Cypress Semiconductor CY7C1516JV18 Specification Sheet

72-mbit ddr-ii sram 2-word burst architecture

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Features
72-Mbit density (8M x 8, 8M x 9, 4M x 18, 2M x 36)
300 MHz clock for high bandwidth
2-word burst for reducing address bus frequency
Double Data Rate (DDR) interfaces
(data transferred at 600 MHz) at 300 MHz
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high speed
systems
Synchronous internally self-timed writes
DDR-II operates with 1.5 cycle read latency when Delay Lock
Loop (DLL) is enabled
Operates similar to a DDR-I device with 1 cycle read latency in
DLL off mode
1.8V core power supply with HSTL inputs and outputs
Variable drive HSTL output buffers
Expanded HSTL output voltage (1.4V–V
Available in 165-ball FBGA package (15 x 17 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Configurations
CY7C1516JV18 – 8M x 8
CY7C1527JV18 – 8M x 9
CY7C1518JV18 – 4M x 18
CY7C1520JV18 – 2M x 36
Selection Guide
Description
Maximum Operating Frequency
Maximum Operating Current
Cypress Semiconductor Corporation
Document Number: 001-12559 Rev. *D
72-Mbit DDR-II SRAM 2-Word

Functional Description

The CY7C1516JV18, CY7C1527JV18, CY7C1518JV18, and
CY7C1520JV18 are 1.8V Synchronous Pipelined SRAM
equipped with DDR-II architecture. The DDR-II consists of an
SRAM core with advanced synchronous peripheral circuitry and
a 1-bit burst counter. Addresses for read and write are latched
on alternate rising edges of the input (K) clock. Write data is
registered on the rising edges of both K and K. Read data is
driven on the rising edges of C and C if provided, or on the rising
edge of K and K if C/C are not provided. Each address location
is associated with two 8-bit words in the case of CY7C1516JV18
and two 9-bit words in the case of CY7C1527JV18 that burst
sequentially into or out of the device. The burst counter always
starts with a "0" internally in the case of CY7C1516JV18 and
CY7C1527JV18. On CY7C1518JV18 and CY7C1520JV18, the
burst counter takes in the least significant bit of the external
address and bursts two 18-bit words in the case of
CY7C1518JV18 and two 36-bit words in the case of
CY7C1520JV18 sequentially into or out of the device.
Asynchronous inputs include an output impedance matching
input (ZQ). Synchronous data outputs (Q, sharing the same
physical pins as the data inputs D) are tightly matched to the two
output echo clocks CQ/CQ, eliminating the need for separately
capturing data from each individual DDR SRAM in the system
design. Output data clocks (C/C) enable maximum system
clocking and data synchronization flexibility.
)
DD
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
300 MHz
x8
x9
x18
x36
198 Champion Court
CY7C1516JV18, CY7C1527JV18
CY7C1518JV18, CY7C1520JV18
Burst Architecture
250 MHz
300
250
1035
800
1035
800
1045
800
1055
900
,
San Jose
CA 95134-1709
Unit
MHz
mA
408-943-2600
Revised June 25, 2008
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Summary of Contents for Cypress Semiconductor CY7C1516JV18

  • Page 1: Functional Description

    C and C if provided, or on the rising edge of K and K if C/C are not provided. Each address location is associated with two 8-bit words in the case of CY7C1516JV18 and two 9-bit words in the case of CY7C1527JV18 that burst sequentially into or out of the device.
  • Page 2 Logic Block Diagram (CY7C1516JV18) (21:0) Address Register Gen. DOFF Control Logic [1:0] Logic Block Diagram (CY7C1527JV18) (21:0) Address Register Gen. DOFF Control Logic Document Number: 001-12559 Rev. *D CY7C1516JV18, CY7C1527JV18 CY7C1518JV18, CY7C1520JV18 Write Write Output Logic Control Read Data Reg.
  • Page 3 [1:0] Logic Block Diagram (CY7C1520JV18) Burst Logic (20:0) Address (20:1) Register Gen. DOFF Control Logic [3:0] Document Number: 001-12559 Rev. *D CY7C1516JV18, CY7C1527JV18 CY7C1518JV18, CY7C1520JV18 Write Write Output Logic Control Read Data Reg. Reg. Reg. Reg. Write Write Output Logic Control Read Data Reg.
  • Page 4: Pin Configuration

