Cypress Semiconductor CY7C1354CV25 Specification Sheet

9-mbit (256k x 36/512k x 18) pipelined sram with nobl architecture

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Features
• Pin-compatible with and functionally equivalent to
ZBT™
• Supports 250-MHz bus operations with zero wait states
• Available speed grades are 250, 200, and 166 MHz
• Internally self-timed output buffer control to eliminate
the need to use asynchronous OE
• Fully registered (inputs and outputs) for pipelined
operation
• Byte Write capability
• Single 2.5V power supply (V
• Fast clock-to-output times
— 2.8 ns (for 250-MHz device)
• Clock Enable (CEN) pin to suspend operation
• Synchronous self-timed writes
• Available in lead-free 100-Pin TQFP package, lead-free
and non lead-free 119-Ball BGA package and 165-Ball
FBGA package
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• Burst capability–linear or interleaved burst order
• "ZZ" Sleep Mode option and Stop Clock option
Logic Block Diagram–CY7C1354CV25 (256K x 36)
A0, A1, A
MODE
CLK
C
CEN
ADV/LD
BW
a
BW
b
BW
c
BW
d
WE
OE
CE1
CE2
CE3
ZZ
Note:
1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05537 Rev. *H
Pipelined SRAM with NoBL™ Architecture
)
DD
ADDRESS
REGISTER 0
A1
A1'
D1
Q1
A0
BURST
A0'
D0
Q0
LOGIC
ADV/LD
C
WRITE ADDRESS
WRITE ADDRESS
REGISTER 1
REGISTER 2
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
READ LOGIC
SLEEP
CONTROL
198 Champion Court
9-Mbit (256K x 36/512K x 18)
Functional Description
The CY7C1354CV25 and CY7C1356CV25 are 2.5V, 256K x
36 and 512K x 18 Synchronous pipelined burst SRAMs with
No Bus Latency™ (NoBL™) logic, respectively. They are
designed to support unlimited true back-to-back Read/Write
operations with no wait states. The CY7C1354CV25 and
CY7C1356CV25 are equipped with the advanced (NoBL) logic
required to enable consecutive Read/Write operations with
data being transferred on every clock cycle. This feature
dramatically improves the throughput of data in systems that
require frequent Write/Read transitions. The CY7C1354CV25
and CY7C1356CV25 are pin-compatible with and functionally
equivalent to ZBT devices.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. All data outputs pass through
output registers controlled by the rising edge of the clock. The
clock input is qualified by the Clock Enable (CEN) signal,
which when deasserted suspends operation and extends the
previous clock cycle.
Write operations are controlled by the Byte Write Selects
(BW
–BW
for
CY7C1354CV25
a
d
CY7C1356CV25) and a Write Enable (WE) input. All writes are
conducted with on-chip synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. In order to avoid bus
contention, the output drivers are synchronously tri-stated
during the data portion of a write sequence.
S
D
E
A
N
T
S
A
E
MEMORY
S
WRITE
ARRAY
A
T
DRIVERS
E
M
E
P
R
S
I
N
E
G
INPUT
INPUT
E
E
REGISTER 1
REGISTER 0
,
San Jose
CA 95134-1709
CY7C1354CV25
CY7C1356CV25
[1]
and
BW
–BW
for
a
b
, CE
, CE
) and an
1
2
3
O
U
T
P
U
T
B
DQs
U
DQP
a
F
DQP
b
F
DQP
E
c
R
DQP
d
S
E
408-943-2600
Revised September 14, 2006
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Summary of Contents for Cypress Semiconductor CY7C1354CV25

  • Page 1 9-Mbit (256K x 36/512K x 18) Pipelined SRAM with NoBL™ Architecture Functional Description The CY7C1354CV25 and CY7C1356CV25 are 2.5V, 256K x 36 and 512K x 18 Synchronous pipelined burst SRAMs with No Bus Latency™ (NoBL™) logic, respectively. They are designed to support unlimited true back-to-back Read/Write operations with no wait states.
  • Page 2: Selection Guide

    WRITE ADDRESS REGISTER 2 WRITE REGISTRY MEMORY AND DATA COHERENCY WRITE ARRAY CONTROL LOGIC DRIVERS INPUT REGISTER 1 READ LOGIC Sleep Control 250 MHz 200 MHz CY7C1354CV25 CY7C1356CV25 INPUT REGISTER 0 166 MHz Unit Page 2 of 28 [+] Feedback...
  • Page 3: Pin Configurations

