the system unit has continuity. 2. Check that the external power cable is plugged into both the system unit and the power outlet.
  • Page 94 Step 6 (from Step 3) Note: Either the Operator Panel (99 % failure probability) or the system planar (1 % failure probability) is defective. 1. Unplug the system unit power cable from the wall outlet. 2. Exchange the operator panel. See “Operator Panel” on page 4-11. 3.
  • Page 95 Step 8 (from Step 7) 1. Power on the system unit, with the key mode switch set to Service. 2. Find your symptom in the following table; then follow the instructions given in the Action column. Symptom Action The power-on light does not come on or If SRN is 409–Axy, go to step 9, otherwise comes on and does not stay on.
  • Page 96 Step 9 (from Step 1 and 8) The xy value in SRN 409-Axy is the hex value for the Power Status Register byte. Line 2 of the operator panel display identifies the unit that contains the error. The bits in the Power Status Register are defined as follows: 8 4 2 1 8 4 2 1 = Hex value of bits 7 6 5 4 3 2 1 0 = Bit numbering...
  • Page 97 (from Step 9) An over temperature problem can be caused by an environmental problem (see Specifications on page 1-15 in 7012 G Series Service Guide ) or blocked air ducts. Check each of these items. Did you find the problem? Go to Step 11.
  • Page 98 3-1520-8 Service Guide...
  • Page 99: Map 1540:7012 G Series Minimum Configuration

    The MAP steps on the following pages instruct you to reduce the system to one or more of the following configurations: Minimum Configurations for the 7012 G Series Systems: – System planar, operator panel, CPU card, and memory card. If no failure is detected, the maintenance menu is displayed. Any other response means one of the remaining FRUs is failing.
  • Page 100 Step 1 (from Step 3, 6, 7, 9, 10, 17) 1. Ensure that the diagnostics and the operating system are shut down. 2. Turn the key mode switch to the Service position. 3. Sometimes an SRN or Error Code will be logged in the BUMP Error Log. Before proceeding, check the BUMP Error Log for any SRNs or Error Codes.
  • Page 101 Note: Before verifying any condition indicated in the following steps of this MAP (for example, a certain code displayed on the operator panel display), be sure that the system activity has stopped on that condition (same condition for more than 3 minutes except for 165, which may display up to ten minutes with no activity on the BUMP console).
  • Page 102 Step 2 (from Step 1) 1. Power off the system. 2. Unplug the system unit power cord from the wall outlet. 3. Record the slot numbers of the adapters. Label and record the location of any cables attached to the adapters. Remove all the adapters from the MCA area. 4.
  • Page 103 Step 3 (from Step 2) One of the parts installed into the system unit is defective. To test each part, exchange them in the following order: 1. System planar 2. CPU card 3. Memory card 4. Power supply 5. Operator panel The system is working correctly if the maintenance menu is displayed.
  • Page 104 Step 4 (from Step 2) No failure was detected with this configuration. 1. Power off the system unit. 2. Unplug the system unit power cord from the wall outlet. 3. If any CPU cards were removed, install a CPU card and continue with substep 4. If there are no additional CPU cards, perform the steps under the YES answer below.
  • Page 105 Step 5 (from Step 4) The failure may be caused by the last CPU card (CPU) or memory card (MC) installed. To isolate the failing card, do the following: 1. Power off the system unit. 2. Unplug the system unit power cord from the wall outlet. 3.
  • Page 106 Step 6 (from Step 5) One of the installed parts is defective. To test each part, exchange them in the following order: System planar CPU card Memory card Power supply The system is working correctly if it stops with 269 displayed in the operator panel display or if the Maintenance Menu displays.
  • Page 107 Step 7 (from Steps 1, 2, and 4) 1. Power off the system unit. 2. Unplug the system unit power cord from the wall outlet. 3. Record the slot numbers of the adapters. Label and record the location of any cables attached to the adapters.
  • Page 108 Step 8 (from Steps 7 and 17) The system is working correctly with this configuration. One of the adapters or devices that you removed is probably defective. 1. Power off the system unit. 2. Unplug the system unit power cord from the wall outlet. 3.
  • Page 109 Step 9 (from Step 8) 1. Power off the system unit. 2. Unplug the system unit power cord from the wall outlet. 3. Starting with the last installed adapter, disconnect one attached device and cable. 4. Insert the diagnostic CD-ROM disc into the CD-ROM drive. 5.
  • Page 110 Step 10 (from Step 1) 1. Set the power button on the system unit to Off. 2. Unplug the system from the electrical outlet. 3. Record the slot numbers of the adapters. Label and record the location of any cables attached to the adapters.
  • Page 111 Step 11 (from Step 10) 1. Follow the instructions on the display to select your console. 2. When the Diagnostics Operating Instructions display, press the Enter key. 3. If the terminal type has not been defined or you are IPLing from CD-ROM, you must use the Initialize Terminal option on the FUNCTION SELECTION menu to initialize the AIX operating system environment before you can continue with the diagnostics.
  • Page 112 Step 13 (from Step 19, 20, 21, 22) 1. Set the power button on the system unit to Off. 2. Unplug the system from the electrical outlet. 3. Record the location of all the internal SCSI devices attached to the SCSI bus you are attempting to IPL from.
  • Page 113 Step 14 (from Step 13) This problem can be caused by: – the CD-ROM pulling the bus down or opening the positive temperature coefficient (PTC) on the SCSI adapter – a defective SCSI adapter – a defective terminator – a defective System Board (ELM) –...
  • Page 114 Step 16 (from Steps 14 and 15) In the following order, exchange the FRUs that have not been exchanged: 1. SCSI adapter 2. CD-ROM drive (if still in the system). 3. System Board (ELM) 4. SCSI cable Test each FRU by trying to load diagnostics from CD-ROM if installed or disk.
  • Page 115 Step 17 (from Step 16) 1. Set the power button on the system unit to Off. 2. Unplug the system from the electrical outlet. 3. Record the slot numbers of the adapters. Label and record the location of any cables attached to the adapters.
  • Page 116 Step 18 (from Step 13) The system is working correctly with this configuration. One of the devices that you removed is probably defective. 1. Set the power button on the system unit to Off. 2. Unplug the system from the electrical outlet. 3.
  • Page 117 Step 19 (from Step 1) This problem can be caused by: – a SCSI device pulling the bus down or opening the PTC on the SCSI adapter. – a defective SCSI adapter – a defective terminator – a defective system board (ELM) –...
  • Page 118 Step 20 (from Step 1) A message should be displayed with the flashing 269. Find the message in the table and do the listed action. Message Displayed Perform the Listed Action(s) 269 - NO BOOTABLE Go to Step 21. 269 - NO DEVICE Go to Step 13.
  • Page 119: Electrical Safety

