Product Specifications - Quanmax QDSP-2030 User Manual

Product Specifications

Construction Aluminum extrusion, heavy-duty steel chassis
3.5" Embedded SBC, Intel® Core 2 Duo 45nm Penryn support, Intel®
System Board
GM45/ICH9-M chipset
Intel® Core™2 Duo Processor T9400 (6M Cache, 2.53 GHz, 1066 MHz FSB)
Intel® Core™2 Duo Processor P8400 (3M Cache, 2.26 GHz, 1066 MHz FSB)
CPU Support
Intel® Celeron® Processor 575 (1M Cache, 2.00 GHz, 667 MHz FSB)
Memory 1x SO-DIMM DDR3 800/1066 up to 2GB
Front I/O panel
1x Power LED
1x HDD Active LED
1x Power Switch Button
2x R/L Channel Speaker Output RCA Connector
1x Line-Out Audio Jack
1x Line-In Audio Jack
1x MIC-In Audio Jack
1x Side Surround Output Audio Jack
I/O Panel 1x CEN/LFE Output Audio Jack
1x Back Surround Output Audio Jack
Rear I/O panel
1x HDMI
1x DVI-I
1x COM (RS-232/422/485)
1x 10/100/1000 LAN port (RJ45)
4x USB ports
DC-12V IN
Antenna Connector (Option)
Drive Bays/
1x 2.5" Hard Drive Bay (SATA)
Storage
Input: 100-240 VAC
Power Supply
Output: 80W, +12VDC output, 6.67A max
Cooling System Fan
Expansion Slot 1x Internal Compact-Flash Type II Slot
WLAN IEEE 802.11b/g (option)
Shock Operating: 10 g / 11ms; Storage: 50 g / 11ms (half-sine)
Operating (IEC 68-2-64 Fh): 5-500Hz, 1 g (rms) / 3-axes
Vibration
Storage (IEC 68-2-6 Fc): 5-500Hz, 2 g (rms) / 3-axes
Temperature/ Operating: 0°C to 40°C, 0%-90%, non-condensing
Humidity Storage: -20°C to 80°C, 0%-90%, non-condensing
Dimensions 227 x 44 x 210 mm (WxHxD)
Weight 1.8 kg
Mounting Wall-Mount, VESA 75/100 Standard
Certification CE, FCC Class A
QDSP-2030 User's Manual
Table 1 QDSP-2030 product specifications
15
Chapter 1