HP Pavilion 14 Maintenance And Service Manual page 102

Remove the heat sink assembly:
1.
Turn the system board upside down, with the front toward you.
NOTE:
graphics. See steps 5 through 7 for heat sink assembly removal information for computer models
equipped with UMA graphics.
2.
Following the 1, 2, 3, 4, 5, 6, 7 sequence stamped into the heat sink assembly, loosen the 4
Phillips PM2.0×10.0 captive screws (1) and the 3 Phillips PM2.0×3.5 captive screws (2) that
secure the heat sink assembly to the system board.
3. Remove the heat sink assembly (3) from the system board.
NOTE:
assembly and the system board components, it may be necessary to move the heat sink assembly
from side to side to detach it.
4. Remove the thermal material. The thermal material must be thoroughly cleaned from the surfaces of
the heat sink assembly and the system board components each time the heat sink assembly is
removed. Replacement thermal material is included with the heat sink assembly and system board
spare part kits.
Thermal paste is used on the processor (1) and the heat sink assembly section (2) that
●
services it
Thermal paste is used on the graphics subsystem chip (3) and the heat sink assembly
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section (4) that services it
92 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts
Steps 2 through 4 apply to computer models equipped with switchable discrete
Due to the adhesive quality of the thermal material located between the heat sink