Cypress Semiconductor CY7C1511V18 Specification Sheet

72-mbit qdr-ii sram 4-word burst architecture

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Features
Separate independent read and write data ports
Supports concurrent transactions
300 MHz clock for high bandwidth
4-word burst for reducing address bus frequency
Double Data Rate (DDR) interfaces on both read and write ports
(data transferred at 600 MHz) at 300 MHz
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Single multiplexed address input bus latches address inputs
for read and write ports
Separate port selects for depth expansion
Synchronous internally self-timed writes
Available in x8, x9, x18, and x36 configurations
Full data coherency, providing most current data
Core V
= 1.8 (± 0.1V); IO V
DD
Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
Variable drive HSTL output buffers
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Configurations
CY7C1511V18 – 8M x 8
CY7C1526V18 – 8M x 9
CY7C1513V18 – 4M x 18
CY7C1515V18 – 2M x 36
Selection Guide
Description
Maximum Operating Frequency
Maximum Operating Current
Cypress Semiconductor Corporation
Document Number: 38-05363 Rev. *F
= 1.4V to V
DDQ
DD
300 MHz
278 MHz
300
x8
930
x9
940
x18
1020
x36
1230
198 Champion Court
CY7C1511V18, CY7C1526V18
CY7C1513V18, CY7C1515V18
72-Mbit QDR™-II SRAM 4-Word

Functional Description

The CY7C1511V18, CY7C1526V18, CY7C1513V18, and
CY7C1515V18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR™-II architecture. QDR-II architecture
consists of two separate ports: the read port and the write port to
access the memory array. The read port has dedicated data
outputs to support read operations and the write port has
dedicated data inputs to support write operations. QDR-II archi-
tecture has separate data inputs and data outputs to completely
eliminate the need to "turn-around" the data bus that exists with
common IO devices. Each port can be accessed through a
common address bus. Addresses for read and write addresses
are latched on alternate rising edges of the input (K) clock.
Accesses to the QDR-II read and write ports are completely
independent of one another. To maximize data throughput, both
read and write ports are equipped with DDR interfaces. Each
address
location
is
(CY7C1511V18), 9-bit words (CY7C1526V18), 18-bit words
(CY7C1513V18), or 36-bit words (CY7C1515V18) that burst
sequentially into or out of the device. Because data can be trans-
ferred into and out of the device on every rising edge of both input
clocks (K and K and C and C), memory bandwidth is maximized
while
simplifying
system
"turn-arounds".
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
250 MHz
278
250
865
790
870
795
950
865
1140
1040
,
San Jose
CA 95134-1709
Burst Architecture
associated
with
four
8-bit
design
by
eliminating
200 MHz
167 MHz
200
167
655
570
660
575
715
615
850
725
408-943-2600
Revised August 06, 2008
words
bus
Unit
MHz
mA
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Summary of Contents for Cypress Semiconductor CY7C1511V18

  • Page 1: Functional Description

    DDR interfaces. Each address location (CY7C1511V18), 9-bit words (CY7C1526V18), 18-bit words (CY7C1513V18), or 36-bit words (CY7C1515V18) that burst sequentially into or out of the device. Because data can be trans- ferred into and out of the device on every rising edge of both input...
  • Page 2 Logic Block Diagram (CY7C1511V18) [7:0] Address (20:0) Register Gen. DOFF Control Logic [1:0] Logic Block Diagram (CY7C1526V18) [8:0] Address (20:0) Register Gen. DOFF Control Logic Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 Write Write Write Write Address Register...
  • Page 3 Control Logic [1:0] Logic Block Diagram (CY7C1515V18) [35:0] Address (18:0) Register Gen. DOFF Control Logic [3:0] Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 Write Write Write Write Address Register Control Logic Read Data Reg. Reg. Reg. Reg. Write...
  • Page 4: Pin Configuration