    Chapter 4. Removal and Replacement Procedures This chapter describes the removal and replacement procedures for all replaceable units installable into the system, and for other hardware components, such as the system unit covers. Note: Unless otherwise noted, the procedures described in the following pages are applicable to both the base and expansion units.
  • Page 120: Handling Static-Sensitive Devices

    Handling Static-Sensitive Devices Attention: Adapters, planars, diskette drives, and disk drives are sensitive to static electricity discharge. These devices are wrapped in antistatic bags, as shown in this illustration, to prevent this damage. Take the following precautions: Do not remove the device from the antistatic bag until you are ready to install the device in the system unit.
  • Page 121: Front Cover

    Front Cover Attention: Do no operate the system unit with the covers removed. Operating with the covers on ensures adequate cooling of the components. Removal 1. Set the power switches of the attached devices to Off. 2. Set the power switch of the system unit to Off. 3.
  • Page 122 Note: Pull tools, for ease in removing CPU and Memory cards, are located on the inside of the front cover. Pull Tools Service Guide...
  • Page 123 Replacement 1. Hook the top of the front cover into the top of the unit frame and Insert the positioning pins located on the inside of the cover in the corresponding holes on the unit frame. P 2. ush the middle of the cover toward the frame and then push the bottom toward the frame to snap the cover into place.
  • Page 124: Side Cover

    Side Cover Removal 1. Remove the front cover following the procedure on page 4-3. 2. Remove the three retaining screws located on the front of the side cover. Screws 3. With a firm grip on the panel, rotate it slightly to the left while pulling it forward. Retaining Clips Service Guide...
  • Page 125 Replacement 1. Center the holes on the left of the side cover with the corresponding retaining clips on the unit. Retaining Clips 2. Push the cover against the unit. 3. Install and tighten the retaining screws. Screws 4. Replace the front cover following the procedure on page 4-3. Removal and Replacement Procedures...
  • Page 126: Rear Cover

    Rear Cover Removal 1. Remove the front cover following the procedure on page 4-3. 2. Remove the side cover following the procedure on page 4-6. 3. There may be a retaining screw securing the rear cover, if so, loosen the retaining screw of the rear cover.
  • Page 127 4. Firmly grip the rear cover and remove it from the unit. Note: Be careful when removing the rear cover from the unit. Removing it too roughly can cause accidental disconnection of the cables coming from the rear of the unit. Replacement Note: Before replacing the cover, ensure that all cables are properly connected, and not entangled.
  • Page 128: System Unit Base

    System Unit Base Removal 1. Set the power switches on the attached devices to Off. 2. Set the power switch on the system unit to Off. 3. Unplug the power cable from the wall outlet. 4. Put the system unit in horizontal position. 5.
  • Page 129: Operator Panel

    Operator Panel Attention: After the operator panel is installed and the system is powered–up, the system ID is down-loaded to the operator panel from a backup source within the system. This ID becomes permanent on the operator panel and cannot be altered without special tools. Therefore, the operator panel cannot be transferred to another system.
  • Page 130 3. Move the operator panel from left to right to help remove it from its slot. Be careful in handling the operator panel. The cables are still connected and these could be damaged. Keep the operator panel near the unit. 4.
  • Page 131 5. For the expansion unit, disconnect the cables in the following order: a. the cable coming from the RS-485 card, which is connected to the operator panel. b. the cable going to the ECB card, which is connected to the ECB card itself. Operator Panel Cable RS-485 Cable (Goes To The Expan-...
  • Page 132: Base Unit Adapters

    Base Unit Adapters Note: Refer to “Handling Static-Sensitive Devices” on page 4-2 before removing or installing adapters in this system. Removal 1. Remove the front cover following the procedures on page 4-3. 2. Remove the side cover following the procedures on page 4-6. 3.
  • Page 133 8. On the front fan cage, loosen the retainer screw which locks the adapters. Retaining Screw 4-15 Removal and Replacement Procedures...
  • Page 134 9. Slide the retainer down until the adapters are unlocked. Retainer 10.Slide the adapter out of the slot. If you are removing a Type 3 adapter, move the tongue of the plastic frame. Using the tabs on the adapter card, firmly grip the adapter, pull it up and slide it out of the slot. If you are removing a Type 5 adapter, using the tabs on the adapter card, firmly grip the adapter, pull it up and then slide it out of the slot.
  • Page 135 Replacement Note: If the adapter removed will not be replaced with another one, you must install a dummy blank in the free slot to protect the unit from dust or any debris, and to guide cooling air. Position the dummy plate in the free slot, inserting it from the internal side of the unit.
  • Page 136 5. Slide the retainer to lock the adapters and tighten the retaining screws. Retainer 6. Connect any attached devices and internal cables to the adapter. Attention: Before re-starting the system, make sure of any free slot has been protected by inserting an appropriate dummy plate. 7.
  • Page 137: Rear Fan

    Rear Fan Note: Before removing the rear fan, make a note of the air flow direction of the fan. Removal 1. Remove the rear cover of the unit following the procedure described on page 4-8. 2. Put the system unit in a horizontal position. Note: Be careful when laying the system unit in the horizontal position, the cables connected to it could be damaged.
  • Page 138: Base Unit Front Fan

    Base Unit Front Fan Notes: Before removing the front fan, record the following: The routing of all cables involved in the Replacement procedure of this fan. The air flow direction of the fan. Removal 1. Remove the front cover using the procedure on page 4-3. 2.
  • Page 139 12.Remove the four rubber shock mounts from the fan mounting holes. Shock Mounts Shock Mounts Bracket 13.Lift up and remove the fan module from the bracket. Replacement 1. Replace the four rubber shock mounts in the fan mounting holes. 2. Place the fan back into position and pull the rubber shock mounts through the holes. 3.
  • Page 140: Base Unit Cpu/Memory Card Retainers

    Base Unit CPU/Memory Card Retainers Note: There are two types of card retainers. One is used when only one CPU card is installed into the system; the other one must be used when two CPU cards are installed. Model G40 uses the card retainers for two CPU boards only. Front Card Retainer for one CPU Front Card Retainer for two CPU board (G30 only)
  • Page 141 Removal 1. Remove the screws used to secure the CPU/memory cards retainers to the lower support tray for the hard disks (at the front and rear of the system). Retainer Screw Retainer Screw 2. Slide the upper tongue of the CPU/memory cards retainer out of the slit located on the front fan support.
  • Page 142: Disk Drive