    Pin Configuration The pin configuration for CY7C1516JV18, CY7C1527JV18, CY7C1518JV18, and CY7C1520JV18 follow. DOFF DOFF Note 1. NC/144M and NC/288M are not connected to the die and can be tied to any voltage level. Document Number: 001-12559 Rev. *D CY7C1516JV18, CY7C1527JV18 CY7C1518JV18, CY7C1520JV18 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout...
  • Page 5 Pin Configuration The pin configuration for CY7C1516JV18, CY7C1527JV18, CY7C1518JV18, and CY7C1520JV18 follow. DQ10 DQ11 DQ12 DQ13 DOFF DQ14 DQ15 DQ16 DQ17 NC/144M DQ27 DQ18 DQ28 DQ29 DQ19 DQ20 DQ30 DQ21 DQ31 DQ22 DOFF DQ32 DQ23 DQ33 DQ24 DQ34 DQ35 DQ25 DQ26 Document Number: 001-12559 Rev.
  • Page 6: Pin Definitions

    Synchronous device is organized as 8M x 8 (2 arrays each of 4M x 8) for CY7C1516JV18 and 8M x 9 (2 arrays each of 4M x9) for CY7C1527JV18, 4M x 18 (2 arrays each of 2M x 18) for CY7C1518JV18, and 2M x 36 (2 arrays each of 1M x 36) for CY7C1520JV18.
  • Page 7 Ground for the Device. Power Supply Power Supply Inputs for the Outputs of the Device. Document Number: 001-12559 Rev. *D CY7C1516JV18, CY7C1527JV18 CY7C1518JV18, CY7C1520JV18 Pin Description output impedance are set to 0.2 x RQ, where RQ is a resistor connected...
  • Page 8: Functional Overview

    [0:X] input registers controlled by the rising edge of the input clock (K). CY7C1518JV18 is described in the following sections. The same basic descriptions apply to CY7C1516JV18, CY7C1527JV18, and CY7C1520JV18. Read Operations The CY7C1518JV18 is organized internally as a single array of 4M x 18.
  • Page 9: Application Example

    Source CLK# Echo Clock1/Echo Clock#1 Echo Clock2/Echo Clock#2 Document Number: 001-12559 Rev. *D CY7C1516JV18, CY7C1527JV18 CY7C1518JV18, CY7C1520JV18 DDR-II. CQ is referenced with respect to C and CQ is referenced with respect to C. These are free-running clocks and are synchronized to the output clock of the DDR-II. In single clock mode, CQ is generated with respect to K and CQ is generated with respect to K.
  • Page 10: Truth Table

    4. On CY7C1518JV18 and CY7C1520JV18, “A1” represents address location latched by the devices when transaction was initiated and “A2” represents the addresses sequence in the burst. On CY7C1516JV18 and CY7C1527JV18, “A1” represents A + ‘0’ and “A2” represents A + ‘1’.
  • Page 11 L–H – L–H – L–H – L–H – Document Number: 001-12559 Rev. *D CY7C1516JV18, CY7C1527JV18 CY7C1518JV18, CY7C1520JV18 [2, 8] Comments [2, 8] Comments – During the data portion of a write sequence, all four bytes (D the device. L–H During the data portion of a write sequence, all four bytes (D the device.
  • Page 12 TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK. Document Number: 001-12559 Rev. *D CY7C1516JV18, CY7C1527JV18 CY7C1518JV18, CY7C1520JV18 Instruction Register Three-bit instructions can be serially loaded into the instruction register.
  • Page 13 TAP into the Shift-DR state. This places the boundary scan register between the TDI and TDO pins. Document Number: 001-12559 Rev. *D CY7C1516JV18, CY7C1527JV18 CY7C1518JV18, CY7C1520JV18 PRELOAD places an initial data pattern at the latched parallel outputs of the boundary scan register cells before the selection of another boundary scan test operation.
  • Page 14: Tap Controller State Diagram

    The state diagram for the TAP controller follows. TEST-LOGIC RESET TEST-LOGIC/ IDLE Note 9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document Number: 001-12559 Rev. *D CY7C1516JV18, CY7C1527JV18 CY7C1518JV18, CY7C1520JV18 SELECT DR-SCAN CAPTURE-DR SHIFT-DR EXIT1-DR PAUSE-DR...
  • Page 15 10. These characteristics pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the 11. Overshoot: V (AC) < V + 0.85V (Pulse width less than t 12. All Voltage referenced to Ground. Document Number: 001-12559 Rev. *D CY7C1516JV18, CY7C1527JV18 CY7C1518JV18, CY7C1520JV18 Bypass Register Instruction Register Identification Register Boundary Scan Register...
  • Page 16 14. Test conditions are specified using the load in TAP AC Test Conditions. t Document Number: 001-12559 Rev. *D CY7C1516JV18, CY7C1527JV18 CY7C1518JV18, CY7C1520JV18 Description [14] Figure 2.
  • Page 17: Instruction Codes