    Pin Configuration The pin configuration for CY7C1511V18, CY7C1526V18, CY7C1513V18, and CY7C1515V18 follow. DOFF DOFF Note 1. V /144M and V /288M are not connected to the die and can be tied to any voltage level. Document Number: 38-05363 Rev. *F...
  • Page 5 Pin Configuration (continued) The pin configuration for CY7C1511V18, CY7C1526V18, CY7C1513V18, and CY7C1515V18 follow. /144M DOFF /288M DOFF Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout CY7C1513V18 (4M x 18) NC/288M...
  • Page 6: Pin Definitions

    Internally, the device is organized as 8M x 8 (4 arrays each of 2M x 8) for CY7C1511V18, 8M x 9 (4 arrays each of 2M x 9) for CY7C1526V18, 4M x 18 (4 arrays each of 1M x 18) for CY7C1513V18 and 2M x 36 (4 arrays each of 512K x 36) for CY7C1515V18.
  • Page 7 Power Supply Power Supply Inputs to the Core of the Device. Ground Ground for the Device. Power Supply Power Supply Inputs for the Outputs of the Device. Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 Pin Description Switching Characteristics on page 24.
  • Page 8: Functional Overview

    Single Clock Mode The CY7C1511V18 can be used with a single clock that controls both the input and output registers. In this mode the device recognizes only a single pair of input clocks (K and K) that control both the input and output registers.
  • Page 9 All pending transactions (read and write) are completed before the device is deselected. Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 Programmable Impedance An external resistor, RQ, must be connected between the ZQ pin...
  • Page 10: Application Example

    ASIC) Source K# Delayed K Delayed K# R = 50ohms Truth Table The truth table for CY7C1511V18, CY7C1526V18, CY7C1513V18, and CY7C1515V18 follows. Operation RPS WPS Write Cycle: Load address on the rising edge of K; input write data on two consecutive K and K rising edges.
  • Page 11 Write Cycle Descriptions The write cycle description table for CY7C1511V18 and CY7C1513V18 follows. L–H – During the data portion of a write sequence: CY7C1511V18 − both nibbles (D CY7C1513V18 − both bytes (D L-H During the data portion of a write sequence : –...
  • Page 12 L–H – L–H – L–H – Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 [2, 10] Comments – During the Data portion of a write sequence, all four bytes (D the device. L–H During the Data portion of a write sequence, all four bytes (D the device.
  • Page 13 TDI pin on the rising edge of TCK. Data is output on the TDO pin on the falling edge of TCK. Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 Instruction Register Three-bit instructions can be serially loaded into the instruction register.
  • Page 14 TAP into the Shift-DR state. This places the boundary scan register between the TDI and TDO pins. Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 PRELOAD places an initial data pattern at the latched parallel outputs of the boundary scan register cells before the selection of another boundary scan test operation.
  • Page 15: Tap Controller State Diagram

    The state diagram for the TAP controller follows. TEST-LOGIC RESET TEST-LOGIC/ IDLE Note 11. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 [11] SELECT DR-SCAN CAPTURE-DR SHIFT-DR EXIT1-DR...
  • Page 16 12. These characteristics pertain to the TAP inputs (TMS, TCK, TDI and TDO). Parallel load levels are specified in the 13. Overshoot: V (AC) < V + 0.85V (Pulse width less than t 14. All Voltage referenced to Ground. Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 Bypass Register Instruction Register Identification Register Boundary Scan Register...
  • Page 17 Description [16] Figure 2. TAP Timing and Test Conditions 0.9V 1.8V 50Ω = 20 pF TMSH TMSS TDIS TDIH TDOV = 1 ns. CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 ALL INPUT PULSES 0.9V TCYC TDOX Page 17 of 32 Unit [+] Feedback...
  • Page 18: Instruction Codes