    Disk Drive References to the small computer systems interface (SCSI) input/output controller is abbreviated as SCSI controller in this publication. Note: Refer to “Handling Static-Sensitive Devices” on page 4-2. Removal 1. Keep the system unit in vertical position. 2. Remove the front cover following the procedure on page 4-3. 3.
  • Page 143 9. To remove the drives from the support tray, remove the four retaining screws holding the drives to the support tray. Retaining Screws Retaining Screws 10.Lift the disk drive out of the support tray. 11. Record the settings of any jumpers and/or switches that are present on it. 12.If equipped with an adapter, remove the adapter from the disk drives SCSI cable connector.
  • Page 144 Replacement Notes: It is important to remember the following facts when installing or replacing optional disk drives in positions F and G (G30, and G02 only): The third and fourth disk drives, positions F and G, must be installed on the upper support tray.
  • Page 145 3. Install the required grommets in the grooves located on the support tray. Grommets 4. Lay the disk drive, that you are installing, on the support tray in the dedicated position. The power connectors of the disk must be kept on the right, that means the disk must be installed with the power connectors toward the front of the unit.
  • Page 146 9. Replace the retaining screws that anchor the disk drive support tray to the system unit frame. Upper Support Tray Lower Support Tray Mounting Screws 10.Replace the CPU/Memory board retainers. 11. Replace the side cover following the procedure on page 4-6. 12.Replace the front cover following the procedure on page 4-3.
  • Page 147: Base Unit Diskette Drive

    Base Unit Diskette Drive Removal 1. Remove the front cover following the procedure on page 4-3. 2. Remove the side cover following the procedure on page 4-6. 3. Remove the diskette drive retaining screws located in the left side of the system unit. Diskette Drive Retaining Screws...
  • Page 148: Media Devices

    Media Devices Notes: 1. For a translation of this notice, see System Unit Safety Information . 2. This caution only applies to the CD-ROM drive. CAUTION: A class 3 laser may be contained in the device. Do not attempt to operate the drive while it is disassembled.
  • Page 149 6. Remove the retaining screws for the guide from the device. EMC Band Guide Retaining Screw 7. Remove the EMC band, if installed, from the device. (The EMC band will be installed on the new device using the same retaining screws as the guide.) 8.
  • Page 150 Replacement 1. If you do not replace the device just removed with any other device; a. Install the EMC blank in the area corresponding to the empty slot. EMC Blank b. Install the plastic blank in the area corresponding to the empty slot. Access the front panel from its internal side and keeping the plastic blank front side facing forward, insert the left tongue of the blank in the dedicated slit on the panel.
  • Page 151 3. Install the EMC band on the device. 4. Install the plastic guide. 5. Adjust the setting of any jumper and/or switches to match the device you are replacing. 6. Gently push the device into the appropriate slot and secure it in place with the retaining screws.
  • Page 152: Base Unit Cpu Card

    Base Unit CPU Card Note: Refer to “Handling Static-Sensitive Devices” on page 4-2 before removing or installing the CPU card in this system. Removal 1. Remove the front cover following the procedure on page 4-3. 2. Remove the side cover following the procedure on page 4-6. 3.
  • Page 153 Card Support CPU Card Bracket Retainer Card Extractor Tool Card Extractor Tool Note the use of the card extractor tools being inserted into the holes located on each end of the adapter. 8. Slide the board out of the slot by pressing the extractors toward the system unit frame. Replacement 1.
  • Page 154: Base Unit Memory Card

    Base Unit Memory Card Note: Refer to “Handling Static-Sensitive Devices” on page 4-2 before removing or installing the CPU card in this system. Removal 1. Remove the front cover following the procedure on page 4-3. 2. Remove the side cover following the procedure on page 4-6. 3.
  • Page 155 Card Support Bracket Card Extractor Tool Card Extractor Tool Note the use of the card extractor tools being inserted into the holes located on each end of the adapter. Memory Card 6. Slide the board out of the slot by pressing the extractors toward the system unit frame. Replacement 1.
  • Page 156: Memory Modules

    Memory Modules Note: There are four types of memory cards; an MRE card, a two bank (8 slots) RLX card, a four bank (16 slots) NFX card, and an SF5 memory card. Removal 1. Remove the front cover using the procedure on page 4-3. 2.
  • Page 157 Replacement 1. Place the memory module on the appropriate connector on the memory card; then firmly press the memory module into the connector. White Release Lever 2. In reverse order, do the steps listed in “Removal” on page 4-38. 4-39 Removal and Replacement Procedures...
  • Page 158: Rs-485 Card

    RS-485 Card Note: Before attempting to handle the RS-485 card, read “Handling Static Sensitive Devices ” , on page 4-1. Removal 1. Remove the front cover using the procedure on page4-3. 2. Remove the side cover using the procedure on page 4-6. 3.
  • Page 159 Replacement 1. Position the RS-485 card and slide it into the system unit. 2. Secure the card, tightening the retaining screw. 3. Replace the three RS-485 card back connector retaining screws. 4. Connect any external and internal RS-485 card connections. 5.
  • Page 160: Base Unit Battery

    Base Unit Battery Note: For a translation of this safety notice, refer to the System Unit Safety Information , Order Number SA23-2652. CAUTION: A lithium battery can cause fire, explosion, or a severe burn. Do not recharge, disassemble, heat above 100 C (212 F), solder directly to cell, incinerate, or expose cell contents to water.
  • Page 161 Replacement 1. Attach a piece of loop and hook strip to the new battery. (The loop and hook strip is furnished with the battery.) 2. Position the new battery in the same position as the previous one. 3. Connect the battery cable to the connector on the system planar. 4.
  • Page 162: Power Supply

    Power Supply Note: For a translation of this safety notice, refer to the System Unit Safety Information , Order Number SA23-2652. DANGER Do not attempt to open the covers of the power supply. The power supply is not serviceable and is to be replaced as a unit. Removal 1.
  • Page 163 Replacement 1. Position the power supply in the system unit. (The side with the power cables for the designated components in the unit must be kept toward the front of the system unit.) 2. Replace the retaining screw used to anchor the tongue located at the back of the power supply to the unit.
  • Page 164: Base Unit System Planar

