Cypress Semiconductor Perform CY7C1561V18 Manual

72-mbit qdr-ii+ sram 4-word burst architecture (2.5 cycle read latency)

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Features
Separate independent read and write data ports
Supports concurrent transactions
400 MHz clock for high bandwidth
4-word burst for reducing address bus frequency
Double Data Rate (DDR) interfaces on both read and write ports
(data transferred at 800 MHz) at 400 MHz
Available in 2.5 clock cycle latency
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Data valid pin (QVLD) to indicate valid data on the output
Single multiplexed address input bus latches address inputs
for both read and write ports
Separate port selects for depth expansion
Synchronous internally self-timed writes
Available in x8, x9, x18, and x36 configurations
Full data coherency, providing most current data
Core V
= 1.8V ± 0.1V; IO V
DD
HSTL inputs and variable drive HSTL output buffers
Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Selection Guide
Description
Maximum Operating Frequency
Maximum Operating Current
Note
1. The QDR consortium specification for V
V
= 1.4V to V
.
DDQ
DD
Cypress Semiconductor Corporation
Document Number: 001-05384 Rev. *F
72-Mbit QDR™-II+ SRAM 4-Word Burst
Architecture (2.5 Cycle Read Latency)
[1]
= 1.4V to V
DDQ
DD
400 MHz
400
x8
1400
x9
1400
x18
1400
x36
1400
is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting
DDQ
198 Champion Court
CY7C1561V18, CY7C1576V18
CY7C1563V18, CY7C1565V18
Configurations
With Read Cycle Latency of 2.5 cycles:
CY7C1561V18 – 8M x 8
CY7C1576V18 – 8M x 9
CY7C1563V18 – 4M x 18
CY7C1565V18 – 2M x 36

Functional Description

The CY7C1561V18, CY7C1576V18, CY7C1563V18, and
CY7C1565V18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR-II+ architecture. Similar to QDR-II archi-
tecture, QDR-II+ SRAMs consists of two separate ports: the read
port and the write port to access the memory array. The read port
has dedicated data outputs to support read operations and the
write port has dedicated data inputs to support write operations.
QDR-II+ architecture has separate data inputs and data outputs
to completely eliminate the need to "turn-around" the data bus
that exists with common IO devices. Each port is accessed
through a common address bus. Addresses for read and write
addresses are latched on alternate rising edges of the input (K)
clock. Accesses to the QDR-II+ read and write ports are
completely independent of one another. To maximize data
throughput, both read and write ports are equipped with DDR
interfaces. Each address location is associated with four 8-bit
words (CY7C1561V18), 9-bit words (CY7C1576V18), 18-bit
words (CY7C1563V18), or 36-bit words (CY7C1565V18) that
burst sequentially into or out of the device. Because data is trans-
ferred into and out of the device on every rising edge of both input
clocks (K and K), memory bandwidth is maximized while simpli-
fying system design by eliminating bus "turn-arounds".
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the K or K input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
375 MHz
333 MHz
375
333
1300
1200
1300
1200
1300
1200
1300
1200
,
San Jose
CA 95134-1709
300 MHz
Unit
300
MHz
1100
mA
1100
1100
1100
408-943-2600
Revised March 6, 2008
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Summary of Contents for Cypress Semiconductor Perform CY7C1561V18

  • Page 1: Functional Description

    Features ■ Separate independent read and write data ports ❐ Supports concurrent transactions ■ 400 MHz clock for high bandwidth ■ 4-word burst for reducing address bus frequency ■ Double Data Rate (DDR) interfaces on both read and write ports (data transferred at 800 MHz) at 400 MHz ■...
  • Page 2 Logic Block Diagram (CY7C1561V18) [7:0] Address (20:0) Register Gen. DOFF Control Logic [1:0] Logic Block Diagram (CY7C1576V18) [8:0] Address (20:0) Register Gen. DOFF Control Logic Document Number: 001-05384 Rev. *F CY7C1561V18, CY7C1576V18 CY7C1563V18, CY7C1565V18 Write Write Write Write Address Register Control Logic Read Data Reg.
  • Page 3 Logic Block Diagram (CY7C1563V18) [17:0] Address (19:0) Register Gen. DOFF Control Logic [1:0] Logic Block Diagram (CY7C1565V18) [35:0] Address (18:0) Register Gen. DOFF Control Logic [3:0] Document Number: 001-05384 Rev. *F CY7C1561V18, CY7C1576V18 CY7C1563V18, CY7C1565V18 Write Write Write Write Address Register Control Logic...
  • Page 4: Pin Configuration