    RESERVED Do Not Use: This instruction is reserved for future use. BYPASS Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 Value CY7C1526V18 CY7C1513V18 00000110100...
  • Page 19 Boundary Scan Order Bit # Bump ID Bit # Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 Bump ID Bit # Bump ID Bit # Bump ID Internal Page 19 of 32 [+] Feedback...
  • Page 20 DLL. Unstable Clock Clock Start (Clock Starts after DOFF Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 DLL Constraints ■ DLL uses K clock as its synchronizing input. The input must have low phase jitter, which is specified as t ■...
  • Page 21: Maximum Ratings

    (min) within 200 ms. During this time V < V and V /2)/(RQ/5) for values of 175 ohms <= RQ <= 350 ohms. (max) = 0.95V or 0.54V , whichever is smaller. CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 Ambient [17] Temperature (T 0°C to +70°C 1.8 ±...
  • Page 22 Current AC Electrical Characteristics [13] Over the Operating Range Parameter Description Input HIGH Voltage Input LOW Voltage Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 Test Conditions = Max, 200MHz (x8) = 0 mA, (x9) f = f = 1/t...
  • Page 23: Thermal Resistance

    22. Unless otherwise noted, test conditions are based on signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V, RQ = 250Ω, V pulse levels of 0.25V to 1.25V, and output loading of the specified I Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 Test Conditions = 25°C, f = 1 MHz, V...
  • Page 24: Switching Characteristics

    24. This part has a voltage regulator internally; t POWER initiated. 25. For D0 data signal on CY7C1526V18 device, t Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 300 MHz 278 MHz Min Max Min Max Min Max Min Max Min Max [24] 1.32...
  • Page 25 , are specified with a load capacitance of 5 pF as in (b) of 27. At any voltage and temperature t is less than t Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 300 MHz 278 MHz Min Max Min Max Min Max Min Max Min Max –...
  • Page 26: Switching Waveforms

    30. In this example, if address A2 = A1, then data Q20 = D10, Q21 = D11, Q22 = D12, and Q23 = D13. Write data is forwarded immediately as read results. This note applies to the whole diagram. Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 [28, 29, 30]...
  • Page 27: Ordering Information

    CY7C1515V18-278BZI CY7C1511V18-278BZXI CY7C1526V18-278BZXI CY7C1513V18-278BZXI CY7C1515V18-278BZXI Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 Package Diagram Package Type 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
  • Page 28 CY7C1515V18-200BZI CY7C1511V18-200BZXI CY7C1526V18-200BZXI CY7C1513V18-200BZXI CY7C1515V18-200BZXI Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 Package Diagram Package Type 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
  • Page 29 CY7C1515V18-167BZI CY7C1511V18-167BZXI CY7C1526V18-167BZXI CY7C1513V18-167BZXI CY7C1515V18-167BZXI Document Number: 38-05363 Rev. *F CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 Package Diagram Package Type 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm) Pb-Free 51-85195 165-Ball Fine Pitch Ball Grid Array (15 x 17 x 1.4 mm)
  • Page 30: Package Diagram

    CY7C1511V18, CY7C1526V18 CY7C1513V18, CY7C1515V18 Package Diagram Figure 6. 165-ball FBGA (15 x 17 x 1.4 mm), 51-85195 51-85195-*A Document Number: 38-05363 Rev. *F Page 30 of 32 [+] Feedback...
  • Page 31 Document History Page Document Title: CY7C1511V18/CY7C1526V18/CY7C1513V18/CY7C1515V18, 72-Mbit QDR™-II SRAM 4-Word Burst Archi- tecture Document Number: 38-05363 SUBMISSION REV. ECN NO. DATE 226981 See ECN 257089 See ECN 319496 See ECN 403231 See ECN 467290 See ECN Document Number: 38-05363 Rev. *F...
  • Page 32 Document History Page Document Title: CY7C1511V18/CY7C1526V18/CY7C1513V18/CY7C1515V18, 72-Mbit QDR™-II SRAM 4-Word Burst Archi- tecture Document Number: 38-05363 2511080 See ECN 2549270 08/06/08 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at cypress.com/sales.

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Cy7c1515v18Cy7c1513v18Cy7c1526v18

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