    Base Unit System Planar The system planar and operator panel EEPROMs contain the SYSID of the system. When one of the two components is to be replaced (for example the system planar), the SYSID information will be copied from operator panel EEPROM into the system planar EEPROM when you at start the system.
  • Page 165 14.Remove the standoff screws used to secure the planar serial/parallel connectors to the rear of the unit. Planar Board S1/S2 15.Gently lift the system planar right side (the side towards the front of the system) (A). 16.Once the planar is lifted, take both edges with your hands, and pull it again toward the front of the unit, until the serial/parallel connectors are removed from their holes (B).
  • Page 166 Replacement Note: Before installing the new planar in the system unit, test the memory card by placing it in position on the memory connectors of the system board (do not plug the memory board completely at this time). If you find that guide pins on the memory connectors of the system board interfere with the memory card connectors, remove the pins, nuts and washers from the system board.
  • Page 167: Key Lock

    Key Lock Removal 1. Remove the front cover, the side cover, and the rear cover of the unit following the procedures described in “Front Cover” on page 4-3, “Side Cover” on page 4-6, and “Rear Cover” on page 4-8. 2. Disconnect any cable connected to the Micro Channel (MCA) adapters installed in the system unit.
  • Page 168: Expansion Unit Ecb Card

    Expansion Unit ECB Card Note: Before attempting to handle the ECB card, please read the “How to Use the Antistatic Envelope” section at the beginning of this chapter. Removal 1. Remove the front cover, the side cover, and the rear cover of the unit following the procedures described in “Front Cover”...
  • Page 169: Expansion Unit Scsi Cable

    Expansion Unit SCSI Cable Removal Note: Before removing the SCSI cable from the expansion unit, note how it is routed. 1. Remove the front cover, the side cover, and the rear cover of the unit following the procedures described in “Front Cover” on page 4-3, “Side Cover” on page 4-6, and “Rear Cover”...
  • Page 170 Installation 1. Position the SCSI cable in the unit, making it follow the correct routing. Then connect any SCSI cable connector to the designated disk drives and/or media devices in the unit, and to the ECB card. See the following SCSI Cable Routing scheme. SCSI Cable Routing SCSI connector Upper dev.
  • Page 171: Chapter 5. System Installation

    The About Your Machine document (In the plastic bag on the outside of the box) Hardware Setup Publications 7012 G Series Setup Procedure 7012 G Series Expansion Unit Setup Procedure Operator Publications 7012 G Series Operator Guide Service Publications 7012 G Series Service Guide...
  • Page 172: Step 2. Observe This Safety Notice During Installation

    Step 2. Observe this Safety Notice during Installation Note: For a translation of the following notices, see System Unit Safety Information , Order Number SA23-2652. DANGER An electrical outlet that is not correctly wired could place hazardous voltage on metal parts of the system or the devices that attach to the system. It is the responsibility of the customer to ensure that the outlet is correctly wired and grounded to prevent an electrical shock.
  • Page 173: Step 3. Checking Customer Outlets

    Step 3. Checking Customer Outlets Note: For a translation of the following notices, see System Unit Safety Information , Order Number SA23-2652. CAUTION: Do not touch the receptacle or the receptacle faceplate with anything other than your test probes before you have met the requirement in step 8. 1.
  • Page 174: Step 4. Setting Up The System Unit

    Step 4. Setting Up the System Unit 1. Be sure the power cable on the system unit is unplugged and the power switch is set to the Off position. 2. Remove the packing material from all of the media devices installed in the front panel. 3.
  • Page 175: Step 7. Connecting Devices To The Adapters

    2. Arrange the cables at the back of the system unit. 3. Using the customer’s planning information, arrange the system unit and devices. 4. Go to Chapter 7 of 7012 G Series Operator Guide to check out the system. System Installation...
  • Page 176: Installation Checkout

    Installation Checkout Installation Checkout Procedure The installation checkout procedure is used to check out the system after initial installation or after a system upgrading kit is installed. Notes: 1. The following procedure can be followed only if the AUTOSERVICEIPL flag (this flag can be set in the STAND BY menu) is set to 1.
  • Page 177 Step 3. Loading the Diagnostics The diagnostics can be run from a CD ROM disk, from a locally attached disk, or from a server if Version 4.1 (or higher) of the AIX operating system is installed on the system. If you are not sure whether Version 4.1 (or higher) of the AIX operating system is installed, you can check by setting the mode switch to the Service position and turning the system unit on.
  • Page 178 Step 4. Checking for the Correct Resources Use the “Display or Change Configuration or VPD” service aid to check the resources that are present (memory cards, SCSI devices, adapters, diskette drives, disk drives, and input devices). Note: If the terminal type has not been defined, it will need to be defined before you can select the service aids.
  • Page 179 Step 6. Completing the Installation Some of the following steps only apply to an initial installation. These steps are provided as reminders in completing the installation or finishing a system upgrading activity. 1. If present, remove the CD ROM diagnostic disk from the appropriate drive, and store it in the binder with the operator guides.
  • Page 180: Chapter 6. Expansion Installation

    In addition it illustrates briefly the general rules to disconnect a unit from the system configuration. For details about setting the system up, refer to 7012 G Series Expansion Unit Setup Procedure , order number SA23-2754. Installation Looking at the unit from the front, the expansion units must be installed starting on the left side of the base unit.
  • Page 181: Disconnecting Expansion Units

    Disconnecting Expansion Units Before disconnecting any units, perform the following steps: 1. If the machine is running, perform a system shutdown first. For further information about the shutdown procedure, refer to the shutdown command in your operating system documentation. 2. Turn off the system by pushing the power On/Off button on the operator panel. Power On/Off Button 3.
  • Page 182: Chapter 7. Parts

    Chapter 7. Parts All parts shown pertain to both the base and the expansion units, unless otherwise noted. Acronyms for FRU Parts Occasionally, an acronym is displayed with an SRN or Error Code on the LCD display to identify a failing FRU. The listing below defines the FRUs associated with the acronyms displayed.
  • Page 183: Covers And Chassis

    Covers and Chassis Service Guide...
  • Page 184 Units Index Part Number Number Description 40H2841 Chassis assembly 40H2873 Hinge 40H2690 Front cover, base unit 40H2691 Front cover, expansion unit 52G0284 Bezel blank 52G0231 Fan Bracket 78X8993 Mounting screw 52G0249 Base Stand 52G0241 Side cover 78X8993 Mounting screw 93H1645 Front card support bracket for 2 CPUs and 1 disk drive tray 78X8993...
  • Page 185: Electronics, Drives, And Power (1 Of 2)