    RESERVED Do Not Use: This instruction is reserved for future use. BYPASS Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. Document Number: 001-12559 Rev. *D CY7C1516JV18, CY7C1527JV18 CY7C1518JV18, CY7C1520JV18 Value CY7C1527JV18 CY7C1518JV18 00000110100...
  • Page 18 Boundary Scan Order Bit # Bump ID Bit # Document Number: 001-12559 Rev. *D CY7C1516JV18, CY7C1527JV18 CY7C1518JV18, CY7C1520JV18 Bump ID Bit # Bump ID Bit # Bump ID Internal Page 18 of 26 [+] Feedback...
  • Page 19: Start Normal Operation

    DLL. Unstable Clock Clock Start (Clock Starts after DOFF Document Number: 001-12559 Rev. *D CY7C1516JV18, CY7C1527JV18 CY7C1518JV18, CY7C1520JV18 DLL Constraints ■ DLL uses K clock as its synchronizing input. The input must have low phase jitter, which is specified as t ■...
  • Page 20: Maximum Ratings

    , whichever is larger, V 19. The operation current is calculated with 50% read cycle and 50% write cycle. Document Number: 001-12559 Rev. *D CY7C1516JV18, CY7C1527JV18 CY7C1518JV18, CY7C1520JV18 Current into Outputs (LOW) ... 20 mA Static Discharge Voltage (MIL-STD-883, M 3015)... >2001V Latch Up Current ...
  • Page 21: Thermal Resistance

    20. Unless otherwise noted, test conditions assume signal transition time of 2V/ns, timing reference levels of 0.75V, V levels of 0.25V to 1.25V, and output loading of the specified I Document Number: 001-12559 Rev. *D CY7C1516JV18, CY7C1527JV18 CY7C1518JV18, CY7C1520JV18 Test Conditions Test Conditions = 25°C, f = 1 MHz, V...
  • Page 22: Switching Characteristics

    24. t are specified with a load capacitance of 5 pF as in (b) of 25. At any voltage and temperature t is less than t Document Number: 001-12559 Rev. *D CY7C1516JV18, CY7C1527JV18 CY7C1518JV18, CY7C1520JV18 Description [22] , BWS , BWS...
  • Page 23: Switching Waveforms

    28. In this example, if address A2 = A1, then data D20 = Q10 and D21 = Q11. Write data is forwarded immediately as read results. This note applies to the whole diagram. Document Number: 001-12559 Rev. *D CY7C1516JV18, CY7C1527JV18 CY7C1518JV18, CY7C1520JV18...
  • Page 24: Ordering Information

    CY7C1520JV18-250BZI CY7C1516JV18-250BZXI CY7C1527JV18-250BZXI CY7C1518JV18-250BZXI CY7C1520JV18-250BZXI Document Number: 001-12559 Rev. *D CY7C1516JV18, CY7C1527JV18 CY7C1518JV18, CY7C1520JV18 Package Diagram Package Type 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
  • Page 25: Package Diagram

    Package Diagram Figure 6. 165-Ball FBGA (15 x 17 x 1.40 mm), 51-85195 Document Number: 001-12559 Rev. *D CY7C1516JV18, CY7C1527JV18 CY7C1518JV18, CY7C1520JV18 51-85195-*A Page 25 of 26 [+] Feedback...
  • Page 26 Document History Page Document Title: CY7C1516JV18/CY7C1527JV18/CY7C1518JV18/CY7C1520JV18, 72-Mbit DDR-II SRAM 2-Word Burst Architecture Document Number: 001-12559 ISSUE ORIG. OF REV. ECN NO. DATE CHANGE 808457 See ECN 1273883 See ECN 1462589 See ECN VKN/AESA 2189567 See ECN VKN/AESA 2521072 06/25/08 NXR/PYRS...

This manual is also suitable for:

Cy7c1520jv18Cy7c1518jv18Cy7c1527jv18

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