Cypress Semiconductor CY7C1546V18 Specification Sheet

72-mbit ddr-ii+ sram 2-word burst architecture (2.0 cycle read latency)

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Features
72-Mbit density (8M x 8, 8M x 9, 4M x 18, 2M x 36)
375 MHz clock for high bandwidth
2-word burst for reducing address bus frequency
Double Data Rate (DDR) interfaces
(data transferred at 750 MHz) at 375 MHz
Available in 2.0 clock cycle latency
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Data valid pin (QVLD) to indicate valid data on the output
Synchronous internally self-timed writes
Core V
= 1.8V ± 0.1V; IO V
DD
HSTL inputs and variable drive HSTL output buffers
Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Configurations
With Read Cycle Latency of 2.0 cycles:
CY7C1546V18 – 8M x 8
CY7C1557V18 – 8M x 9
CY7C1548V18 – 4M x 18
CY7C1550V18 – 2M x 36
Selection Guide
Description
Maximum Operating Frequency
Maximum Operating Current
Note
1. The QDR consortium specification for V
= 1.4V to V
.
DD
Cypress Semiconductor Corporation
Document Number: 001-06550 Rev. *E
72-Mbit DDR-II+ SRAM 2-Word Burst
Architecture (2.0 Cycle Read Latency)
[1]
= 1.4V to V
DDQ
DD
is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting V
DDQ
198 Champion Court
CY7C1546V18, CY7C1557V18
CY7C1548V18, CY7C1550V18

Functional Description

The CY7C1546V18, CY7C1557V18, CY7C1548V18, and
CY7C1550V18 are 1.8V Synchronous Pipelined SRAM
equipped with DDR-II+ architecture. The DDR-II+ consists of an
SRAM core with advanced synchronous peripheral circuitry.
Addresses for read and write are latched on alternate rising
edges of the input (K) clock. Write data is registered on the rising
edges of both K and K. Read data is driven on the rising edges
of both K and K. Each address location is associated with two
8-bit words (CY7C1546V18), 9-bit words (CY7C1557V18),
18-bit words (CY7C1548V18), or 36-bit words (CY7C1550V18)
that burst sequentially into or out of the device.
Asynchronous inputs include an output impedance matching
input (ZQ). Synchronous data outputs (Q, sharing the same
physical pins as the data inputs, D) are tightly matched to the two
output echo clocks CQ/CQ, eliminating the need for separately
capturing data from each individual DDR SRAM in the system
design.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the K or K input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
375 MHz
333 MHz
375
x8
1300
1200
x9
1300
1200
x18
1300
1200
x36
1300
1200
,
San Jose
CA 95134-1709
300 MHz
333
300
1100
1100
1100
1100
408-943-2600
Revised March 11, 2008
Unit
MHz
mA
DDQ
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Summary of Contents for Cypress Semiconductor CY7C1546V18

  • Page 1: Functional Description

    K and K. Read data is driven on the rising edges of both K and K. Each address location is associated with two 8-bit words (CY7C1546V18), 9-bit words (CY7C1557V18), 18-bit words (CY7C1548V18), or 36-bit words (CY7C1550V18) that burst sequentially into or out of the device.
  • Page 2 Logic Block Diagram (CY7C1546V18) (21:0) Address Register Gen. DOFF Control Logic [1:0] Logic Block Diagram (CY7C1557V18) (21:0) Address Register Gen. DOFF Control Logic Document Number: 001-06550 Rev. *E CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 Write Write Output Logic Control Read Data Reg.
  • Page 3 DOFF Control Logic [1:0] Logic Block Diagram (CY7C1550V18) (19:0) Address Register Gen. DOFF Control Logic [3:0] Document Number: 001-06550 Rev. *E CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 Write Write Output Logic Control Read Data Reg. Reg. Reg. Reg. Write Write Output Logic Control Read Data Reg.
  • Page 4: Pin Configuration

    Pin Configuration The pin configuration for CY7C1546V18, CY7C1557V18, CY7C1548V18, and CY7C1550V18 follow. DOFF DOFF Note 2. NC/144M and NC/288M are not connected to the die and can be tied to any voltage level. Document Number: 001-06550 Rev. *E CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout...
  • Page 5 Pin Configuration (continued) The pin configuration for CY7C1546V18, CY7C1557V18, CY7C1548V18, and CY7C1550V18 follow. DQ10 DQ11 DQ12 DQ13 DOFF DQ14 DQ15 DQ16 DQ17 NC/144M DQ27 DQ18 DQ28 DQ29 DQ19 DQ20 DQ30 DQ21 DQ31 DQ22 DOFF DQ32 DQ23 DQ33 DQ24 DQ34 DQ35...
  • Page 6: Pin Definitions

    These address inputs are multiplexed for both read and write operations. Internally, the device is organized as 8M x 8 (2 arrays each of 4M x 8) for CY7C1546V18, 8M x 9 (2 arrays each of 4M x 9) for CY7C1557V18, 4M x 18 (2 arrays each of 2M x 18) for CY7C1548V18, and 2M x 36 (2 arrays each of 1M x 36) for CY7C1550V18.
  • Page 7 Ground Ground for the Device. Power Supply Power Supply Inputs for the Outputs of the Device. Document Number: 001-06550 Rev. *E CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 Pin Description output impedance are set to 0.2 x RQ, where RQ is a resistor...
  • Page 8: Functional Overview

    (K). CY7C1548V18 is described in the following sections. The same basic descriptions apply to CY7C1546V18, CY7C1557V18, and CY7C1550V18. Read Operations The CY7C1548V18 is organized internally as two arrays of 2M x 18.
  • Page 9: Application Example

