Cypress Semiconductor NoBL CY7C1355C Specification Sheet

9-mbit (256k x 36/512k x 18) flow-through sram with nobl architecture

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Features
• No Bus Latency™ (NoBL™) architecture eliminates
dead cycles between write and read cycles
• Can support up to 133-MHz bus operations with zero
wait states
— Data is transferred on every clock
• Pin compatible and functionally equivalent to ZBT™
devices
• Internally self-timed output buffer control to eliminate
the need to use OE
• Registered inputs for flow-through operation
• Byte Write capability
• 3.3V/2.5V I/O power supply (V
• Fast clock-to-output times
— 6.5 ns (for 133-MHz device)
• Clock Enable (CEN) pin to enable clock and suspend
operation
• Synchronous self-timed writes
• Asynchronous Output Enable
• Available in JEDEC-standard and lead-free 100-Pin
TQFP, lead-free and non lead-free 119-Ball BGA
package and 165-Ball FBGA package
• Three chip enables for simple depth expansion.
• Automatic Power-down feature available using ZZ
mode or CE deselect
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• Burst Capability—linear or interleaved burst order
• Low standby power
Selection Guide
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
Note:
1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05539 Rev. *E
Flow-Through SRAM with NoBL™ Architecture
)
DDQ
198 Champion Court
9-Mbit (256K x 36/512K x 18)
Functional Description
The CY7C1355C/CY7C1357C is a 3.3V, 256K x 36/512K x 18
Synchronous Flow-through Burst SRAM designed specifically
to support unlimited true back-to-back Read/Write operations
without
the
insertion
CY7C1355C/CY7C1357C is equipped with the advanced No
Bus Latency (NoBL) logic required to enable consecutive
Read/Write operations with data being transferred on every
clock cycle. This feature dramatically improves the throughput
of data through the SRAM, especially in systems that require
frequent Write-Read transitions.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. The clock input is qualified by
the Clock Enable (CEN) signal, which when deasserted
suspends operation and extends the previous clock cycle.
Maximum access delay from the clock rise is 6.5 ns (133-MHz
device).
Write operations are controlled by the two or four Byte Write
Select (BW
) and a Write Enable (WE) input. All writes are
X
conducted with on-chip synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. In order to avoid bus
contention, the output drivers are synchronously tri-stated
during the data portion of a write sequence.
133 MHz
100 MHz
6.5
250
40
,
San Jose
CA 95134-1709
CY7C1355C
CY7C1357C
[1]
of
wait
states.
, CE
, CE
) and an
1
2
3
Unit
7.5
ns
180
mA
40
mA
408-943-2600
Revised September 14, 2006
The
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Summary of Contents for Cypress Semiconductor NoBL CY7C1355C

  • Page 1 Flow-Through SRAM with NoBL™ Architecture Features • No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles • Can support up to 133-MHz bus operations with zero wait states — Data is transferred on every clock • Pin compatible and functionally equivalent to ZBT™ devices •...
  • Page 2 Logic Block Diagram – CY7C1355C (256K x 36) ADDRESS A0, A1, A REGISTER MODE WRITE ADDRESS ADV/LD READ LOGIC SLEEP CONTROL Logic Block Diagram – CY7C1357C (512K x 18) ADDRESS A0, A1, A REGISTER MODE WRITE ADDRESS ADV/LD READ LOGIC SLEEP CONTROL Document #: 38-05539 Rev.
  • Page 3: Pin Configurations

    Pin Configurations BYTE C Vss/DNU BYTE D Document #: 38-05539 Rev. *E 100-Pin TQFP Pinout CY7C1355C CY7C1355C CY7C1357C BYTE B BYTE A Page 3 of 28 [+] Feedback...
  • Page 4 Pin Configurations (continued) Vss/DNU BYTE B Document #: 38-05539 Rev. *E 100-Pin TQFP Pinout CY7C1357C CY7C1355C CY7C1357C BYTE A Page 4 of 28 [+] Feedback...
  • Page 5 Pin Configurations (continued) 119-Ball BGA Pinout (3 Chip Enables with JTAG) NC/576M NC/1G NC/144M NC/576M NC/1G NC/144M NC/72M Document #: 38-05539 Rev. *E CY7C1355C (256K x 36) NC/18M ADV/LD MODE NC/72M CY7C1357C (512K x 18) NC/18M ADV/LD MODE NC/36M CY7C1355C CY7C1357C NC/288M NC/36M...
  • Page 6 Pin Configurations (continued) 165-Ball FBGA Pinout (3 Chip enable with JTAG) NC/576M NC/1G NC/144M NC/72M MODE NC/36M NC/576M NC/1G NC/144M NC/72M MODE NC/36M Document #: 38-05539 Rev. *E CY7C1355C (256K x 36) CY7C1357C (512K x 18) CY7C1355C CY7C1357C ADV/LD NC/18M NC/288M ADV/LD NC/18M...
  • Page 7: Pin Definitions