    Electronics, Drives, and Power (1 of 2) Service Guide...
  • Page 186 Units Index Part Number Number Description 11H7687 Mode switch and cable 52G0254 Non lock mode keylock 52G0252 Locking mode keylock 78X8993 Mounting screw 52G0292 Bracket 78X8993 Mounting screw See Note CD-ROM drive 78X8993 Mounting screw See Note Diskette drive (1.44MB) 78X8993 Mounting screw 11H3757...
  • Page 187: Electronics, Drives, And Power (2 Of 2)

    Electronics, Drives, and Power (2 of 2) Service Guide...
  • Page 188 Units Index Part Number Number Description 19H0287 Memory module, 8MB (MRE, NFX, RTX, or SF5) 19H0288 Memory module 16MB (MRE, NFX, RTX, or SF5) 19H0289 Memory module 32MB (MRE, NFX, RTX, or SF5) 35H8751 Memory module, 64MB (NFX or SF5) 35H8694 MRE memory card, base without memory modules 93H4357...
  • Page 189: 7012 G Series Expansion Unit Unique Parts

    7012 G Series Expansion Unit Unique Parts Units Index Part Number Number Description 52G9501 External SCSI cable 40H2691 Front cover assembly 52G0284 Bezel blank 11H3904 Operator panel 11H3629 Internal RS485 cable 11H7538 ECB card assembly 11H3930 Internal SCSI cable 88G3997...
  • Page 190: Appendix A. Systemguard Test Groups

    Appendix A. SystemGuard Test Groups SystemGuard Test Groups Table The following diagram shows the various test groups and their associated tests. To modify the test list, the tests have to be selected in the xxyy format, where xx is the group number and yy is the test number within the group.
  • Page 191 GROUP NO GROUP TEST NO TEST DCB and Memory MM Data lines Test test group MM Address lines Test MM board dec. Test MM Basic acc. Test MM components Test ECC component Test ECC mechanism Test Refresh mech. Test ECC Data lines access. Test MM Full Test (K/H) Interrupt test group BUMP to CPU interrupt Test...
  • Page 192: Systemguard Test Group Descriptions

    SystemGuard Test Group Descriptions The following is a description of the different test groups and the tests available under them. All of these tests are performed automatically at Power On with default parameters. They can also be performed selectively (selection of test group/subtest/parameter) with user configured parameters, under the control of the Off Line Test monitor.
  • Page 193 BUMP, Remote, and Special Asynchronous Lines Test These tests are meant to check the Asynchronous lines of the Standard I/O and the Asynchronous Lines controller in the Super I/O. These tests contain sub-tests, which are described as follows. Each sub-test saves and restores the line parameters. When an error is detected, it is reported to the operator with a suitable error message.
  • Page 194 NVRAM Test This test checks the accessibility of NVRAM bytes. It contains the following sub-tests: NVRAM Data Lines Access Test This test saves the first NVRAM byte. Then a read / write operation is done word by word. It restores the first NVRAM byte. NVRAM Address Lines Access Test This test reads, writes and compares 2 NVRAM addresses.
  • Page 195 DTR Register Test This test writes, reads and compares a 1 among 0 bits in DTR registers. CTR Register Test This test writes, reads and compares a 1 among 0 bits in CTR registers. It saves and restores the CTR register value. Miscellaneous Registers Test This test checks accessibility to the MC68230 chip and its internal registers.
  • Page 196 Entry Parameters Parameters Name Definition Possible Values Default Value Parameter 1 Sub test # Subtest Number 0 or 1 0 = All tests linked Parameter 2 Proc # Processor Number 8 = BUMP Check–Sum Test It checks the CRC value for all present VPDs; It checks the CRC value according to the configuration and it checks the coherency of the configuration.
  • Page 197: Jtag Test Group

    BPP External LoopBack Test (BPP EXT L–B TEST Note: This test can only be performed by Field or Manufacturing people. This test checks the accessibility of the Super–IO chip. It saves and restores used registers. This test is not performed at power on. Entry Parameters Parameters Name...
  • Page 198 IONIAN-SSGA Registers Test This test is performed by all the processors and it checks the accessibility from the processor to the IONIAN and SSGA chips. Following hardware parts are checked. 1. DCB ASIC 2. IONIAN ASIC 3. SSGA ASIC The following sub-tests are included under the IONIAN-SSGA Registers Test: IONIAN Registers Test This test operates on the DSC register, CONFIG register, Personalization register, Bus_Status register.
  • Page 199 Super I/O and UART Access Test This test checks the accessibility of the Super I/O chip from the processors. They don’t check the functional aspects of the Super I/O chip (this is done by the BUMP directly). The following sub-tests are available under this test: Super I/O UART 1 Access Test Specific values are written and read in the data register scratch SCR.
  • Page 200: Cpu Test Group

    SSGA Interrupt Registers Test This test writes and reads specific values from each of the interrupt registers. The values are then compared. Values are saved and restored in all the operations. Floppy Disk Access Test This test needs a formatted diskette in the diskette drive (the diskette content is erased by the test).
  • Page 201: Dcb And Memory Test Group

    Level 2 cache. It calculates the memory address available and then validates the Level 2 cache before writing 1 MB. Then a read operation is done in word mode and values are compared. Then a read is done in burst mode and comparison is done. TAG Data Test This test checks the availability of the TAG chips of the L2 cache memory.
  • Page 202 Walking 0 Data Test This test isolates the open lines among the data lines. It writes “0s among 1s” pattern on the cache line. Then it is read and compared. Transfer Modes On DCB Test This sub-test is used to check the transfer of 1 to 8 bytes to the memory.
  • Page 203 This test consists of two sub-tests. Words manipulated / used are not restored at the end of the test. This test is applied to all the memory cards which are present. In case of errors, suitable error messages are displayed on the console. The following is a description of the sub-tests.
  • Page 204 Basic Main Memory Test This test is performed by all the processors and it checks the capability to access the main memory in all kinds of data formats. This test applies to one main memory location and the words used during the test are not restored. This test partially checks the DCB ASICs.
  • Page 205 Main Memory Components Test This test is performed by all the processors to check all the main memory locations. From the hardware point of view, this test checks the memory chips mounted on the main memory cards. This test can be launched in two modes, as follows: 1.
  • Page 206 ECC Data Lines Accessibility Test This test checks the accessibility for all the data lines to the ECC memory banks, through SMC ASICs. The following hardware parts are checked by running this test: DCB ASICs SMC ASICs Connection of data lines between CPU daughter boards and MPB ASICs Connection of data lines between MPB ASICs and ECC memory chips.
  • Page 207 ECC Memory Component Test This test is identical to the main memory components test but it is applied to the ECC memory components. Error Correction Mechanism Test This test checks the hardware mechanisms enabling the detection of and the correction of single bit errors when working with the main memory.
  • Page 208: Interrupt Tests Group