    Source CLK Echo Clock1/Echo Clock1 Echo Clock2/Echo Clock2 Document Number: 001-06550 Rev. *E CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 These chips use a Delay Lock Loop (DLL) that is designed to function between 120 MHz and the specified maximum clock frequency. The DLL may be disabled by applying ground to the DOFF pin.
  • Page 10: Truth Table

    Truth Table The truth table for CY7C1546V18, CY7C1557V18, CY7C1548V18, and CY7C1550V18 follows. Operation Write Cycle: Load address; wait one cycle; input write data on consecutive K and K rising edges. Read Cycle: (2.0 cycle Latency) Load address; wait two cycle;...
  • Page 11 L–H – L–H – L–H – L–H – Document Number: 001-06550 Rev. *E CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 [3, 9] Comments [3, 9] Comments – During the data portion of a write sequence, all four bytes (D the device. L–H During the data portion of a write sequence, all four bytes (D the device.
  • Page 12 TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK. Document Number: 001-06550 Rev. *E CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 Instruction Register Three-bit instructions can be serially loaded into the instruction register.
  • Page 13 Document Number: 001-06550 Rev. *E CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 The shifting of data for the SAMPLE and PRELOAD phases can occur concurrently when required, that is, while the data captured is shifted out, the preloaded data can be shifted in.
  • Page 14: Tap Controller State Diagram

    The state diagram for the TAP controller follows. TEST-LOGIC RESET TEST-LOGIC/ IDLE Note 10. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document Number: 001-06550 Rev. *E CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 [10] SELECT DR-SCAN CAPTURE-DR SHIFT-DR EXIT1-DR...
  • Page 15 11. These characteristics apply to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in 12. Test conditions are specified using the load in TAP AC Test Conditions. t 13. All voltage refers to ground. Document Number: 001-06550 Rev. *E CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 Bypass Register Instruction Register...
  • Page 16 Document Number: 001-06550 Rev. *E Description Figure 2. TAP Timing and Test Conditions 0.9V 50Ω 1.8V = 20 pF TMSH TMSS TDIS TDIH TDOV CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 [12] ALL INPUT PULSES 0.9V TCYC TDOX Page 16 of 28 Unit [+] Feedback [+] Feedback...
  • Page 17: Instruction Codes

    RESERVED Do Not Use: This instruction is reserved for future use. BYPASS Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. Document Number: 001-06550 Rev. *E CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 Value CY7C1557V18 CY7C1548V18 00000110100...
  • Page 18 Boundary Scan Order Bit Number Bump ID Bit Number Document Number: 001-06550 Rev. *E CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 Bump ID Bit Number Bump ID Bit Number Bump ID Internal Page 18 of 28 [+] Feedback [+] Feedback...
  • Page 19: Power-Up Sequence

    Figure 3. Power Up Waveforms > 2048 Stable Clock V DD /V DDQ Stable (< + 0.1V DC per 50 ns) Fix HIGH (tie to V DDQ ) CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 KC Var Start Normal Operation...
  • Page 20: Maximum Ratings

    , whichever is larger. V 20. The operation current is calculated with 50% read cycle and 50% write cycle. Document Number: 001-06550 Rev. *E CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 Current into Outputs (LOW) ... 20 mA Static Discharge Voltage (MIL-STD-883, M. 3015)... >2001V Latch up Current...
  • Page 21: Dc Electrical Characteristics

    Tested initially and after any design or process change that may affect these parameters. Parameter Description Θ Thermal Resistance (Junction to Ambient) Θ Thermal Resistance (Junction to Case) Document Number: 001-06550 Rev. *E CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 Test Conditions Max V 375MHz (x8) Both Ports Deselected, (x9) ≥ V ≤ V...
  • Page 22 21. Unless otherwise noted, test conditions assume signal transition time of 2V/ns, timing reference levels of 0.75V, V levels of 0.25V to 1.25V, output loading of the specified I Document Number: 001-06550 Rev. *E CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 Figure 4. AC Test Loads and Waveforms = 0.75V...
  • Page 23: Switching Characteristics

    27. t specification is applicable for both rising and falling edges of QVLD signal. QVLD 28. Hold to >V or <V Document Number: 001-06550 Rev. *E CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 Description [23] , BWS , BWS [24]...
  • Page 24: Switching Waveforms

    32. In this example, if address A4 = A3, then data Q40 = D30 and Q41 = D31. Write data is forwarded immediately as read results. This note applies to the whole diagram. Document Number: 001-06550 Rev. *E CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18...
  • Page 25: Ordering Information

    CY7C1550V18-333BZI CY7C1546V18-333BZXI CY7C1557V18-333BZXI CY7C1548V18-333BZXI CY7C1550V18-333BZXI Document Number: 001-06550 Rev. *E CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 Package Diagram Package Type 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
  • Page 26 CY7C1550V18-300BZI CY7C1546V18-300BZXI CY7C1557V18-300BZXI CY7C1548V18-300BZXI CY7C1550V18-300BZXI Document Number: 001-06550 Rev. *E CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 Package Diagram Package Type 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
  • Page 27: Package Diagram

    Package Diagram Document Number: 001-06550 Rev. *E CY7C1546V18, CY7C1557V18 CY7C1548V18, CY7C1550V18 Figure 6. 165-Ball FBGA (15 x 17 x 1.4 mm) 51-85195-*A Page 27 of 28 [+] Feedback [+] Feedback...
  • Page 28 Document History Page Document Title: CY7C1546V18/CY7C1557V18/CY7C1548V18/CY7C1550V18, 72-Mbit DDR-II+ SRAM 2-Word Burst Architec- ture (2.0 Cycle Read Latency) Document Number: 001-06550 Issue Orig. of REV. ECN No. Date Change 432718 See ECN 437000 See ECN 461934 See ECN 497567 See ECN...

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Cy7c1548v18Cy7c1550v18Cy7c1557v18

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