    Pin Definitions Name Input- Address Inputs used to select one of the address locations. Sampled at the rising edge Synchronous of the CLK. A , BW Input- Byte Write Inputs, active LOW. Qualified with WE to conduct Writes to the SRAM. Sampled , BW Synchronous on the rising edge of CLK.
  • Page 8: Functional Overview

    Pin Definitions (continued) Name JTAG serial input Serial data-In to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG feature Synchronous is not being utilized, this pin can be disconnected or connected to V available on TQFP packages. JTAG Clock input to the JTAG circuitry.
  • Page 9: Truth Table

    precaution, DQs and DQP are automatically tri-stated during the data portion of a write cycle, regardless of the state of OE. Burst Write Accesses The CY7C1355C/CY7C1357C has an on-chip burst counter that allows the user the ability to supply a single address and conduct up to four Write operations without reasserting the address inputs.
  • Page 10 [2, 3, 4, 5, 6, 7, 8] Truth Table Operation NOP/WRITE ABORT (Begin Burst) WRITE ABORT (Continue Burst) IGNORE CLOCK EDGE (Stall) SLEEP MODE Partial Truth Table for Read/Write Function (CY7C1355C) Read Write No bytes written Write Byte A – (DQ and DQP Write Byte B –...
  • Page 11: Tap Controller State Diagram

    IEEE 1149.1 Serial Boundary Scan (JTAG) The CY7C1355C/CY7C1357C incorporates a serial boundary scan test access port (TAP) in the BGA package only. The TQFP package does not offer this functionality. This part operates in accordance with IEEE Standard 1149.1-1900, but doesn’t have the set of functions required for full 1149.1 compliance.
  • Page 12 Diagram. Upon power-up, the instruction register is loaded with the IDCODE instruction. It is also loaded with the IDCODE instruction if the controller is placed in a reset state as described in the previous section. When the TAP controller is in the Capture-IR state, the two least significant bits are loaded with a binary “01”...
  • Page 13 TAP Timing Test Clock (TCK) Test Mode Select (TMS) Test Data-In (TDI) Test Data-Out (TDO) TAP AC Switching Characteristics Parameter Clock TCK Clock Cycle Time TCYC TCK Clock Frequency TCK Clock HIGH Time TCK Clock LOW Time Output Times TCK Clock LOW to TDO Valid TDOV TCK Clock LOW to TDO Invalid TDOX...
  • Page 14 3.3V TAP AC Test Conditions Input pulse levels ... V Input rise and fall times ... 1 ns Input timing reference levels ...1.5V Output reference levels...1.5V Test load termination supply voltage...1.5V 3.3V TAP AC Output Load Equivalent 1.5V Z = 50Ω TAP DC Electrical Characteristics [12] otherwise noted)
  • Page 15: Identification Codes

    Scan Register Sizes Register Name Instruction Bypass Boundary Scan Order (119-ball BGA package) Boundary Scan Order (165-ball FBGA package) Identification Codes Instruction Code EXTEST Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces all SRAM outputs to High-Z state. This instruction is not 1149.1 compliant. IDCODE Loads the ID register with the vendor ID code and places the register between TDI and TDO.
  • Page 16 119-ball BGA Boundary Scan Order CY7C1355C (256K x 36) Signal Bit# ball ID Name Bit# ball ID ADV/LD Internal Document #: 38-05539 Rev. *E CY7C1357C (512K x 18) Signal Signal Name Bit# ball Id Name MODE ADV/LD Internal Internal Internal Internal Internal Internal...
  • Page 17 165-ball FBGA Boundary Scan Order CY7C1355C (256K x 36) Signal Bit# ball ID Name Bit# ball ID ADV/LD Internal Document #: 38-05539 Rev. *E Signal Name Bit# ball ID MODE Internal Internal Internal Internal Internal Internal Internal Internal Internal CY7C1355C CY7C1357C CY7C1357C (512K x 18) Signal...
  • Page 18: Maximum Ratings