    Pin Configuration The pin configuration for CY7C1561V18, CY7C1576V18, CY7C1563V18, and CY7C1565V18 follow. DOFF DOFF Note 2. NC/144M and NC/288M are not connected to the die and can be tied to any voltage level. Document Number: 001-05384 Rev. *F CY7C1561V18, CY7C1576V18 CY7C1563V18, CY7C1565V18 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout CY7C1561V18 (8M x 8)
  • Page 5 Pin Configuration (continued) The pin configuration for CY7C1561V18, CY7C1576V18, CY7C1563V18, and CY7C1565V18 follow. NC/144M DOFF NC/288M DOFF Document Number: 001-05384 Rev. *F CY7C1561V18, CY7C1576V18 CY7C1563V18, CY7C1565V18 165-Ball FBGA (15 x 17 x 1.4 mm) Pinout CY7C1563V18 (4M x 18) NC/288M QVLD CY7C1565V18 (2M x 36) QVLD...
  • Page 6: Pin Definitions

    Pin Definitions Pin Name Input- Data Input Signals. Sampled on the rising edge of K and K clocks when valid write operations are active. [x:0] CY7C1561V18 − D Synchronous CY7C1576V18 − D CY7C1563V18 − D CY7C1565V18 − D Write Port Select − Active LOW. Sampled on the rising edge of the K clock. When asserted active, a Input- Synchronous write operation is initiated.
  • Page 7 Pin Definitions (continued) Pin Name Input Output Impedance Matching Input. This input is used to tune the device outputs to the system data bus impedance. CQ, CQ and Q between ZQ and ground. Alternately, this pin can be connected directly to V minimum impedance mode.
  • Page 8: Functional Overview

    Functional Overview The CY7C1561V18, CY7C1576V18, CY7C1563V18, and CY7C1565V18 are synchronous pipelined Burst SRAMs equipped with a read port and a write port. The read port is dedicated to read operations and the write port is dedicated to write operations. Data flows into the SRAM through the write port and out through the read port.
  • Page 9: Application Example

    Depth Expansion The CY7C1563V18 has a port select input for each port. This enables for easy depth expansion. Both port selects are sampled on the rising edge of the positive input clock only (K). Each port select input can deselect the specified port. Deselecting a port does not affect the other port.
  • Page 10: Truth Table

    The truth table for CY7C1561V18, CY7C1576V18, CY7C1563V18, and CY7C1565V18 follows. Truth Table Operation RPS WPS Write Cycle: Load address on the rising edge of K; input write data on two consecutive K and K rising edges. [10] Read Cycle: (2.5 cycle Latency) Load address on the rising edge of K;...
  • Page 11 The write cycle description table for CY7C1576V18 follows. Write Cycle Descriptions L–H – During the Data portion of a write sequence, the single byte (D – L–H During the Data portion of a write sequence, the single byte (D L–H –...
  • Page 12 IEEE 1149.1 Serial Boundary Scan (JTAG) These SRAMs incorporate a serial boundary scan Test Access Port (TAP) in the FBGA package. This part is fully compliant with IEEE Standard #1149.1-2001. The TAP operates using JEDEC standard 1.8V IO logic levels. Disabling the JTAG Feature It is possible to operate the SRAM without using the JTAG feature.
  • Page 13 IDCODE The IDCODE instruction loads a vendor-specific, 32-bit code into the instruction register. It also places the instruction register between the TDI and TDO pins and shifts the IDCODE out of the device when the TAP controller enters the Shift-DR state. The IDCODE instruction is loaded into the instruction register at power up or whenever the TAP controller is supplied a Test-Logic-Reset state.
  • Page 14: Tap Controller State Diagram

    The state diagram for the TAP controller follows. TAP Controller State Diagram TEST-LOGIC RESET TEST-LOGIC/ IDLE Note 12. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document Number: 001-05384 Rev. *F CY7C1561V18, CY7C1576V18 CY7C1563V18, CY7C1565V18 [12]...
  • Page 15 TAP Controller Block Diagram Selection Circuitry TAP Electrical Characteristics [13, 14, 15] Over the Operating Range Parameter Description Output HIGH Voltage Output HIGH Voltage Output LOW Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage Input and Output Load Current Notes 13.
  • Page 16 TAP AC Switching Characteristics [16, 17] Over the Operating Range Parameter TCK Clock Cycle Time TCYC TCK Clock Frequency TCK Clock HIGH TCK Clock LOW Setup Times TMS Setup to TCK Clock Rise TMSS TDI Setup to TCK Clock Rise TDIS Capture Setup to TCK Rise Hold Times...
  • Page 17: Instruction Codes