    Interrupt Tests Group These tests are performed by the BUMP as well as the processors. They are launched at Power On and under control of Off Line Test Monitor. They collectively check the interrupt system. The following tests are available under this group. BUMP To CPU Interrupt Test This test is performed jointly by the BUMP and the processor.
  • Page 209: Cpu Multiprocessor Test Group

    CPU MultiProcessor Test Group These tests are launched at Power-On and are also available under the control of the Off Line Tests monitor. These tests check the multi-processor mechanisms, atomic instructions, cache coherency, main memory sharing, and multi-resources sharing. The following tests are available under this group. Atomic Instructions Test This test checks the mechanisms enabling the protection of the content of the memory in case of use of some specific instructions, called “atomic instructions”.
  • Page 210 instruction. This is issued by Processor 0 which is set to Global Copy Back mode. Caching is inhibited for Processor 1. Paradox Detection: DCBST not from Line Owner Here, Processor 1 is set to Local Copy Back mode. Memory coherency is enabled for Processor 0. This test verifies the incoherency introduced by the Local Copy Back.
  • Page 211 Main Memory Sharing Test This test is launched by the BUMP and performed by all configured processors. It has a sub-test to check the capability of all the processors to access the main memory. The following hardware parts are checked during the process: 1.
  • Page 212: Appendix B. Modifying Systemguard Parameters

    Appendix B. Modifying SystemGuard Parameters Many SystemGuard parameters can be modified in several ways. Some can be modified using the SystemGuard Stand-By menu, others using the SystemGuard Maintenance menu, and others using the AIX diag or mpcfg commands or Diagnostic Service Aids. When you want to modify SystemGuard parameters, the method to use depends on the machine boot phase (stand-by, init, run-time).
  • Page 213 Flag, Parameter and Keyword Default Values Name Default Value BUMP Console Power-On Command String Power Service Console Power-On Command String Blank (not set) BUMP Console Power-On Command flag Enabled Service Console Power-On Command flag Disabled Remote Authorization flag Disabled Autoservice IPL flag Disabled BUMP Console Present flag Enabled...
  • Page 214: Changing Flags And Parameters Under Aix Service Aids

    Changing Flags and Parameters Under AIX Service Aids The Service Aids are recommended to change the flags. The Service Aids can be entered using the diag command or by booting diagnostics in service mode. They display or change flag values using 0 (zero) for disabled and 1 (one) for enabled. The explanations that follow refer to the Service Aids.
  • Page 215: Modifying The Dial-Out Authorization Flag

    SystemGuard Maintenance Menu Starting from the main maintenance menu: Enter 2 to enable the flag. Enter 3 to disable the flag. AIX Diag Command Starting from the Service Aids Selection menu: 1. Select the BUMP Service Aids option. 2. Select the Display or Change Flags and Configuration option. 3.
  • Page 216: Modifying Dial-In Phone Numbers

    Modifying Dial-In Phone Numbers These parameters can be changed under SystemGuard using the maintenance menu, or under AIX using the diag command. SystemGuard Maintenance Menu Starting from the main maintenance menu: 1. Enter 8 to set parameters. 2. Enter 3 for phone numbers. 3.
  • Page 217: Modifying The Electronic Mode Switch From Service Line Flag

    Modifying the Electronic Mode Switch from Service Line Flag This flag can be changed under SystemGuard using the maintenance menu, or under AIX using the diag command. SystemGuard Maintenance Menu Starting from the main maintenance menu: 1. Enter 8 to set parameters. 2.
  • Page 218: Reloading The Flash Eeprom

    Reloading the Flash EEPROM Follow this procedure to load a new version of SystemGuard into the flash EEPROM. Only system administrators should perform this procedure. Prerequisites To install a new version of the EEPROM firmware, you need either a firmware diskette containing a binary firmware image, or a file containing the firmware.
  • Page 219: Appendix C. Systemguard Remote Operation Configuration

    Appendix C. SystemGuard Remote Operation Configuration In order to utilize the remote operation capabilities of SystemGuard and also allow console mirroring, you need to have flags, parameters and tty configurations properly enabled. Below, are tty0 and tty1 settings, sample modem files and all the parameters that are necessary to allow remote operations.
  • Page 220: Flags And Parameters Settings

    The configuration of the tty1 for the S2 port looks similar to the following: [TOP] [Entry Fields] tty1 TTY type TTY interface rs232 Description Asynchronous Terminal Status Available Location 00–00–S2–00 Parent adapter PORT number [s2] Enable LOGIN disable BAUD rate [9600] PARITY [none]...
  • Page 221 The Modem Parameters File Name Value should be set to the file name of your modem configuration file. The service line speed should be set to your modem and tty capabilities (9600 is recommended). Service flags: mpcfg –dS Index Name Value Remote Service Support Quick On Call Service...
  • Page 222: Modem Configuration Files

    Modem Configuration Files If you want to attach a modem to the S2 port to allow automatic problem reporting from SystemGuard or dial-in access from a remote location, you have to provide a configuration file for the modem you are using. This file is also necessary to utilize the mirroring capabilities supported by the operating system mirrord daemon.
  • Page 223 This is a sample /usr/share/modems/mir_modem file for console mirroring using an IBM 7851 modem. # Tested at 9600bps. ICDelay 5 DefaultTO 10 CallDelay 120 Attention Code Enable result codes to screen # &F1 Set factory profile 1 Disable result codes to screen Turn echo off S0=0...
  • Page 224: Initializing A Modem

    Initializing a Modem Once flags, parameters and configurations have been enabled, the modem can be initialized to accept incoming calls. This can be done in the following manner: Place the System Key to Normal. Issue a ps –ef|grep mirrord command. Obtain mirrord process ID.
  • Page 225: Appendix D. Off Line Diagnostic Error Codes