    Maximum Ratings (Above which the useful life may be impaired. For user guide- lines, not tested.) Storage Temperature ... –65°C to +150°C Ambient Temperature with Power Applied... –55°C to +125°C Supply Voltage on V Relative to GND... –0.5V to +4.6V Supply Voltage on V Relative to GND ...
  • Page 19 [15] Capacitance Parameter Description Input Capacitance Clock Input Capacitance Input/Output Capacitance [15] Thermal Resistance Parameter Description Θ Thermal Resistance (Junction to Ambient) Θ Thermal Resistance (Junction to Case) AC Test Loads and Waveforms 3.3V I/O Test Load OUTPUT OUTPUT = 50Ω = 50Ω...
  • Page 20: Switching Characteristics

    Switching Characteristics Over the Operating Range Parameter (Typical) to the First Access POWER Clock Clock Cycle Time Clock HIGH Clock LOW Output Times Data Output Valid after CLK Rise Data Output Hold after CLK Rise Clock to Low-Z Clock to High-Z OE LOW to Output Valid OE LOW to Output Low-Z OELZ...
  • Page 21: Switching Waveforms

    Switching Waveforms [22, 23, 24] Read/Write Waveforms t CYC t CENS t CENH t CL t CH t CES t CEH ADV/LD ADDRESS t AS t AH D(A1) t DS t DH COMMAND WRITE WRITE D(A1) D(A2) Notes: 22. For this waveform ZZ is tied LOW. 23.
  • Page 22 Switching Waveforms (continued) [22, 23, 25] NOP, STALL and DESELECT Cycles t CYC t CENS t CENH t CL t CH t CES t CEH ADV/LD ADDRESS t AS t AH D(A1) t DS t DH COMMAND WRITE WRITE D(A1) D(A2) D(A2+1) Note:...
  • Page 23 Switching Waveforms (continued) [26, 27] ZZ Mode Timing t ZZ t ZZI SUPPLY I DDZZ ALL INPUTS (except ZZ) Outputs (Q) Notes: 26. Device must be deselected when entering ZZ mode. See truth table for all possible signal conditions to deselect the device. 27.
  • Page 24: Ordering Information

    Ordering Information Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit Speed Package (MHz) Ordering Code Diagram CY7C1355C-133AXC 51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free CY7C1357C-133AXC CY7C1355C-133BGC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm)
  • Page 25: Package Diagrams

    Package Diagrams 100-Pin Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm) (51-85050) R 0.08 MIN. 0° MIN. 0.20 MAX. 0.25 GAUGE PLANE R 0.08 MIN. 0°-7° 0.20 MAX. 0.60±0.15 0.20 MIN. 1.00 REF. DETAIL Document #: 38-05539 Rev. *E 16.00±0.20 14.00±0.10 0.30±0.08...
  • Page 26 Package Diagrams (continued) A1 CORNER 0.70 REF. 12.00 30° TYP. SEATING PLANE Document #: 38-05539 Rev. *E 119-Ball BGA (14 x 22 x 2.4 mm) (51-85115) Ø1.00(3X) REF. 0.15(4X) CY7C1355C CY7C1357C Ø0.05 M C Ø0.25 M C A B Ø0.75±0.15(119X) 1.27 3.81 7.62...
  • Page 27 Package Diagrams (continued) 165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D TOP VIEW TOP VIEW PIN 1 CORNER PIN 1 CORNER 13.00±0.10 13.00±0.10 SEATING PLANE SEATING PLANE NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation. ZBT is a trademark of Integrated Device Technology, Inc.
  • Page 28 Document History Page Document Title: CY7C1355C/CY7C1357C 9-Mbit (256K x 36/512K x 18) Flow-Through SRAM with NoBL™ Architecture Document Number: 38-05539 Orig. of REV. ECN NO. Issue Date Change 242032 See ECN 332059 See ECN 351895 See ECN 377095 See ECN 408298 See ECN 501793...

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