    Pin Configurations DQPc CY7C1354CV25 (256K × 36) DQPd Document #: 38-05537 Rev. *H 100-pin TQFP Pinout DQPb CY7C1356CV25 (512K × 18) DQPb DQPa CY7C1354CV25 CY7C1356CV25 DQPa Page 3 of 28 [+] Feedback...
  • Page 4 Pin Configurations (continued) NC/576M NC/1G NC/144M NC/576M NC/1G NC/144M NC/72M Document #: 38-05537 Rev. *H 119-Ball BGA Pinout CY7C1354CV25 (256K × 36) NC/18M ADV/LD MODE NC/72M CY7C1356CV25 (512K x 18) NC/18M ADV/LD MODE NC/36M CY7C1354CV25 CY7C1356CV25 NC/288M NC/36M NC/288M Page 4 of 28...
  • Page 5 NC/144M NC/72M MODE NC/36M NC/576M NC/1G NC/144M NC/72M MODE NC/36M Document #: 38-05537 Rev. *H 165-Ball FBGA Pinout CY7C1354CV25 (256K × 36) CY7C1356CV25 (512K × 18) CY7C1354CV25 CY7C1356CV25 ADV/LD NC/18M NC/288M ADV/LD NC/18M NC/288M Page 5 of 28 [+] Feedback...
  • Page 6: Pin Definitions

    –DQ are placed in a tri-state condition. The outputs are automati- is controlled by BW , DQP is controlled by BW is controlled by BW CY7C1354CV25 CY7C1356CV25 and DQP , BW controls DQ and DQP During [a:d].
  • Page 7: Functional Overview

    Burst Read Accesses The CY7C1354CV25 and CY7C1356CV25 have an on-chip burst counter that allows the user the ability to supply a single address and conduct up to four Reads without reasserting the address inputs.
  • Page 8: Truth Table

    OE. Burst Write Accesses The CY7C1354CV25/56CV25 has an on-chip burst counter that allows the user the ability to supply a single address and conduct up to four WRITE operations without reasserting the address inputs.
  • Page 9: Sleep Mode

    Truth Table Operation NOP/WRITE ABORT (Begin Burst) WRITE ABORT (Continue Burst) IGNORE CLOCK EDGE (Stall) SLEEP MODE Partial Write Cycle Description Function (CY7C1354CV25) Read Write –No bytes written Write Byte a– (DQ and DQP Write Byte b – (DQ and DQP Write Bytes b, a Write Byte c –...
  • Page 10: Tap Controller State Diagram

    IEEE 1149.1 Serial Boundary Scan (JTAG) The CY7C1354CV25/CY7C1356CV25 incorporates a serial boundary scan test access port (TAP) in the BGA package only. The TQFP package does not offer this functionality. This part operates in accordance with IEEE Standard 1149.1-1900, but doesn’t have the set of functions required for full 1149.1 compliance.
  • Page 11 The IDCODE instruction is loaded into the instruction register upon power-up or whenever the TAP controller is given a test logic reset state. Document #: 38-05537 Rev. *H CY7C1354CV25 CY7C1356CV25 SAMPLE Z The SAMPLE Z instruction causes the boundary scan register to be connected between the TDI and TDO pins when the TAP controller is in a Shift-DR state.
  • Page 12 TH t CYC t TMSS t TMSH t TDIS t TDIH t TDOX DON’T CARE UNDEFINED [11, 12] Over the Operating Range Description = 1 ns. CY7C1354CV25 CY7C1356CV25 t TDOV Min. Max. Unit Page 12 of 28 [+] Feedback...
  • Page 13 Output LOW Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage Input Load Current Identification Register Definitions Instruction Field CY7C1354CV25 Revision Number (31:29) Cypress Device ID (28:12) 01011001000100110 Cypress JEDEC ID (11:1) 00000110100 ID Register Presence (0) Scan Register Sizes...
  • Page 14 Boundary Scan Exit Order (256K × 36) Bit # 119-ball ID Document #: 38-05537 Rev. *H Boundary Scan Exit Order (256K × 36) Bit # 165-ball ID CY7C1354CV25 CY7C1356CV25 (continued) 119-ball ID 165-ball ID Not Bonded Not Bonded (Preset to 1)
  • Page 15 (Preset to 0) Not Bonded (Preset to 0) Not Bonded (Preset to 0) Not Bonded (Preset to 0) Not Bonded (Preset to 0) CY7C1354CV25 CY7C1356CV25 (continued) 119-ball ID 165-ball ID Not Bonded Not Bonded (Preset to 0) (Preset to 0)
  • Page 16: Maximum Ratings