    Appendix D. Off Line Diagnostic Error Codes Note: The Failure Percent value is calculated on a system model base. As some Failing Function Codes are system model specific but are associated the the same Error Number, it may happen that the sum of the Failure Percent values in one single box exceeds 100.
  • Page 226 Failing Failure Error Function Percent Number Source Codes Description 401-023 Description: S2 asynchronous line junction signal error (DTR to DSR link). Action: Use MAP 0210. 401-024 Description: S2 asynchronous line junction signal error (RTS to CTS link). Action: Use MAP 0210. 401-025 Description: S2 asynchronous line junction signal error (OUT2 to DCD link).
  • Page 227 Failing Failure Error Function Percent Number Source Codes Description 401-049 Description: S3 asynchronous line junction signal error (DTR to DSR link). External loop-back mode. Action: Use MAP 0210. 401-050 Description: S3 asynchronous line speed error. External loop-back mode. Action: Use MAP 0210. 401-060 Description: Flash EPROM standard area checksum error.
  • Page 228 Failing Failure Error Function Percent Number Source Codes Description 401-140 all boards Description: Bad VPD Board. 401-141 all boards Description: No Board present. 401-142 all boards Description: No coherent configuration on board. 401-150 Description: Asynchronous lines access. Line Sx: register error Action: Use MAP 0210.
  • Page 229 Failing Failure Error Function Percent Number Source Codes Description 401-182 Description: DIAL-OUT test. No customer Hub or Service Center Modem phone Dial-Out. 401-183 Description: DIAL-OUT test. Modem parameters failed. Modem 401-184 Description: DIAL-OUT test. Line busy. Modem 401-185 Description: DIAL-OUT test. Connection Time out. Modem 401-186 Description: DIAL-OUT test.
  • Page 230 Failing Failure Error Function Percent Number Source Codes Description 401-514 Description: Direct IO: IONIAN-SSGA. APR register error. Action: Use MAP 0210. 401-515 Description: Direct IO: IONIAN-SSGA. BSR init value. Action: Use MAP 0210. 401-516 Description: Direct IO: IONIAN-SSGA. MD0 init value. Action: Use MAP 0210.
  • Page 231 Failing Failure Error Function Percent Number Source Codes Description 401-550 Description: Direct IO. Flash Eprom access error. Action: Use MAP 0210. 401-560 Description: Direct IO. Eprom access error. Action: Use MAP 0210. 401-570 Description: Direct IO. TOD imbedded RAM access error. Action: Use MAP 0210.
  • Page 232 Failing Failure Error Function Percent Number Source Codes Description 401-591 Description: Diskette drive access. Error on sense interrupt command. Action: Use MAP 0210. 401-592 Description: Diskette drive access. Error on write command. Action: Use MAP 0210. 401-593 Description: Diskette drive access. Error on read command.
  • Page 233 Failing Failure Error Function Percent Number Source Codes Description 401-807 Description: Channel reset and POS. Missing DMA interrupt error during transfer. Action: Use MAP 0210. 401-808 Description: Channel reset and POS. DMA status error. Action: Use MAP 0210. 401-809 Description: Channel reset and POS. Missing DMA interrupt error after transfer.
  • Page 234 Failing Failure Error Function Percent Number Source Codes Description 401-824 Description: Channel reset and POS. SCSI Bus control lines error. Action: Use MAP 0210. 401-825 Description: Channel reset and POS. Missing ACK signal error. Action: Use MAP 0210. 401-826 Description: Channel reset and POS. Pending ACK signal error.
  • Page 235 Failing Failure Error Function Percent Number Source Codes Description 401-841 Description: Channel reset and POS. POS4 register error. Action: Use MAP 0210. 401-842 Description: Channel reset and POS. POS2 register error. Action: Use MAP 0210. 401-843 Description: Channel reset and POS. NCR SCRATCH A register error.
  • Page 236 Failing Failure Error Function Percent Number Source Codes Description 401-851 Description: Channel reset and POS. Buffer exchange error. Action: Use MAP 0210. 401-852 Description: Channel reset and POS. LSA board not responding. Action: Use MAP 0210. 402-000 Description: CPU processor error. Action: Use MAP 0210.
  • Page 237 Failing Failure Error Function Percent Number Source Codes Description 402-110 Description: Caches coherencies. Concurrent coherent write accesses error. Action: Use MAP 0210. 402-111 Description: Caches coherencies. Concurrent not coherent write accesses error. Action: Use MAP 0210. 402-112 Description: Caches coherencies. DCBST from line owner error.
  • Page 238 Failing Failure Error Function Percent Number Source Codes Description 402-132 Description: DCB ports arbitration error. Memory coherency error. Action: Use MAP 0210. 402-133 Description: DCB ports arbitration error. Odd processor DCBF or even processor read error. Action: Use MAP 0210. 402-134 Description: DCB ports arbitration error.
  • Page 239 Failing Failure Error Function Percent Number Source Codes Description 402-530 Description: CPUs to CPUs interrupt error. Even processors auto interrupt. Action: Use MAP 0210. 402-531 Description: CPUs to CPUs interrupt error. Odd processors auto interrupt. Action: Use MAP 0210. 402-532 Description: CPUs to CPUs interrupt error.
  • Page 240 Failing Failure Error Function Percent Number Source Codes Description 403-013 Description: Main Memory address lines accessibility error. Unexpected interrupt. Action: Use MAP 0210. 403-020 Description: Main memory board address accessibility error. Write all 0 and 1 error. Action: Use MAP 0210. 403-021 Description: Main memory board address accessibility error.
  • Page 241 Failing Failure Error Function Percent Number Source Codes Description 403-038 Description: Main memory basic tests error. Work mode main memory addressing error. Action: Use MAP 0210. 403-039 Description: Main memory basic tests error. Aligned multi-store error. Action: Use MAP 0210. 403-040 Description: Main memory basic tests error.
  • Page 242 Failing Failure Error Function Percent Number Source Codes Description 403-074 Description: Error correction code mechanism. B96 or Multiple Error generation error. Action: Use MAP 0210. 403–075 Description: DCB or SMC error. Multiple Error generation error. Action: Use MAP 0210. 403-080 Description: Main Memory refresh mechanism.
  • Page 243 Failing Failure Error Function Percent Number Source Codes Description 403-506 Description: BUMP to CPU interrupt error. IOD-HW-STS register error. Action: Use MAP 0210. 403-507 Description: BUMP to CPU interrupt error. IRR register error. Action: Use MAP 0210. 403-508 Description: BUMP to CPU interrupt error. No external interrupt.
  • Page 244 Failing Failure Error Function Percent Number Source Codes Description 403-527 Description: CPU to BUMP interrupt. XIRR4 register error. Action: Use MAP 0210. 403-528 Description: CPU to BUMP interrupt. IOD-HW-STS register error. Action: Use MAP 0210. 403-529 Description: CPU to BUMP interrupt. XIRR0 register error.
  • Page 245 Failing Failure Error Function Percent Number Source Codes Description 403-555 Description: CPU to CPU interrupt. XIRR register error. Action: Use MAP 0210. 403-560 Description: TOD to BUMP interrupt. Unexpected interrupt error. Action: Use MAP 0210. 403-561 Description: TOD to BUMP interrupt. No trap interrupt.
  • Page 246 Failing Failure Error Function Percent Number Source Codes Description 404-018 Description: Caches coherencies. DCBI not from line owner error. Action: Use MAP 0210. 404-019 Description: Caches coherencies. DCBT not from line owner error. Action: Use MAP 0210. 404-020 Description: DCB arbitration mechanism error. Action: Use MAP 0210.
  • Page 247 Failing Failure Error Function Percent Number Source Codes Description 407-015 Description: CPU interrupt test manager stopping T-O. Action: Use MAP 0210. 407-016 Description: CPU multi-processor test manager launching T-O. Action: Use MAP 0210. 407-017 Description: CPU multi-processor test manager stopping T-O. Action: Use MAP 0210.
  • Page 248 Failing Failure Error Function Percent Number Source Codes Description 408-060 Description: Main memory Knaizuk-Hartmann test error. B96 or Action: Use MAP 0210. 408-080 Description: Multi resources full test error. Action: Use MAP 0210. 409-000 Description: Planar vital part FATAL ERROR. Action: Use MAP 0210.
  • Page 249 Failing Failure Error Function Percent Number Source Codes Description 409-083 Description: OP microcontroller not working. Action: Use MAP 0210. 409-087 Description: MVR not compatible with the CPU boards. Action: Use MAP 0210. 409-088 Description: Different cycle time between the present CPU boards.
  • Page 250: Error Logging