    Identification Register Definitions Instruction Field CY7C1561V18 Revision Number (31:29) Cypress Device ID 11010010001000100 11010010001001100 11010010001010100 11010010001100100 Defines the type of (28:12) Cypress JEDEC ID 00000110100 (11:1) ID Register Presence (0) Scan Register Sizes Register Name Instruction Bypass Boundary Scan Instruction Codes Instruction Code EXTEST...
  • Page 18 Boundary Scan Order Bit # Bump ID Bit # Document Number: 001-05384 Rev. *F CY7C1561V18, CY7C1576V18 CY7C1563V18, CY7C1565V18 Bump ID Bit # Bump ID Bit # Bump ID Internal Page 18 of 28 [+] Feedback [+] Feedback...
  • Page 19: Power-Up Sequence

    Power Up Sequence in QDR-II+ SRAM QDR-II+ SRAMs must be powered up and initialized in a predefined manner to prevent undefined operations. During Power Up, when the DOFF is tied HIGH, the DLL gets locked after 2048 cycles of stable clock. Power Up Sequence ■...
  • Page 20: Maximum Ratings

    Maximum Ratings Exceeding maximum ratings may impair the useful life of the device. These user guidelines are not tested. Storage Temperature ... –65°C to +150°C Ambient Temperature with Power Applied.. –55°C to +125°C Supply Voltage on V Relative to GND ...–0.5V to +2.9V Supply Voltage on V Relative to GND...–0.5V to +V DC Applied to Outputs in High-Z ...
  • Page 21 Electrical Characteristics (continued) DC Electrical Characteristics [15] Over the Operating Range Parameter Description [22] Operating Supply Automatic Power down Current Document Number: 001-05384 Rev. *F CY7C1561V18, CY7C1576V18 CY7C1563V18, CY7C1565V18 Test Conditions = Max, 333 MHz = 0 mA, f = f = 1/t 300 MHz Max V...
  • Page 22: Thermal Resistance

    AC Electrical Characteristics [14] Over the Operating Range Parameter Description Input HIGH Voltage Input LOW Voltage Capacitance Tested initially and after any design or process change that may affect these parameters. Parameter Description Input Capacitance Clock Input Capacitance Output Capacitance Thermal Resistance Tested initially and after any design or process change that may affect these parameters.
  • Page 23: Switching Characteristics

    Switching Characteristics [23, 24] Over the Operating Range Consortium Parameter Parameter (Typical) to the First Access POWER K Clock Cycle Time KHKH Input Clock (K/K) HIGH KHKL Input Clock (K/K) LOW KLKH K Clock Rise to K Clock Rise KHKH KHKH (rising edge to rising edge) Setup Times...
  • Page 24: Switching Waveforms

    Switching Waveforms [31, 32, 33] Read/Write/Deselect Sequence Figure 5. Waveform for 2.5 Cycle Read Latency READ t KH t KL t CYC t SC t HC t SA QVLD (Read Latency = 2.5 Cycles) t CQH CQHCQH Notes 31. Q00 refers to output from address A0. Q01 refers to output from the next internal burst address following A0, i.e., A0+1. 32.
  • Page 25: Ordering Information

    Ordering Information Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit www.cypress.com for actual products offered. Speed (MHz) Ordering Code CY7C1561V18-400BZC CY7C1576V18-400BZC CY7C1563V18-400BZC CY7C1565V18-400BZC CY7C1561V18-400BZXC CY7C1576V18-400BZXC CY7C1563V18-400BZXC CY7C1565V18-400BZXC CY7C1561V18-400BZI CY7C1576V18-400BZI CY7C1563V18-400BZI CY7C1565V18-400BZI CY7C1561V18-400BZXI...
  • Page 26 Ordering Information (continued) Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit www.cypress.com for actual products offered. Speed (MHz) Ordering Code CY7C1561V18-333BZC CY7C1576V18-333BZC CY7C1563V18-333BZC CY7C1565V18-333BZC CY7C1561V18-333BZXC CY7C1576V18-333BZXC CY7C1563V18-333BZXC CY7C1565V18-333BZXC CY7C1561V18-333BZI CY7C1576V18-333BZI CY7C1563V18-333BZI CY7C1565V18-333BZI...
  • Page 27: Package Diagram

    Package Diagram Figure 6. 165-ball FBGA (15 x 17 x 1.4 mm), 51-85195 Document Number: 001-05384 Rev. *F CY7C1561V18, CY7C1576V18 CY7C1563V18, CY7C1565V18 51-85195-*A Page 27 of 28 [+] Feedback [+] Feedback...
  • Page 28 Document History Page Document Title: CY7C1561V18/CY7C1576V18/CY7C1563V18/CY7C1565V18, 72-Mbit QDR™-II+ SRAM 4-Word Burst Archi- tecture (2.5 Cycle Read Latency) Document Number: 001-05384 ISSUE ORIG. OF REV. ECN NO. DATE CHANGE 402911 See ECN 425251 See ECN 437000 See ECN 461934 See ECN 497567 See ECN 1351243 See ECN...

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