    , f = 0 /2), undershoot: V (AC)> –2V (Pulse width less than t (min.) within 200 ms. During this time V < V and V CY7C1354CV25 CY7C1356CV25 Ambient Temperature 0°C to +70°C 2.5V ± 5% –40°C to +85°C Min.
  • Page 17 = 2.5V 100 TQFP Test Conditions Package 29.41 6.13 R = 1667Ω 2.5V OUTPUT 5 pF R = 1538Ω INCLUDING JIG AND SCOPE CY7C1354CV25 CY7C1356CV25 119 BGA 165 FBGA Max. Max. Unit 119 BGA 165 FBGA Package Package Unit 34.1 16.8 °C/W...
  • Page 18: Switching Characteristics

    V minimum initially, before a Read or Write operation can be and t is less than t to eliminate bus contention between SRAMs when sharing the same EOLZ CY7C1354CV25 CY7C1356CV25 –200 –166 Min. Max.
  • Page 19: Switching Waveforms

    D(A2+1) BURST READ READ BURST WRITE Q(A3) Q(A4) READ Q(A4+1) DON’T CARE UNDEFINED is LOW. When CE is HIGH,CE is HIGH or CE CY7C1354CV25 CY7C1356CV25 Q(A4) Q(A4+1) D(A5) OEHZ OELZ WRITE READ WRITE DESELECT D(A5) Q(A6) D(A7) is LOW or CE is HIGH.
  • Page 20 26. The IGNORE CLOCK EDGE or STALL cycle (Clock 3) illustrated CEN being used to create a pause. A write is not performed during this cycle. Document #: 38-05537 Rev. *H [23, 24, 26] D(A1) Q(A2) Q(A3) READ WRITE STALL Q(A3) D(A4) DON’T CARE CY7C1354CV25 CY7C1356CV25 D(A4) Q(A5) READ DESELECT CONTINUE Q(A5) DESELECT UNDEFINED Page 20 of 28 [+] Feedback...
  • Page 21 27. Device must be deselected when entering ZZ mode. See cycle description table for all possible signal conditions to deselect the device. 28. I/Os are in High-Z when exiting ZZ sleep mode. Document #: 38-05537 Rev. *H CY7C1354CV25 CY7C1356CV25 ZZREC...
  • Page 22: Ordering Information

    CY7C1354CV25-166BZC 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) CY7C1356CV25-166BZC CY7C1354CV25-166BZXC 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free CY7C1356CV25-166BZXC CY7C1354CV25-166AXI 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free...
  • Page 23 CY7C1354CV25-200BZC 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) CY7C1356CV25-200BZC CY7C1354CV25-200BZXC 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free CY7C1356CV25-200BZXC CY7C1354CV25-200AXI 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free...
  • Page 24 CY7C1354CV25-250BZC 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) CY7C1356CV25-250BZC CY7C1354CV25-250BZXC 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free CY7C1356CV25-250BZXC CY7C1354CV25-250AXI 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free...
  • Page 25: Package Diagrams

    2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 3. DIMENSIONS IN MILLIMETERS CY7C1354CV25 CY7C1356CV25 1.40±0.05 12°±1°...
  • Page 26 A1 CORNER 0.70 REF. 12.00 30° TYP. SEATING PLANE Document #: 38-05537 Rev. *H 119-Ball BGA (14 x 22 x 2.4 mm) (51-85115) Ø1.00(3X) REF. 0.15(4X) CY7C1354CV25 CY7C1356CV25 Ø0.05 M C Ø0.25 M C A B Ø0.75±0.15(119X) 1.27 3.81 7.62 14.00±0.20...
  • Page 27 NOTES : SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD) PACKAGE WEIGHT : 0.475g JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE CODE : BB0AC CY7C1354CV25 CY7C1356CV25 BOTTOM VIEW PIN 1 CORNER Ø0.05 M C Ø0.25 M C A B 0.06...
  • Page 28 Document History Page Document Title: CY7C1354CV25/CY7C1356CV25 9-Mbit (256K x 36/512K x 18) Pipelined SRAM with NoBL™ Architecture Document Number: 38-05537 REV. ECN No. Issue Date 242032 See ECN 278969 See ECN 284929 See ECN 323636 See ECN 332879 See ECN...

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