    Error Logging When a failure occurs on a fan or on a power supply, the system produces a logging report for this event. The logging report can be viewed using errpt . An errpt report about power and fan is the following: LABEL: EPOW_SUS Description:...
  • Page 251 1010 Fan 2 fault 1011 Fan 3 fault 1100 Fan 4 fault 1100 Fan 5 fault 1100 Fan 6 fault 1111 Reserved Power Up Bits 4–6 Values Description Manual On button pushed Remote On signal from external Timed power on from TOD clock Remote on signal from power control interface Automatic restart Power Up...
  • Page 252 Power System Operating in Backup Mode Bit 14 Values Description No power warning Power system operating in backup mode warning Cooling System Operating in Backup Mode Bit 15 Values Description No cooling warning Cooling system operating in backup mode warning Power Fault and Fan Fault (R30, R40, and R50) Bits 16–23 values Description...
  • Page 253 Understanding PKSR The PKSR status is logged in hexadecimal value: 8 digits are logged. Each hexadecimal digit must be converted in 4 binary digits: 32 bits are obtained. Divide the bits as indicated in the PKSR layout and check the bit values to understand the meaning of the register. Example Suppose you receive an error message whose PKSR content in hex is: 9005 0007...
  • Page 254: Appendix E. System Power States

    Appendix E. System Power States The state of the system is dependant on the condition of four variable conditions that effect how the system IPLs or shuts down. The four conditions are: the position of the Power-on button This button has two positions. It can be pressed in to the On position (position for turning the power on), or it can be in the out or Off position.
  • Page 255 If the command sbb is entered on the BUMP console, and the system key is in the Normal position, the system goes to the SBB_ECMD state. If the Power-on button is pressed and changes from the On position to the Off position, the system sets the was_shutdown status to false.
  • Page 256 If the power_fault status is false, the system attempts to power on. If the system then detects a power fault, the power_fault status is set to true. The system displays an operator panel LCD error message, and the system goes to the MAIN_STANDBY status. If no power fault is detected, the system goes to the IPL state.
  • Page 257 If the system power does not turn on, the Power-on button may be in the off position. Go to the system unit and press the Power-on button (only press the button once), If the system power still does not turn on there may be an earlier fault condition. Remove main power from the system unit, wait 30 seconds, and restore main power.
  • Page 258: Glossary: Special Terms Used In Systemguard

    Glossary: Special Terms Used in SystemGuard BP (back plane). A panel located in the system I/O card. A card which handles system I/O and unit and used to interconnect boards and devices. directly connects to the system planar. BIST (built in self-test). Tests performed during IPL (initial program load).
  • Page 259 which can be removed without turning the power off such as the EEPROM, the flash EEPROM, and the to the entire system). non-volatile RAM. ROS (read-only storage). Storage which does not SSF (system service facility). See SystemGuard. support writing. SYSID (system identification). Identifies part of SCSI (small computer system interface).
  • Page 260: Index

    Index acronym to FRU list, 7-1 device connection adapter, 5-5 adapter, device connection, 5-5 standard I/O port, 5-4 adapters, removal and replacement procedure, device, attached, setting up, 5-4 4-14 Dial–OutAuthorization Flag, 2-36 antistatic bags, 4-2 digital multimeter, 5-3 AutoserviceIPL Flag, 2-36 dimension, 1-14 disconnection expansion units, 6-2 disk drive (base unit), removal and replacement...
  • Page 261 memory card retainers, 4-22 minimum configuration MAP, 3-1540-1 ground impedance, 5-3 model R00 rack, cluster power control (CPC), 1-9 modifying SystemGuard parameters, B-1 hardware components CPU module, memory cards, 1-4 new unit, recognizing, expansion installation, 6-1 keyboard/mouse card, 1-5 RS-485 card, 1-8 serial port splitter cable, 1-5 heat output, 1-14 off line diagnostics, error codes, D-1...
  • Page 262 power-on from BUMP console, E-3 power-on using the power-on button, E-4 safety notice, installation, 5-2 safety notices, definitions, xi scsi cable connection, expansion installation, 6-1 rear cover, removal and replacement procedure, service inspection check point, 1-16 when to perform, 1-16 recognizing the new unit, expansion installation, service inspection guide, 1-16 reference information, 1-1...
  • Page 263 boot from network, 2-52 parameters, 2-9 boot from SCSI device, 2-49 phases, 2-4 disable processors, 2-55 boot, 2-5 enable processors, 2-55 Boot to AIX load and run-time, 2-9 enable surveillance, 2-46 init, 2-5 reboot AIX from remote service console, 2-48 init to Boot, 2-9 set fast IPL, 2-40 Maint to Boot, 2-9...
  • Page 264 Printed in the U.S.A. SA23–2741–02...

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