Hardware Configuration - Samsung ProXpress M337x Service Manual

2. Product Specifications

2.2.5. Hardware configuration

ProXpress M337x / M387x / M407x series Electrical Circuit system consists of the following :
•
Main controller
•
OPE controller
•
DDR3 SODIMM
•
SCF board (Option)
•
SMPS board
•
HVPS board
•
WLAN Module (M387xFW only)
•
MICRO SD 4GB (M407xFR / M407xFX only)
Diagram of the M337xFD/387xFD/387xFW/407xFR/407xFX/4072FD Series Electrical Circuit
3.3 V 3.3 V_ Cover_Open
Front Cover
Micro Switch
HVPS
Supply
DEV
THV
OPC
Va ristor
S
M
D
FUSER
BIAS DRUM
T
DEVELOPER Unit
SMPS
INLE T FUS E R
INLET
The main controller controls all modules required to print, that is, LSU, HVPS, SMPS, FAN, Fuser, etc.
The main controller receives print data from the host through network or USB Port or fax, Scanner. It takes this information
and generates printable video bitmap data. Engine and Video controller are not separated.
The main controller adopts the A1500(600MHz) CPU, DIMM PBA on DDR3 memory and external memory to perform
printing and Scan jobs successfully.
The OPE controller displays the status of the system using 16 x 4line LCD in response to user actions or the main controller.
The HVPS supplies high voltage for developing Process. High Voltage controlled by PWM signal from CPU.
SMPS makes +5V and +24V DC from 220V or 110 AC.
WLAN module is used for wireless communication.
2-25
1 5V_S US P
P AR ALLEL
2 N.C
OP TION 3 GND
4 5V_S US P
24VS
1 24 VS
24VS 12
2 GND
GND 11 3.3V
3 THV_R E AD
THV_R E AD 10
4 nTHV_E N
nTHV_E N 9
5 P WM_THV
P WM_THV 8
6 P WM_DE V_ DC
P WM_DE V_DC 7
7 P WM_MHV
P WM_MHV 6
8 P WM_FUS E R _B IAS
P WM_FUS E R_B IAS 5
9 GND
GND 4
10 GND
GND 3
11 3. 3V
3.3V 2
3 .3V_Cover_ Open 1
12 3. 3V_C ove r_Ope n 1
3.3V_ C ove r_Ope n 1
FAN MAIN
MHV
1 GND(FB )
2 N. C
3 FAN_MAIN
1
GND
CRUM 2 S C L1
S DA1
3
4 3. 3V_C R UM
CRUM I/F PBA
N.C 6
N.C 5
Z-CRUM GND 4 1 GND
S C L 3
2 S C L 1
3. 3V_C R UM 2 3 3.3V_C R UM
S DA 1 4 S DA
FAN 1
24VS
2 F AN _S MP S (F/ B)
SMPS
GND 1 24 VS
5 GND
2
24 V OFF 4
24V OFF
R e la y 3
3 R e la y _AC _ON
CN 24 (2mm )
24 VS 4
24VS THE RM
2
Fus e r ON
5 Fus e r ON
FUSER ON 1
1
5V_S MP S 1 5V_S MP S
2
GND 2 GND
3
24 V1 3 24V1
4
GND 24V GND
4
5V_SMPS
The rmistor1
FUSER Unit
The rmoSta t
OP E_ LC D
LCD (2-Line )
LSU
(Dual Beam )
CN17(FFC 1mm)
CN18
LS U_ IF
OP E I/F(2lLINE )
EEPROM
(32KB)
MAIN
A1500
MAIN CLK
12 MHz
RTC CLK
32.7KHz
US B 2.0
CN31(2mm) CN27 (1.5 mm) CN 7 (2mm )
C N19(2mm )
Cover Open E XIT
MP
MAIN MOTOR
S E NS OR S E NS OR
CL CL CL
Cove r
Pickup Re gi
MP MP Exit
Ope n
Clutch Clutch
Clutch Se nsor Se nsor Outbinfull
Se nsor
Ma in Motor
Copyright© 1995-2013 SAMSUNG. All rights reserved.
OP PANEL
(LED)
(1 . 5mm )
CN9 (1 . 5 mm )
OP E I/ F(LED)
5V_ S US P
DDR3 DIMM
nR S T_ S C F
S C F_ TXD
(128MB)
S C F_R XD
nS C F_OP R
_R E Q
DDR3 DIMM
(256MB)
ML-4210/15ND
NAND FLASH
MX0P
(128MB)
MX0N
MX1P
MX2P
MX2N
MX1N
25 MHz
MX3P
MX3N
25 MHz
3.3V_P S
Ne twork
RTL8211E
VB US
DM
DP
GND
USB HUB
CN6(2mm)
CN2( 1.5mm ) CN16
CN28(2 mm)
OUTBIN FULL AIR
SENSOR
USB_IF
COVE R OP E N TE MP
Ambie nt
Te mp
Se nsor
Pa pe r Cove r
EMPTY FEED REGI
Ope n WLAN
Se nsor Se nsor Se nsor
Se nsor
1 N.C
2 OP T_nC MDR E Q
3 N.C
24 V1 1
4 N.C
24 V1 2
DRAWER CN 5 GND
3
6 GND SCF
4 7 GND
5 8 GND
9 GND
6
10 24 V
7
11 24 V
8
GND
12 24 V
GND 9
13 5V
GND 10
14 5V
15
5V
16 OP T_nR E S E T
17 OP T_R XD
18 OP T_TXD
1
2
3
4
5
6
7
8
GND 9
LE D1 10
LE D0 11
12
GND 13
GND 14
1
2
3
4